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Semiconductor integrated circuit failure analysis using magnetic imaging

  • US 6,064,220 A
  • Filed: 07/29/1997
  • Issued: 05/16/2000
  • Est. Priority Date: 07/29/1997
  • Status: Expired due to Term
First Claim
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1. A method of characterizing an integrated circuit having a functional circuitry area and a connection area with a plurality of pins for input and output of electrical signals to the functional circuitry area, comprising the steps of:

  • producing a magnetic response from the functional circuitry area by applying a predetermined electrical stimulus to at least one of the pins of the connection area,sensing the magnetic response of the functional circuitry area at each of a plurality of positions across the functional circuitry area of the integrated circuit,capturing a quantitative indication of a strength of the magnetic response at each of the plurality of positions across the functional circuitry area of the integrated circuit,creating a magnetic response array for the functional circuitry area based on the captured quantitative indications of the magnetic field strength at the plurality of positions, andcomparing the magnetic response array of the integrated circuit to at least one predetermined magnetic response array for a reference integrated circuit having a known characteristic; and

    characterizing the integrated circuit based at least in part on the comparison between the integrated circuit and the reference integrated circuit.

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