Modular and multifunctional structure
First Claim
Patent Images
1. A multifunctional structure for use in spacecraft comprising:
- a panel having a first panel side and a second panel side that is separated from said first panel sides;
a flex circuit patch having a first patch side and a second patch side that is separated from said first patch side, said second patch side having a patch lead;
a multi-chip module (MCM) comprised of at least two, unpackaged semiconductor dies integrated onto a common substrate and having at a least one MCM lead extending over said substrate for use in establishing an electrical connection between one of said two, unpackaged semiconductor dies and said flex circuit patch; and
means for establishing an electrical connection between said patch lead and said MCM lead;
wherein said first patch side of said flex circuit is operatively attached to said second panel side of said panel;
wherein said MCM and said means for establishing an electrical connection are operatively attached to said second panel side of said panel;
wherein said panel provides structural support to said flex circuit patch, MCM, and means for establishing an electrical connection;
wherein said panel provides a thermal circuit for transferring heat from said MCM to said second panel side of said panel during operation of said MCM.
2 Assignments
0 Petitions
Accused Products
Abstract
The present invention is directed to a multifunction structure (MFS) in which electrical/electronic componentry, thermal control and structural support are integrated into a monolithic structure that is particularly useful in spacecraft applications. The multifunctional structure is also designed to be modular so that the electrical/electronic componentry can be repaired or replaced.
-
Citations
24 Claims
-
1. A multifunctional structure for use in spacecraft comprising:
-
a panel having a first panel side and a second panel side that is separated from said first panel sides; a flex circuit patch having a first patch side and a second patch side that is separated from said first patch side, said second patch side having a patch lead; a multi-chip module (MCM) comprised of at least two, unpackaged semiconductor dies integrated onto a common substrate and having at a least one MCM lead extending over said substrate for use in establishing an electrical connection between one of said two, unpackaged semiconductor dies and said flex circuit patch; and means for establishing an electrical connection between said patch lead and said MCM lead; wherein said first patch side of said flex circuit is operatively attached to said second panel side of said panel; wherein said MCM and said means for establishing an electrical connection are operatively attached to said second panel side of said panel; wherein said panel provides structural support to said flex circuit patch, MCM, and means for establishing an electrical connection; wherein said panel provides a thermal circuit for transferring heat from said MCM to said second panel side of said panel during operation of said MCM. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. A modular multifunctional structure for use in a spacecraft comprising:
-
a panel having a first panel side and a second panel side that is separated from said first panel side; a flex circuit patch having a first patch side and a second patch side that is separated from said first patch side; wherein said second patch side has a patch lead with a first patch lead end and a second patch lead end; a multi-chip module (MCM) comprised of at least two, unpackaged semiconductor dies integrated onto a common substrate and having at least one MCM lead extending over said substrate for use in establishing an electrical connection between said MCM and said flex circuit patch; a bond connecting said first patch side of said flex circuit patch to said second panel side of said panel; first means for establishing a first electrical connection between said first patch lead end and said MCM lead; second means for establishing a second electrical connection between said second patch lead end and other electrical componentry; wherein said MCM, said first means and said second means are operatively attached to said second panel side of said panel; wherein said panel provides structural support to said flex circuit patch, MCM, first means and second means; wherein said panel provides a thermal circuit for transferring heat from said MCM to said first panel side of said panel during operation of said MCM. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
-
Specification