Semiconductor chip and package with heat dissipation

• US 6,054,759 A
• Filed: 06/05/1998
• Issued: 04/25/2000
• Est. Priority Date: 01/08/1998
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Nakamura, Hisashi
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): THAI, LUAN C
• Application Number:
  US09/092,176
• Time in Patent Office: 690 Days
• Field of Search: 257/691, 257/693, 257/685, 257/688, 257/777, 257/778, 257/700, 257/690, 257/734, 257/737, 257/738, 257/735, 361/729, 361/730, 361/735, 361/761, 361/783, 361/790
• US Class Current: 257/691
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73207 Bump and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/1005 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
• CPC Class Codes: H01L 2225/1094 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A semiconductor chip is die-bonded on a tape. A plurality of electrodes for power supply for supplying power are formed at an upper surface of the semiconductor chip, and a plurality of electrodes for signal communication for communicating signals are formed at a lower surface of the semiconductor chip. The semiconductor chip, the tape and the like are sealed within a package. A power supply wiring formed external to the package is connected to an electrode for power supply. Thus, a semiconductor device is obtained which efficiently releases the heat generated at the semiconductor chip and contemplates increasing the number of electrodes for signal communication.

Claims

1. A semiconductor device comprising:

a semiconductor chip;

a packaging member for housing said semiconductor chip;

a power supply terminal portion and a plurality of signal terminal portions arranged at said packaging member and each electrically connected to said semiconductor chip; and

a power supply wiring portion electrically connected to said power supply terminal portion for supplying power to said semiconductor chip;

wherein

a surface of said packaging member provided with said power supply terminal portion and said power supply wiring portion is different from a surface of said packaging member provided with said signal terminal; and

wherein the surface of said packaging member provided with said power supply terminal portion and said power supply wiring portion is opposite to the surface of said packaging member provided with said signal terminal portion, and further comprising;

a first printed-circuit board provided with a predetermined wiring electrically connected to a respective said signal terminal portion; and

a second printed-circuit board provided with said power supply wiring portion;

wherein

said packaging member housing semiconductor chip is arranged between said first and second printed-circuit boards.

2. A semiconductor device comprising:

a semiconductor chip;

a packaging member for housing said semiconductor chip;

a power supply terminal portion and a plurality of signal terminal portions arranged at said packaging member and each electrically connected to said semiconductor chip; and

a power supply wiring portion electrically connected to said power supply terminal portion for supplying power to said semiconductor chip, said power supply wiring portion entirely in the form of a plate, a portion of said plate having a surface opposite to and substantially parallel to the chip;

wherein

a surface of said packaging member provided with said power supply terminal portion and said power supply wiring portion is different from a surface of said packaging member provided with said signal terminal;

wherein said power supply terminal portion is arranged at a first surface of said chip, and a second surface of said chip is die-bonded with a taping member at a first surface of said taping member, said signal terminal portions being arranged at a second surface of said taping member.

3. A semiconductor device as recited in claim 2, wherein the surface of said packaging member provided with said power supply terminal portion and said power supply wiring portion is opposite to the surface of said packaging member provided with said signal terminal portion.

4. A semiconductor device comprising:

a semiconductor chip;

a packaging member for housing said semiconductor chip;

a power supply terminal portion arranged in said packaging member and connected to said chip at a first surface of said chip;

a plurality of signal terminal portions arranged at said packaging member and connected to said chip at a second surface of said chip; and

an entirely plate-shaped conductive structure, electrically connected to said power supply terminal portion and provided for connection to a supporting printed circuit board external source connection, for supplying power to said semiconductor chip through said power supply terminal, said conductive structure having a surface opposite to and substantially parallel to the chip.