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Modular and multifunctional structure

  • US 6,061,243 A
  • Filed: 06/29/1999
  • Issued: 05/09/2000
  • Est. Priority Date: 11/06/1997
  • Status: Expired due to Fees
First Claim
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1. A multifunctional structure for use in spacecraft comprising:

  • a panel having a first panel side and a second panel side that is separated from said first panel sides;

    a flex circuit patch having a first patch side and a second patch side that is separated from said first patch side, said second patch side having a patch lead;

    a multi-chip module (MCM) comprised of at least two, unpackaged semiconductor dies integrated onto a common substrate and having at a least one MCM lead extending over said substrate for use in establishing an electrical connection between one of said two, unpackaged semiconductor dies and said flex circuit patch; and

    means for establishing an electrical connection between said patch lead and said MCM lead;

    wherein said first patch side of said flex circuit is operatively attached to said second panel side of said panel;

    wherein said MCM and said means for establishing an electrical connection are operatively attached to said second panel side of said panel;

    wherein said panel provides structural support to said flex circuit patch, MCM, and means for establishing an electrical connection;

    wherein said panel provides a thermal circuit for transferring heat from said MCM to said second panel side of said panel during operation of said MCM.

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