Thin type semiconductor package
First Claim
1. A semiconductor package comprising:
- a board having oppositely facing first and second main surfaces and a wiring circuit including connecting portions on the first main surface;
at least one semiconductor chip mounted on the first main surface of the board; and
flat type external connecting terminals on the second main surface of the board and electrically connected to the semiconductor chip through the connecting portions of the wiring circuit, the flat type external connecting terminals each having an area size, being asymmetrically disposed on the second main surface of the board, and being spaced by a curved separating portion extending substantially across the second main surface, the area size, asymmetric disposition, and spacing of the flat type external connecting terminals being related so that all straight lines in a region containing the flat type external connecting terminals cross at least one flat type external connecting terminal, thereby to strengthen the board against bending.
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Accused Products
Abstract
A semiconductor package having a board, at least one semiconductor chip, and flat type external connecting terminals, the board having a wiring circuit including connecting portions on a first main surface, the semiconductor being mounted on the first main surface, the flat type external connecting terminals being electrically connected to the semiconductor chip and formed on a second main surface of the board, wherein the flat type external connecting terminals are disposed in such a manner that any straight line which is arbitrarily drawn across the surface of a region to form the flat type external connecting terminals of the board runs on at least one of the flat type external connecting terminals.
106 Citations
26 Claims
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1. A semiconductor package comprising:
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a board having oppositely facing first and second main surfaces and a wiring circuit including connecting portions on the first main surface; at least one semiconductor chip mounted on the first main surface of the board; and flat type external connecting terminals on the second main surface of the board and electrically connected to the semiconductor chip through the connecting portions of the wiring circuit, the flat type external connecting terminals each having an area size, being asymmetrically disposed on the second main surface of the board, and being spaced by a curved separating portion extending substantially across the second main surface, the area size, asymmetric disposition, and spacing of the flat type external connecting terminals being related so that all straight lines in a region containing the flat type external connecting terminals cross at least one flat type external connecting terminal, thereby to strengthen the board against bending. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor package comprising:
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a generally rectangular board having oppositely facing first and second main surfaces joined by opposite side edges and opposite end edges; a wiring circuit including connecting portions on the first main surface; at least one semiconductor chip mounted on the first main surface of the board; and flat type external connecting terminals on the second main surface of the board and electrically connected to the semiconductor chip, the flat type external connecting terminals being spaced by linear separating portions perpendicular to the side edges of the board and spaced by at least one curved separating portion extending substantially between the end edges of the board. - View Dependent Claims (13, 14)
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15. A semiconductor package, comprising:
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a substrate having a first face, a second face, a wiring pattern formed on the first face, and at least one through hole; at least one semiconductor chip mounted on the first face of the substrate and having an electrode connected to the wiring pattern; and a conductive layer formed on the second face of the board, the conductive layer having grooves that divide the conductive layer into a plurality of flat type external connecting terminals, the flat type external connecting terminals being connected to the wiring pattern via the through hole, the grooves dividing the conductive layer asymmetrically, and including at least one smoothly curved groove running from a first end of the conductive layer to a second end to the conductive layer. - View Dependent Claims (16, 17, 18, 19)
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20. A card shaped storage medium comprising:
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a semiconductor package comprising, a substrate having a first face, a second face, a wiring pattern formed on the first face, and at least one though hole; at least one semiconductor chip mounted on the first face of the substrate and having an electrode connected to the wiring pattern; a conductive layer formed on the second face of the board, the conductive layer having grooves that divide the conductive layer into a plurality of flat type external connecting terminals, the flat type external connecting terminals connected to the wiring pattern via the through hole, the grooves dividing the conductive layer asymmetrically, and including at least one smoothly curved groove running from a first end of the conductive layer to a second end of the conductive layer; and a card for supporting the semiconductor package so that the conductive layer is exposed on a surface of the card. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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Specification