Apparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leads

• US 6,061,466 A
• Filed: 12/24/1996
• Issued: 05/09/2000
• Est. Priority Date: 12/26/1995
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tazawa, Hiroshi, Hosomi, Eiichi, Takubo, Chiaki, Shibasaki, Koji
• Primary Examiner(s): Mancuso, Joseph
• Application Number:
  US08/773,054
• Time in Patent Office: 1,232 Days
• Field of Search: 382/146, 382/150, 348/86, 348/90, 348/92, 348/125, 348/126
• US Class Current: 382/146
• CPC Class Codes: G01N 21/88 Investigating the presence of flaws or contamination
• CPC Class Codes: G01R 31/309 of printed or hybrid circuits or circuit substrates
• CPC Class Codes: G01R 31/70 Testing of connections between components and printed circuit boards G01R31/68 takes precedence
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0004 Industrial image inspection
• CPC Class Codes: H01L 2224/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

Disclosed is an apparatus and method for inspecting a connection state of a lead electrode to a bump after TAB (tape automated bonding). An LSI chip is immobilized on a stage. A flexible lead is held by a holding portion and connected to a bump. Above the chip, a CCD camera is provided. The stage is controlled to move up and down by a moving control mechanism. Each of the lead/bump connection states immediately after ILB (Inner lead bonding) is taken in the form of image data and defined as a first image data. A second image data of the lead/bump connection state is taken after the bump and lead are moved to different positions by moving the stage in order to change the position of the chip by means of the moving control mechanism. Whether or not the lead is duly connected to the bump is determined by the comparison of the first and second image data.

Claims

1. A apparatus for inspecting an LSI device in an assembly process, comprising:

a stage for immobilizing an LSI chip thereon;

an assembly mechanism for controlling a lead so as to be connected to a predetermined portion of said LSI chip;

an image-data receiving mechanism for taking at least two types of image data including a first image data of a lead connection state immediately after said connection is made by said assembly mechanism and a second image data of a lead connection state after at least a portion of said lead is moved to a different position with respect to the LSI chip on the stage.

2. The apparatus according to claim 1, wherein said first and second image data taken by said image-data receiving mechanism are compared to each other to determine whether or not said lead is duly connected to said predetermined portion.

3. The apparatus according to claim 1, wherein said image-data receiving mechanism for receiving said first and second image data include out-of-focus image data.

4. An apparatus for inspecting an LSI device in an assembly process, comprising:

a stage for immobilizing an LSI chip thereon;

a holding portion for holding a plurality of flexible leads;

assembling means for controlling said flexible leads so as to be connected to predetermined portions of said LSI chip;

a camera for taking image data of a connection state between said flexible leads and said predetermined portions connected by said assembling means; and

a control mechanism for changing a relative position between said stage and said holding portion in order to inspect said in order to inspect said connection state.

5. The apparatus according to claim 4, wherein said camera takes two image data of connection states before and after the movement of said control mechanism, and said two image data are compared to each other.

6. The apparatus according to claim 4, wherein said control mechanism has a function of moving said stage and said camera synchronously with a predetermined distance apart therebetween.

7. The apparatus according to claim 4, wherein said control mechanism has a function of moving said stage away from said holding portion by a predetermined distance.

8. The apparatus according to claim 4, wherein said control mechanism has a function of moving said stage toward said holding portion by a predetermined distance.

9. The apparatus according to claim 4, wherein said control mechanism has a function of moving said stage and said camera in an upward direction by the same distance.

10. The apparatus according to claim 4, wherein said control mechanism has a function of moving said stage and said camera in a downward direction by the same distance.

11. An apparatus for inspecting an LSI device in an assembly process, comprising:

a stage for immobilizing an LSI chip thereon;

assembling means for controlling a flexible lead so as to be connected to a predetermined portion of said LSI chip;

a camera for taking a connection state of said lead to said predetermined portion in the form of image data; and

a moving control mechanism for moving said chip and said camera or only said chip from a first position to a second position while maintaining at least a portion of said lead at the first position.

12. The apparatus according to claim 11, wherein said assembling means includes a holding portion for holding said lead and said holding portion is unmoved and left in said first position even if said chip or camera moved from said first position to second position, by means of said moving control mechanism.

13. The apparatus according to claim 11, wherein a moving distance between said first position and said second position is longer than a depth of focus inherent in said camera.

14. An apparatus for inspecting an LSI device in an assembly process, comprising:

a stage for immobilizing an LSI chip thereon;

assembling means having a holding portion for holding a flexible lead, for controlling said flexible lead so as to be connected to a predetermined portion of said LSI chip;

a camera for providing image data related to the connection state of said lead to said predetermined portion;

a moving control mechanism for setting a distance between said chip and said camera before a movement of said chip and camera to be equal to that set after the movement of said chip and camera while said holding portion is maintained in a position at which said lead is connected to said predetermined portion of said chip by said assembling means;

wherein two types of image data are provided by said camera respectively before and after said moving control mechanism is functioned, and wherein the two types of image data are compared to each other to determine whether or not said lead is duly connected to said predetermined portion of said chip.

15. The apparatus according to claim 14, wherein a distance moved by said moving control mechanism is longer than the depth of focus inherent in said camera.