Battery tab attachment method and apparatus

• US 6,063,523 A
• Filed: 04/16/1999
• Issued: 05/16/2000
• Est. Priority Date: 04/16/1999
• Status: Expired due to Term

• Current Assignee: Quallion, LLC (EnerSys)
• Original Assignee: Quallion, LLC (EnerSys)
• Inventors: Tsukamoto, Hisashi
• Primary Examiner(s): Nuzzolillo, Maria
• Assistant Examiner(s): Alejandro, Raymond
• Application Number:
  US09/293,450
• Time in Patent Office: 396 Days
• Field of Search: 429/211, 429/209, 429/218.1, 429/231.5, 429/161
• US Class Current: 429/211
• CPC Class Codes: H01M 4/661 Metal or alloys, e.g. alloy coatings H01M4/669 take precedence
• CPC Class Codes: H01M 4/667 in the form of layers, e.g. coatings
• CPC Class Codes: H01M 4/668 Composites of electroconductive material and synthetic resins
• CPC Class Codes: H01M 50/534 characterised by the material of the leads or tabs
• CPC Class Codes: H01M 6/40 Printed batteries , e.g. thin film batteries
• CPC Class Codes: Y10T 29/49108 Electric battery cell making
• CPC Class Codes: Y10T 29/49114 including adhesively bonding

Abstract

The difficulties encountered with attaching tabs to very thin metal layer, e. g., a layer of gold from 0.3 μm to 50 μm thick are severe. Typically, in the uses envisioned for the thin metal layer, which is for a compact battery, a plastic sheet such as polyimide underlies the thin metal layer. Polyimide has a relatively low melting point. The thin polyimide substrate melts when resistance welding is used. Ultrasonic welding doesn'"'"'t work because the sound wave energy is absorbed by the polyimide. This invention solves the attachment problem by using wire bonding to the thin metal sheet and to its tab. The tab attachment for a thin metal layer comprises a thin metal layer, a metal tab, and a wire and the wire is bonded to the thin metal layer and the wire is bonded to the metal tab. The thin metal layer may be gold; the thickness of the gold is between 0.3 μm and 50.0 μm.

Claims

1. A tab attachment comprising a thin metal layer laminated on a thin plastic layer, a metal tab, and a wire;

said wire wire-bonded to said thin metal layer and said wire wire-bonded to said metal tab whereby an electrical connection is established between the metal tab and the thin metal layer;

further comprising a mechanical bond between the thin metal layer and the metal tab;

wherein said mechanical bond comprises a bond selected from the group consisting of tape, glue and adhesive;

further comprising said wire bonds placed toward the ends of the wire, wire-bonded to the thin metal layer and the tab.

2. The tab attachment as in claim 1 wherein a first thin metal layer is selected from the group consisting of gold and aluminum, for a positive electrode;

wherein the thickness of the first metal layer is between 0.3 μ

m and 50 μ

m.

3. The tab attachment as in claim 1 wherein a second thin metal layer is selected from the group consisting of gold, titanium, iron and stainless steel, for a negative electrode;

wherein the thickness of the second metal layer is between 0.3 μ

m and 50 μ

m.

4. The tab attachment as in claim 2 wherein a first metal wire is selected from the group consisting of gold and aluminum, for a positive electrode;

wherein the thickness of the first wire is between 10 μ

m and 50 μ

m.

5. The tab attachment as in claim 3 wherein a second metal wire is selected from the group consisting of gold, titanium, iron and stainless steel, for a negative electrode;

wherein the thickness of the second wire is between 10 μ

m and 50 μ

m.

6. The tab attachment as in claim 2 wherein a first metal tab is selected from the group consisting of gold and aluminum, for a positive electrode;

where in the thickness of the first metal tab is between 30 μ

m and 80 μ

m.

7. The tab attachment as in claim 3 wherein a second metal tab is selected from the group consisting of gold, titanium, iron and stainless steel, for a negative electrode;

wherein the thickness of the second metal tab is between 30 μ

m and 80 μ

m.