Modular and multifunctional structure

• US 6,061,243 A
• Filed: 06/29/1999
• Issued: 05/09/2000
• Est. Priority Date: 11/06/1997
• Status: Expired due to Fees

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Barnett, David M., Rawal, Suraj P., Morgenthaler, Daniel R., Harris, Edward N.
• Primary Examiner(s): Tolin, Gerald
• Assistant Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/331,922
• Time in Patent Office: 315 Days
• Field of Search: 361/688-690, 361/702-704, 361/707, 361/709, 361/710, 361/712-715, 361/719, 361/761, 361/760, 361/767, 361/772, 361/749, 257/706, 257/707, 257/675, 165/80.3, 165/104.33, 165/185, 439/65, 439/67, 439/74, 439/77
• US Class Current: 361/704
• CPC Class Codes: B64G 1/10 Artificial satellites; Systems of such satellites; Interplanetary vehicles space shuttles B64G1/14
• CPC Class Codes: B64G 1/223 Modular spacecraft systems
• CPC Class Codes: B64G 1/428 Power distribution and management
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0116 Porous, e.g. foam
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0323 : Carbon
• CPC Class Codes: H05K 2201/10689 : Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/0064 : onto a polymeric substrate
• CPC Class Codes: H05K 3/361 : Assembling flexible printed circuits with other printed circuits

Abstract

The present invention is directed to a multifunction structure (MFS) in which electrical/electronic componentry, thermal control and structural support are integrated into a monolithic structure that is particularly useful in spacecraft applications. The multifunctional structure is also designed to be modular so that the electrical/electronic componentry can be repaired or replaced.

Claims

1. A multifunctional structure for use in spacecraft comprising:

a panel having a first panel side and a second panel side that is separated from said first panel sides;

a flex circuit patch having a first patch side and a second patch side that is separated from said first patch side, said second patch side having a patch lead;

a multi-chip module (MCM) comprised of at least two, unpackaged semiconductor dies integrated onto a common substrate and having at a least one MCM lead extending over said substrate for use in establishing an electrical connection between one of said two, unpackaged semiconductor dies and said flex circuit patch; and

means for establishing an electrical connection between said patch lead and said MCM lead;

wherein said first patch side of said flex circuit is operatively attached to said second panel side of said panel;

wherein said MCM and said means for establishing an electrical connection are operatively attached to said second panel side of said panel;

wherein said panel provides structural support to said flex circuit patch, MCM, and means for establishing an electrical connection;

wherein said panel provides a thermal circuit for transferring heat from said MCM to said second panel side of said panel during operation of said MCM.

2. A multifunctional structure, as claimed in claim 1, wherein said panel includes:

a core with a first core side and a second core side that is separated from said first core side;

a first facesheet that is operatively attached to said first core side; and

a second facesheet that is operatively attached to said second core side.

3. A multifunctional structure, as claimed in claim 2, wherein:

said core has one of the following;

a honeycomb structure and a foam structure.

4. A multifunctional structure, as claimed in claim 2, further comprising:

a first laminate that is located between said core and said first facesheet; and

a second laminate that is located between said core and said second facesheet.

5. A multifunctional structure, as claimed in claim 4, wherein:

at least one of said first laminate and said second laminate are quasi-isotropic to facilitate heat transfer between said MCM and said second panel side.

6. A multifunctional structure, as claimed in claim 1, further comprising:

a filler located between said first panel side and said second panel side for establishing a path of high thermal conductivity between said MCM and said second panel side.

7. A multifunctional structure, as claimed in claim 1, wherein:

said flex circuit patch comprises an adhesiveless, copper-polyimide material.

8. A multifunctional structure, as claimed in claim 1, wherein:

said flex circuit patch includes a hole for accommodating said MCM.

9. A multifunctional structure, as claimed in claim 1, wherein:

said means for establishing includes a socket for establishing an electrical connection between said MCM lead and said patch lead.

10. A multifunctional structure, as claimed in claim 1, further comprising:

a cover located over said second panel side to provide radiation shielding.

11. A multifunctional structure, as claimed in claim 10, wherein:

said cover includes a metal for providing one of the following;

EMI shielding and ionization radiation shielding.

12. A modular multifunctional structure for use in a spacecraft comprising:

a panel having a first panel side and a second panel side that is separated from said first panel side;

a flex circuit patch having a first patch side and a second patch side that is separated from said first patch side;

wherein said second patch side has a patch lead with a first patch lead end and a second patch lead end;

a multi-chip module (MCM) comprised of at least two, unpackaged semiconductor dies integrated onto a common substrate and having at least one MCM lead extending over said substrate for use in establishing an electrical connection between said MCM and said flex circuit patch;

a bond connecting said first patch side of said flex circuit patch to said second panel side of said panel;

first means for establishing a first electrical connection between said first patch lead end and said MCM lead;

second means for establishing a second electrical connection between said second patch lead end and other electrical componentry;

wherein said MCM, said first means and said second means are operatively attached to said second panel side of said panel;

wherein said panel provides structural support to said flex circuit patch, MCM, first means and second means;

wherein said panel provides a thermal circuit for transferring heat from said MCM to said first panel side of said panel during operation of said MCM.

13. A modular multifunctional structure, as claimed in claim 12, wherein:

said bond is susceptible to weakening to facilitate removal of said flex circuit patch from said panel.

14. A modular multifunctional structure, as claimed in claim 12, wherein:

said bond is susceptible to weakening upon the application of one of the following;

heat and a solvent.

15. A modular multifunctional structure, as claimed in claim 12, wherein:

said first means includes a socket that is operatively attached to said second patch side of said flex circuit patch.

16. A modular multifunctional structure, as claimed in claim 12, wherein:

said first means includes a socket that permits detachment of said MCM lead.

17. A modular multifunctional structure, as claimed in claim 12, wherein:

said second means includes a flex circuit jumper having a first jumper end and a second jumper end;

third means for electrically connecting said first jumper end to said second patch lead end.

18. A modular multifunctional structure, as claimed in claim 17, wherein:

said third means includes an electrically conductive, adhesive material.

19. A modular multifunctional structure, as claimed in claim 17, wherein:

said third means includes electrically conductive, anisotropic material.

20. A modular multifunctional structure, as claimed in claim 12, wherein:

said second means includes electrically conductive line extending from a first end to a second end;

a first pad operatively connected to said line and located adjacent to said first end;

a second pad operatively connected to said line and located closer to said second end and said first end;

wherein said second electrical connection is initially established between said second patch lead end and said first pad;

wherein said line can be subsequently cut between said first pad and said second pad, and said second pad can be subsequently used to establish said second electrical connection between said second patch lead end and said line.

21. A modular multifunctional structure, as claimed in claim 12, wherein:

said second patch lead end and said second means include a device for orienting said second patch lead end to said second means.

22. A modular multifunctional structure, as claimed in claim 12, wherein:

said flex circuit patch has a hole for accommodating said MCM.

23. A modular multifunctional structure, as claimed in claim 22, further comprising:

a thermally conductive adherent for bonding said MCM to said second panel side of said panel.

24. A modular multifunctional structure, as claimed in claim 23, wherein:

said adherent is susceptible to weakening to facilitate removal of said MCM, wherein said weakening occurs upon the application of one of the following;

heat and a solvent.