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Silicon carbide semiconductor device and manufacturing method thereof

  • US 6,057,558 A
  • Filed: 03/04/1998
  • Issued: 05/02/2000
  • Est. Priority Date: 03/05/1997
  • Status: Expired due to Term
First Claim
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1. A silicon carbide semiconductor device comprising:

  • a semiconductor substrate made up of a low-resistance semiconductor layer of a first conductive type, a high-resistance semiconductor layer of the first conductive type and a first semiconductor layer of a second conductive type;

    a semiconductor region of the first conductive type formed in a predetermined region of a surface of the first semiconductor layer;

    a trench passing from a surface of the semiconductor substrate through the semiconductor region and the first semiconductor layer;

    a second semiconductor layer of the first conductive type consisting of a thin film of silicon carbide formed at least on a surface of the first semiconductor layer at a side face of the trench;

    a gate insulating film formed at least on a surface of the second semiconductor layer;

    a gate electrode layer formed on the gate insulating film in the trench;

    a first electrode layer formed at least on a surface of a part of the semiconductor region at the surface of the semiconductor substrate; and

    a second electrode layer formed on a rear side of the semiconductor substrate,wherein when a reverse bias voltage is impressed on a pn junction between the first electrode layer and the second electrode layer a pn junction between the high-resistance semiconductor layer and the first semiconductor layer undergoes avalanche breakdown before the second semiconductor layer between the high-resistance semiconductor layer and the semiconductor region suffers punch-through.

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