Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore

• US 6,060,336 A
• Filed: 12/11/1998
• Issued: 05/09/2000
• Est. Priority Date: 12/11/1998
• Status: Expired due to Term

• Current Assignee: CF WAN Incorporated
• Original Assignee: CF WAN Incorporated
• Inventors: Wan, Chang-Feng
• Primary Examiner(s): Bowers, Charles
• Assistant Examiner(s): BEREZNY, NEMA O
• Application Number:
  US09/211,486
• Time in Patent Office: 515 Days
• Field of Search: 438/50, 438/52, 438/53, 438/725, 257/417, 216/2
• US Class Current: 438/50
• CPC Class Codes: B81C 1/0019 Flexible or deformable structures not provided for in groups B81C1/00142 - B81C1/00182
• CPC Class Codes: B81C 2201/0108 Sacrificial polymer, ashing of organics
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers

Abstract

A micro-electro-mechanical device and method of manufacture therefore with a suspended structure formed from mono-crystalline silicon, bonded to a substrate wafer with an organic adhesive layer serving as support and spacer and the rest of the organic adhesive layer serving as a sacrificial layer, which is removed by a dry etch means. Said substrate wafer may contain integrated circuits for sensing and controlling the device.

Claims

1. A method of manufacturing micro-electro-mechanical devices, comprising the steps of:

providing a substrate wafer;

applying a layer of organic adhesive to said substrate wafer;

placing a wafer onto said organic adhesive;

etching said wafer; and

etching said organic adhesive layer with undercuts.

2. The method of manufacturing micro-electro-mechanical devices of claim 1, further comprising the step of moderately baking said substrate wafer after said step of applying a layer of organic adhesive to said substrate wafer.

3. The method of manufacturing micro-electro-mechanical devices of claim 1, wherein said organic adhesive is applied to both said substrate wafer and said wafer.

4. The method of manufacturing micro-electro-mechanical devices of claim 3, wherein said organic adhesive is applied to said wafer only.

5. The method of manufacturing micro-electro-mechanical devices of claim 1, further comprising the step of forming electrical components on said wafer.

6. The method of manufacturing micro-electro-mechanical devices of claim 1, further comprising the step of forming electrical connections between said wafer and said substrate wafer.

7. The method of manufacturing micro-electro-mechanical devices of claim 1, wherein said adhesive layer is an epoxy.

8. The method of manufacturing micro-electro-mechanical devices of claim 1, wherein said wafer is placed onto said organic adhesive layer in a press, whereafter pressure and heat are applied under a vacuum.

9. The method of manufacturing micro-electro-mechanical devices of claim 1, wherein said organic adhesive layer is applied using spin coating.

10. The method of manufacturing micro-electro-mechanical devices of claim 1, wherein said organic adhesive viscosity is adjusted by including solvents into said thermoset.

11. The method of manufacturing micro-electro-mechanical devices of claim 1, wherein said etching is accomplished by an oxygen plasma etch.