Apparatus and method for depositing uniform charge on a thin oxide semiconductor wafer
First Claim
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1. An apparatus for depositing a uniform charge on a surface of a semiconductor wafer, said apparatus comprising:
- an ion source;
a conductive screen between said source and said surface, said screen having at least one slit-like aperture, said aperture having a length and a width, said length being substantially greater than said width;
a screen potential control for applying a desired potential to said screen; and
a translator, said translator moves said aperture generally parallel to said width.
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Abstract
A conductive slit screen is placed between a corona gun and the surface of a semiconductor wafer. The charge deposited on the wafer by the gun is controlled by a potential applied to the screen. A chuck orients the wafer in close proximity to the screen. A desired charge is applied to the wafer by depositing alternating polarity corona charge until the potential of the wafer equals the potential of the screen.
81 Citations
14 Claims
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1. An apparatus for depositing a uniform charge on a surface of a semiconductor wafer, said apparatus comprising:
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an ion source; a conductive screen between said source and said surface, said screen having at least one slit-like aperture, said aperture having a length and a width, said length being substantially greater than said width; a screen potential control for applying a desired potential to said screen; and a translator, said translator moves said aperture generally parallel to said width. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for depositing a uniform charge on a surface of a semiconductor wafer, said method comprising:
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providing an alternating polarity ion source; providing a conductive screen between said source and said surface, said screen having at least one slit-like aperture, said aperture having a length and a width, said length being substantially greater than said width; providing a screen potential control for applying a desired potential to said screen; applying said desired potential to said screen; moving said aperture generally parallel to said width; and depositing charge on said wafer until said wafer has a potential equal to said desired potential. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method for depositing a uniform charge on a surface of a semiconductor wafer, said method comprising:
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providing an alternating polarity ion source; providing a conductive screen between said source and said surface, said screen having a plurality of slit-like apertures, each aperture having a length and a width, said length being substantially greater than said width; providing a screen potential control for applying a desired potential to said screen; applying said desired potential to said screen; moving said apertures generally parallel to said width; alternating the polarity of said ion source such that dome-like gradients are eliminated; and depositing charge on said wafer until said wafer has a potential equal to said desired potential.
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Specification