Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
First Claim
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1. A method of manufacturing micro-electro-mechanical devices, comprising the steps of:
- providing a substrate wafer;
applying a layer of organic adhesive to said substrate wafer;
placing a wafer onto said organic adhesive;
etching said wafer; and
etching said organic adhesive layer with undercuts.
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Abstract
A micro-electro-mechanical device and method of manufacture therefore with a suspended structure formed from mono-crystalline silicon, bonded to a substrate wafer with an organic adhesive layer serving as support and spacer and the rest of the organic adhesive layer serving as a sacrificial layer, which is removed by a dry etch means. Said substrate wafer may contain integrated circuits for sensing and controlling the device.
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Citations
11 Claims
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1. A method of manufacturing micro-electro-mechanical devices, comprising the steps of:
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providing a substrate wafer; applying a layer of organic adhesive to said substrate wafer; placing a wafer onto said organic adhesive; etching said wafer; and etching said organic adhesive layer with undercuts. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification