Heating element, manufacturing process and application
First Claim
Patent Images
1. A heating element, comprising:
- at least one substrate;
at least one electrical resistance layer; and
a binder configured to bind said at least one electrical resistance layer to said at least one substrate,wherein said binder has a melting temperature greater than an operating temperature of the heating element and comprises a perfluorinated polymer.
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Abstract
A heating element includes at least one substrate, at least one electrical resistance layer, and a binder configured to bind the electrical resistance layer to the substrate, wherein the binder has a melting temperature greater than an operating temperature of the heating element and includes a perfluorinated polymer.
64 Citations
21 Claims
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1. A heating element, comprising:
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at least one substrate; at least one electrical resistance layer; and a binder configured to bind said at least one electrical resistance layer to said at least one substrate, wherein said binder has a melting temperature greater than an operating temperature of the heating element and comprises a perfluorinated polymer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A process for manufacturing a heating element comprising:
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depositing a first perfluorinated polymer-based film on a first substrate; providing a conductive layer on said first perfluorinated polymer-based film; and shaping said conductive layer by etching said conducting layer. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. An household appliance comprising:
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a heating element, wherein said heating element comprises; at least one substrate; at least one electrical resistance layer; and a binder configured to bind said at least one electrical resistance layer to said at least one substrate, wherein said binder has a melting temperature greater than an operating temperature of the heating element and comprises a perfluorinated polymer. - View Dependent Claims (21)
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Specification