Integrated electrostatically-actuated micromachined all-metal micro-relays
First Claim
1. An electrostatically-actuated, metallic micro-relay comprisinga semiconductor substrate having an electrically insulative surface layer,a metal blade having two ends, a length, width and thickness, and a plurality of longitudinal slots extending through the thickness of said blade, said blade overlying said insulative layer and anchored at at least one of said ends to said layer,an electrostatic actuator on said insulative layer underlying said blade, said actuator being operable between an actuator off condition and an actuator on condition, there being a first gap dimension between said blade and said actuator when the actuator is in said off condition, andan electrical contact on said layer engageable by said blade when said actuator is in said on condition, said contact being spaced from said blade by a second gap dimension during said off condition.
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Accused Products
Abstract
Structures and fabrication methods of micromachined all-metal relays on silicon chips are described. The relay comprises a copper blade, electroformed into the lithographically patterned areas, with suitable dimensions of 1 mm×2 mm×0.01 mm (width×length×thickness) and a plurality of longitudinal slots to facilitate fabrication of the blade. The relay is actuated by electrostatic force, and no conduction current is required to hold the relay at either "on" or "off" state. Preferably, the relay is used in combination with a suitable arc suppression circuit.
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Citations
19 Claims
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1. An electrostatically-actuated, metallic micro-relay comprising
a semiconductor substrate having an electrically insulative surface layer, a metal blade having two ends, a length, width and thickness, and a plurality of longitudinal slots extending through the thickness of said blade, said blade overlying said insulative layer and anchored at at least one of said ends to said layer, an electrostatic actuator on said insulative layer underlying said blade, said actuator being operable between an actuator off condition and an actuator on condition, there being a first gap dimension between said blade and said actuator when the actuator is in said off condition, and an electrical contact on said layer engageable by said blade when said actuator is in said on condition, said contact being spaced from said blade by a second gap dimension during said off condition.
- 11. A micro-relay as recited in 10 in which each said slot has a width in a range of 10 to 40 micrometers.
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15. A micro-relay as recited in 14 in which said holes have a cross-sectional dimension in a range of 10 to 40 micrometers.
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19. An electrostatically-actuated, metallic micro-relay comprising
a semiconductor substrate having an electrically insulative surface layer, a metal blade having two ends, a length, width and thickness, and a plurality of longitudinal slots extending through the thickness of said blade, said slots not extending to either of said two ends, said blade overlying said insulative layer and anchored at at least one of said ends to said layer, an electrostatic actuator on said insulative layer underlying said blade, said actuator being operable between an actuator off condition and an actuator on condition, there being a first gap dimension between said blade and said actuator when the actuator is in said off condition, and an electrical contact on said layer engageable by said blade when said actuator is in said on condition, said contact being spaced from said blade by a second gap dimension during said off condition.
Specification