Circuit packaging for millimeter-wave components

• US 6,060,342 A
• Filed: 04/06/1998
• Issued: 05/09/2000
• Est. Priority Date: 04/06/1998
• Status: Expired due to Term

• Current Assignee: Tumbleweed Holdings LLC (Equitable IP Corporation)
• Original Assignee: P-Com Incorporated
• Inventors: Fernandez, Victor, Montauti, Fabrizio
• Primary Examiner(s): Picardat, Kevin M.
• Application Number:
  US09/056,390
• Time in Patent Office: 764 Days
• Field of Search: 438/121, 438/125, 438/118, 257/704
• US Class Current: 438/125
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers amplifiers per se H03F
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10329 Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching

Abstract

A module for a millimeter-wave component having environmentally sensitive components, such as with chip and wire technology, is described which does not require that the entire module be hermetically sealed against the outside elements in order to protect the environmentally sensitive component. A cap is placed over the environmentally sensitive component in order that the vulnerable component itself is protected from the external environment. The less-vulnerable remainder of the millimeter-wave module can withstand limited exposure to environmental conditions and, therefore, is not necessarily sealed.

Claims

1. A method of protecting an environmentally sensitive component, comprising:

mounting the environmentally sensitive component to a circuit board assembly and electrically coupling the environmentally sensitive component to at least one component mounted on the circuit board assembly; and

mounting a cap over the environmentally sensitive component such that the environmentally sensitive component is fully enclosed in an enclosure formed by the circuit board assembly and the cap, and where at least one of the at least one component mounted on the circuit board assembly is external to the enclosure.

2. The method of claim 1, wherein the cap is epoxied to the circuit board assembly.

3. The method of claim 2, wherein the cap is made from plastic.