Joint structure of metal member and ceramic member and method of producing the same

• US 6,057,513 A
• Filed: 01/26/1998
• Issued: 05/02/2000
• Est. Priority Date: 01/29/1997
• Status: Expired due to Term

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Tsuruta, Hideyoshi, Fujii, Tomoyuki, Ushikoshi, Ryusuke
• Primary Examiner(s): Kincaid, Kristine
• Assistant Examiner(s): Patel, Dhiru R
• Application Number:
  US09/013,199
• Time in Patent Office: 827 Days
• Field of Search: 174/261, 174/68.1, 174/260, 174/266, 361/748, 361/234, 29/843, 279/128, 257/700, 257/701, 257/703
• US Class Current: 174/260
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding

Abstract

A joint structure having a metal member and a ceramic member having a housing hole for accommodating at least a part of the metal member therein, in which an electrically conductive joint layer is formed between a bottom face of the metal member and a bottom face of the housing hole, and a film having a given wettability by the electrically conductive joint layer is formed on at least a part of the side wall face of the metal member.

Claims

1. A joint structure of a metal member and a ceramic member having a housing hole for accommodating at least a part of the metal member therein, an electrically conductive joint layer joining the metal member to the ceramic member is formed between a bottom face of the metal member and a bottom face of the housing hole, and a film which is less wet than a metal of the metal member thereby is formed on at least a part of a wall face of the metal member.

2. A joint structure according to claim 1, wherein a film is formed over the full side wall face of the metal member.

3. A joint structure according to claim 1, wherein the metal member is provided on its lower portion with a C-chamfered face or a round chamfered face, and the film is not formed on the C-chamfered face or round chamfered face.

4. A joint structure according to claim 1, wherein an electrically conductive member is embedded in the ceramic member by integrally sintering, a part of the electrically conductive member is exposed at the bottom face of the housing hole, and the exposed portion of the electrically conductive member is electrically connected to the bottom face of the metal member through the electrically conductive joint layer.

5. A joint structure according to claim 1, wherein a plate-shaped metal electrode and a powdery sintered body of a low thermal expansion metal are embedded in the ceramic member, the metal electrode is made of a bulk member having many small spaces, the powdery sintered body is electrically connected to the metal electrode, a part of the powdery sintered body is exposed from the bottom face of the housing hole, and the exposed portion of the powdery sintered body is electrically connected to the bottom face of the metal member through the electrically conductive joint layer.

6. A joint structure according to claim 1, wherein the film is selected from the group consisting of a metal oxide film formed by oxidation of a metal of the metal member, a metal nitride film formed by nitriding of a metal of the metal member and a metal carbide film formed by carbonizing of a metal of the metal member.

7. A joint structure according to claim 1, wherein a material of the film is selected from the group consisting of boron nitride and carbon.

8. A method of producing a joint structure of a metal member and a ceramic member having a housing hole for accommodating at least a part of the metal member therein, wherein the metal member is accommodated in the housing hole, and an electrically conductive joint layer joining the metal member to the ceramic member is formed between a bottom face of the metal member and a bottom face of the housing hole, characterized in that a film which is less wet than a metal of the metal member thereby is formed on at least a part of side wall face of the metal member, the metal member is inserted into the housing hole, an electrically conductive joint member for joining the metal member to the ceramic member is arranged between the bottom face of the metal member and the bottom face of the housing hole, and at least the electrically conductive joint member is heated to form the electrically conductive joint layer.