Parallel dual switch module
First Claim
1. A parallel dual semiconductor switch module, comprisinga baseplate;
- a molded insulative housing mounted on a marginal area of said baseplate, and having first and second opposing walls which support a first elongate metal plate extending along a longitudinal axis of said module, said first metal plate having a first end extending though said first housing wall to form a common terminal of said module, said first metal plate having multiple spaced apart and raised lateral connection areas formed along each lateral edge thereof;
second and third elongate metal plates disposed side-by-side atop said first elongate metal plate, but insulated therefrom, said second and third metal plates having terminal portions which extend perpendicular to said first plate through a top of said housing to form positive and negative terminals of said module, respectively, and having connection area portions which extend in opposite lateral directions relative to said first plate and which interdigitate with respective lateral connection areas of said first metal plate; and
first and second sets of semiconductor switch assemblies disposed on said baseplate on opposite lateral sides of said first metal plate adjacent said interdigitated connection areas, each semiconductor switch assembly having a first terminal bonded to an adjacent connection area of said first metal plate, and a second terminal bonded to an adjacent connection area of the respective second or third metal plate.
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Accused Products
Abstract
A parallel dual switch module that is characterized by improved mechanical and electrical packaging efficiency and low cost. The module includes a common terminal defined by a first stamped elongate metal plate insert molded into the module housing, and positive and negative terminals defined by second and third stamped elongate metal plates disposed side-by-side atop the common terminal. Connection areas formed on the positive and negative terminals extend in opposite lateral directions, and interdigitate with connection areas formed on the common terminal, thereby forming two linear parallel rows of connection areas. Adjacent each row of connection areas, and mounted on a baseplate of the module is a set of parallel connected transistors subassemblies. A molded elongate gate collection component is mounted on the baseplate between the sets of transistor subassemblies, and beneath the common terminal. The gate collection component confines a pair of insert molded gate terminal strips to which the gate terminals of the respective sets of transistor subassemblies are connected, and the terminal strips, in turn, are coupled to gate terminals of the module. The transistor subassemblies are mounted in close proximity to the central terminal structure, and the metal tabs of the subassemblies are shaped to prevent interference with the overlying terminal connection areas, and to provide stress relief.
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Citations
14 Claims
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1. A parallel dual semiconductor switch module, comprising
a baseplate; -
a molded insulative housing mounted on a marginal area of said baseplate, and having first and second opposing walls which support a first elongate metal plate extending along a longitudinal axis of said module, said first metal plate having a first end extending though said first housing wall to form a common terminal of said module, said first metal plate having multiple spaced apart and raised lateral connection areas formed along each lateral edge thereof; second and third elongate metal plates disposed side-by-side atop said first elongate metal plate, but insulated therefrom, said second and third metal plates having terminal portions which extend perpendicular to said first plate through a top of said housing to form positive and negative terminals of said module, respectively, and having connection area portions which extend in opposite lateral directions relative to said first plate and which interdigitate with respective lateral connection areas of said first metal plate; and first and second sets of semiconductor switch assemblies disposed on said baseplate on opposite lateral sides of said first metal plate adjacent said interdigitated connection areas, each semiconductor switch assembly having a first terminal bonded to an adjacent connection area of said first metal plate, and a second terminal bonded to an adjacent connection area of the respective second or third metal plate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A parallel dual semiconductor switch module, comprising
a baseplate; -
a central gate collection component mounted in a central area of said baseplate, extending along a longitudinal axis of said module, and having wall sections which support first and second spaced apart elongate terminal strips, said terminal strips being electrically coupled to first and second gate terminals of said module; a molded insulative housing mounted on a marginal area of said baseplate, and having first and second opposing walls which support a first elongate metal plate atop said gate collection module, said first metal plate having a first end extending though said first wall to form a common terminal of said module, said first metal plate having multiple spaced apart and raised lateral connection areas formed along each lateral edge thereof; second and third elongate plates disposed side-by-side atop said first elongate metal plate, but insulated therefrom, said second and third plates having terminal portions which extend perpendicular to said first plate through a top of said housing to form positive and negative terminals of said module, respectively, and having connection area portions which extend in opposite lateral directions relative to said first plate and which interdigitate with respective lateral connection areas of said first metal plate; and first and second sets of semiconductor switch assemblies disposed on said baseplate on opposite lateral sides of said first plate adjacent said interdigitated connection areas, each semiconductor switch assembly having a first terminal bonded to an adjacent connection area of said first plate, a second terminal bonded to an adjacent connection area of the respective second or third plate, and a gate terminal bonded to a respective terminal strip of said central gate collection component. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification