Microelectric packages including flexible layers and flexible extensions, and liquid crystal display modules using the same
First Claim
1. A microelectronic package for mounting microelectronic devices thereon, comprising:
- a first substrate and a second substrate that is spaced apart from the first substrate;
an intermediary layer between the first and second spaced apart substrates, the intermediary layer being flexible relative to the first and second spaced apart substrates, the intermediary layer including at least one flexible extension that extends beyond the first and second spaced apart substrates;
a plurality of conductive lines on at least one of the first and second spaced apart substrates, that extend onto the flexible intermediary layer and extend along the flexible intermediary layer onto the at least one flexible extension; and
an integrated circuit mounting region;
wherein the first spaced apart substrate includes at least one aperture that exposes a first face of the intermediary layer, such that the second face of the intermediary layer that is opposite the first face of the intermediary layer exposed by the at least one aperture, is supported by the second spaced apart substrate; and
wherein the integrated circuit mounting region is on the first face of the intermediary layer exposed by the at least one aperture.
2 Assignments
0 Petitions
Accused Products
Abstract
The printed circuit board and tape carrier package of an LCD module are replaced with a microelectronic package that includes a substrate and a layer integrally formed on the substrate that is flexible relative to the substrate. The flexible layer includes at least one flexible extension that extends beyond the substrate. A plurality of conductive lines are included on the substrate that extend onto the flexible layer and extend along the flexible layer onto the at least one flexible extension. The conductive lines on the flexible extension are electrically connected to the data lines, the gate lines or both. Accordingly, tape carrier packages need not be used so that cost may be reduced. Moreover, separate operations to connect tape carrier packages to printed circuits boards may be eliminated, thereby improving reliability and/or cost of the device.
96 Citations
20 Claims
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1. A microelectronic package for mounting microelectronic devices thereon, comprising:
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a first substrate and a second substrate that is spaced apart from the first substrate; an intermediary layer between the first and second spaced apart substrates, the intermediary layer being flexible relative to the first and second spaced apart substrates, the intermediary layer including at least one flexible extension that extends beyond the first and second spaced apart substrates; a plurality of conductive lines on at least one of the first and second spaced apart substrates, that extend onto the flexible intermediary layer and extend along the flexible intermediary layer onto the at least one flexible extension; and an integrated circuit mounting region; wherein the first spaced apart substrate includes at least one aperture that exposes a first face of the intermediary layer, such that the second face of the intermediary layer that is opposite the first face of the intermediary layer exposed by the at least one aperture, is supported by the second spaced apart substrate; and wherein the integrated circuit mounting region is on the first face of the intermediary layer exposed by the at least one aperture. - View Dependent Claims (8, 9)
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2. A microelectronic package for mounting microelectronic devices thereon, comprising:
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a substrate; a layer integrally formed on the substrate that is flexible relative to the substrate, the flexible layer including a plurality of flexible extensions that extend in parallel beyond the substrate; a plurality of conductive lines on the substrate, that extend onto the flexible layer and extend along the flexible layer onto the plurality of flexible extensions; and an integrated circuit mounting region; wherein the substrate includes at least one aperture that exposes the flexible layer; and wherein the integrated circuit mounting region is on the flexible layer exposed by the at least one aperture. - View Dependent Claims (3, 4)
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7. A microelectronic package for mounting microelectronic devices thereon, comprising:
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a first substrate and a second substrate that is spaced apart from the first substrate; an intermediary layer between the first and second spaced apart substrates, the intermediary layer being flexible relative to the first and second spaced apart substrates, the intermediary layer including at least one flexible extension that extends beyond the first and second spaced apart substrates; a plurality of conductive lines on at least one of the first and second spaced apart substrates, that extend onto the flexible intermediary layer and extend along the flexible intermediary layer onto the at least one flexible extension; and a plurality of connecting pads on the at least one flexible extension, a respective one of which is connected to a respective one of the plurality of conductive lines, wherein the plurality of connecting pads are arranged in a plurality of repeated slanting lines on the at least one flexible extension.
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10. A microelectronic package for mounting microelectronic devices thereon, comprising:
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a substrate; a layer integrally formed on the substrate that is flexible relative to the substrate, the flexible layer including at least one flexible extension that extends beyond the substrate; a plurality of conductive lines on the substrate, that extend onto the flexible layer and extend along the flexible layer onto the at least one flexible extension; an integrated circuit mounting region; and a plurality of connecting pads on the at least one flexible extension, a respective one of which is connected to a respective one of the plurality of conductive lines; wherein the substrate includes at least one aperture that exposes the flexible layer; wherein the integrated circuit mounting region is on the flexible layer exposed by the at least one aperture; and wherein the plurality of connecting pads are arranged in a plurality of repeated slanting lines on the at least one flexible extension.
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11. A Liquid Crystal Display (LCD) module comprising:
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an LCD panel including a plurality of spaced apart data lines and a plurality of spaced apart gate lines that intersect the data lines; and a microelectronic package, comprising; a first substrate and a second substrate that is spaced apart from the first substrate; an intermediary layer between the first and second spaced apart substrates, the intermediary layer being flexible relative to the first and second spaced apart substrates, the intermediary layer including at least one flexible extension that extends beyond the first and second spaced apart substrates; and a plurality of conductive lines on at least one of the first and second spaced apart substrates, that extend onto the flexible intermediary layer and extend along the flexible intermediary layer onto the at least one flexible extension, the plurality of conductive lines on the at least one flexible extension being electrically connected to the data lines, the gate lines or both the data lines and the gate lines. - View Dependent Claims (5, 6, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification