Parallel dual switch module

• US 6,054,765 A
• Filed: 04/27/1998
• Issued: 04/25/2000
• Est. Priority Date: 04/27/1998
• Status: Expired due to Term

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delco Electronics Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Gerbsch, Erich William, Eytcheson, Charles Tyler, Viduya, Lisa Ann, Hayes, Monty Bradford, Mock, Roger Allen, Von Kierstead, Eric, Campbell, Robert John, Nakanishi, Todd G.
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US09/067,242
• Time in Patent Office: 729 Days
• Field of Search: 257/723, 257/724, 257/690, 257/692, 257/693, 257/698, 257/705, 257/727, 257/678, 257/787, 257/107
• US Class Current: 257/724
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/4917 Crossed wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/49431 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49433 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A parallel dual switch module that is characterized by improved mechanical and electrical packaging efficiency and low cost. The module includes a common terminal defined by a first stamped elongate metal plate insert molded into the module housing, and positive and negative terminals defined by second and third stamped elongate metal plates disposed side-by-side atop the common terminal. Connection areas formed on the positive and negative terminals extend in opposite lateral directions, and interdigitate with connection areas formed on the common terminal, thereby forming two linear parallel rows of connection areas. Adjacent each row of connection areas, and mounted on a baseplate of the module is a set of parallel connected transistors subassemblies. A molded elongate gate collection component is mounted on the baseplate between the sets of transistor subassemblies, and beneath the common terminal. The gate collection component confines a pair of insert molded gate terminal strips to which the gate terminals of the respective sets of transistor subassemblies are connected, and the terminal strips, in turn, are coupled to gate terminals of the module. The transistor subassemblies are mounted in close proximity to the central terminal structure, and the metal tabs of the subassemblies are shaped to prevent interference with the overlying terminal connection areas, and to provide stress relief.

Claims

1. A parallel dual semiconductor switch module, comprising

a baseplate;

a molded insulative housing mounted on a marginal area of said baseplate, and having first and second opposing walls which support a first elongate metal plate extending along a longitudinal axis of said module, said first metal plate having a first end extending though said first housing wall to form a common terminal of said module, said first metal plate having multiple spaced apart and raised lateral connection areas formed along each lateral edge thereof;

second and third elongate metal plates disposed side-by-side atop said first elongate metal plate, but insulated therefrom, said second and third metal plates having terminal portions which extend perpendicular to said first plate through a top of said housing to form positive and negative terminals of said module, respectively, and having connection area portions which extend in opposite lateral directions relative to said first plate and which interdigitate with respective lateral connection areas of said first metal plate; and

first and second sets of semiconductor switch assemblies disposed on said baseplate on opposite lateral sides of said first metal plate adjacent said interdigitated connection areas, each semiconductor switch assembly having a first terminal bonded to an adjacent connection area of said first metal plate, and a second terminal bonded to an adjacent connection area of the respective second or third metal plate.

2. The switch module of claim 1, wherein the first metal plate is insert molded in the housing, and a second end of said first metal plate opposite said first end is loosely supported by said second housing wall, so as to permit relative movement between said metal plate and said housing during thermal cycling of said module.

3. The switch module of claim 1, wherein said first and second terminals of said switch assemblies have a generally Z-shaped configuration which permits close spacing of said switch assemblies to said plates and which provides stress relief to accommodate relative movement of said switch assemblies and said plates.

4. The switch module of claim 1, wherein heat generated by said switch assemblies is transferred out of said module through said baseplate and into an underlying support structure to which said baseplate is fastened, and a surface of said baseplate facing said underlying support structure is recessed in a region opposite said metal plates to promote heat transfer from said switch assemblies to said underlying support structure.

5. The switch module of claim 1, wherein said baseplate and module each include openings that are axially aligned and adapted to receive fasteners for fastening said module to an underlying support structure, and wherein said module includes a bushing received in each opening of said housing, each bushing having a first end including a flange adjacent a top surface of said housing and adapted to be engaged by a respective fastener, and a second end engaging said baseplate, whereby fastening force developed by said fasteners is applied through said bushings to said baseplate.

6. The switch module of claim 1, wherein said terminal portions are disposed in a central region of said first and second plates to provide substantially symmetrical inductance and resistance paths to individual semiconductor switch assemblies of said first and second sets of switch assemblies.

7. The switch module of claim 6, wherein said terminal portions include at least two openings for attachment of said terminal plates to an external circuit, said openings being spaced apart to encourage substantially even current distribution in said first and second terminal plates.

8. A parallel dual semiconductor switch module, comprising

a baseplate;

a central gate collection component mounted in a central area of said baseplate, extending along a longitudinal axis of said module, and having wall sections which support first and second spaced apart elongate terminal strips, said terminal strips being electrically coupled to first and second gate terminals of said module;

a molded insulative housing mounted on a marginal area of said baseplate, and having first and second opposing walls which support a first elongate metal plate atop said gate collection module, said first metal plate having a first end extending though said first wall to form a common terminal of said module, said first metal plate having multiple spaced apart and raised lateral connection areas formed along each lateral edge thereof;

second and third elongate plates disposed side-by-side atop said first elongate metal plate, but insulated therefrom, said second and third plates having terminal portions which extend perpendicular to said first plate through a top of said housing to form positive and negative terminals of said module, respectively, and having connection area portions which extend in opposite lateral directions relative to said first plate and which interdigitate with respective lateral connection areas of said first metal plate; and

first and second sets of semiconductor switch assemblies disposed on said baseplate on opposite lateral sides of said first plate adjacent said interdigitated connection areas, each semiconductor switch assembly having a first terminal bonded to an adjacent connection area of said first plate, a second terminal bonded to an adjacent connection area of the respective second or third plate, and a gate terminal bonded to a respective terminal strip of said central gate collection component.

9. The switch module of claim 8, wherein said gate terminals are bonded to the respective terminal strips of said central gate collection component by wire conductors routed between the first and second terminals of respective switch assemblies.

10. The switch module of claim 9, wherein the wire conductors bonding the gate terminals to the respective terminal strips of said central gate collection component are oriented substantially perpendicular to portions of the switch assembly terminals between which they are routed, thereby to minimize magnetic coupling between such wire conductors and such switch assembly terminals.

11. The switch module of claim 8, wherein the first metal plate is insert molded in the housing, and a second end of said first metal plate opposite said first end is loosely supported by said second housing wall, so as to permit relative movement between said metal plate and said housing during thermal cycling of said module.

12. The switch module of claim 8, wherein said first and second terminals of said switch assemblies have a generally Z-shaped configuration which permits close spacing of said switch assemblies to said plates and which provides stress relief to accommodate relative movement of said switch assemblies and said plates.

13. The switch module of claim 8, wherein heat generated by said switch assemblies is transferred out of said module through said baseplate and into an underlying structure to which said baseplate is fastened, and a surface of said baseplate facing said underlying structure is recessed in a region opposite said central gate collection component to promote heat transfer from said switch assemblies to said underlying structure.

14. The switch module of claim 8, wherein said baseplate and module each include openings that are axially aligned and adapted to receive fasteners for fastening said module to an underlying support structure, and wherein said module includes a bushing received in each opening of said housing, each bushing having a first end including a flange adjacent a top surface of said housing and adapted to be engaged by a respective fastener, and a second end engaging said baseplate, whereby fastening force developed by said fasteners is applied through said bushings to said baseplate.