Semiconductor physical quantity sensor with stopper portion

• US 6,065,341 A
• Filed: 12/11/1998
• Issued: 05/23/2000
• Est. Priority Date: 02/18/1998
• Status: Expired due to Term

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Sakai, Minekazu, Ao, Kenichi, Ishio, Seiichiro
• Primary Examiner(s): Williams, Hezron
• Assistant Examiner(s): Kwok, Helen C.
• Application Number:
  US09/209,414
• Time in Patent Office: 529 Days
• Field of Search: 73/514.32, 73/514.18, 73/514.01, 73/514.35, 73/777, 73/514.16, 73/514.21, 73/514.38, 361/280, 361/283.1, 361/283.2, 361/283.4, 361/283.3
• US Class Current: 73/514.32
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 3/0051 For defining the movement, i.e. structures that guide or limit the movement of an element mechanical arrangements for preventing or damping vibration or shock H01H3/60
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

A mass portion of a movable portion is supported by an anchor portion protruding from a substrate through a beam portion. A stopper portion fixed to the substrate through another anchor portion is disposed on a side opposite to the mass portion with respect to the beam portion to define a gap with the beam portion. The stopper portion is electrically connected to the beam portion through the anchor portions. Accordingly, the movable portion is restricted from being displaced in a direction generally parallel to a surface of the substrate, and a movable electrode of the movable portion is prevented from being attached to the fixed electrode.

Claims

1. A semiconductor sensor for detecting a physical quantity, comprising:

a substrate having first and second anchor portions thereon;

a movable portion for being displaced generally in a direction parallel to a surface of the substrate by the physical quantity, the movable portion being disposed above the substrate and including a beam portion, a mass portion, and a movable electrode, the mass portion being supported by the first anchor portion through the beam portion;

a fixed electrode fixed to the substrate and facing the movable electrode of the mass portion; and

a stopper portion, for restricting displacement of the mass portion, the stopper portion being fixed to the substrate through the second anchor portion separately from the movable portion, the stopper portion being electrically connected to the beam portion through the first and second anchor portions.

2. The semiconductor sensor of claim 1, wherein the substrate has an electrode pattern made of polysilicon that electrically connects the first and second anchor portions.

3. The semiconductor sensor of claim 1, wherein the stopper portion is provided on a side opposite to the mass portion with respect to the beam portion.

4. The semiconductor sensor of claim 3, wherein:

the beam portion is a polygonally shaped beam including an inner beam cavity therein; and

the stopper portion is disposed in the inner beam cavity.

5. The semiconductor sensor of claim 3, wherein the stopper portion is isolated from the beam portion.

6. The semiconductor sensor of claim 3, wherein the stopper portion has a protrusion protruding toward the beam portion for restricting the displacement of the mass portion.

7. The semiconductor sensor of claim 3, wherein:

the fixed electrode and the movable electrode define a first gap therebetween; and

the stopper portion and the beam portion define a second gap therebetween, the second gap being larger than the first gap.

8. The semiconductor sensor of claim 7, wherein the stopper portion has a protrusion protruding toward the beam portion and defining the second gap with the beam portion.

9. The semiconductor sensor of claim 1, wherein the substrate has a plurality of protrusions respectively facing the beam portion, the movable electrode and the mass portion.

10. The semiconductor sensor of claim 1, wherein the substrate has an electrode pattern facing the mass portion and electrically connected to the movable portion through the first anchor portion to have an electric potential equal to that of the movable portion.

11. The semiconductor sensor of claim 10, wherein the electrode pattern faces all of the mass portion, the movable electrode and the beam portion.

12. The semiconductor sensor of claim 11, wherein the electrode pattern has a plurality of protrusions respectively facing the mass portion, the movable electrode and the beam portion.

21. The semiconductor sensor of claim 1, wherein the stopper portion is non-movable even when the movable portion abuts the stopper portion.

22. The semiconductor sensor of claim 1, wherein the stopper portion faces the mass portion in a displacement direction in which the movable portion is displaced.

23. The semiconductor sensor of claim 22, wherein the stopper portion extends in a direction perpendicular to the displacement direction.

24. The semiconductor sensor of claim 6, wherein the protrusion faces the mass portion in a displacement direction in which the movable portion is displaced.

25. The semiconductor sensor of claim 8, wherein the protrusion faces the mass portion in a displacement direction in which the movable portion is displaced.

26. The semiconductor sensor of claim 1, wherein:

the stopper portion has first and second stopper portions respectively facing the mass portion on both sides of the mass portion in a displacement direction in which the movable portion is displaced.

13. A semiconductor sensor for detecting a physical quantity, comprising:

a substrate having an anchor portion thereon;

a movable portion including a beam portion, a mass portion, and a movable electrode, the movable portion being suspended above the substrate and being displaced by the physical quantity, the mass portion being supported by the anchor portion through the beam portion;

a fixed electrode fixed to the substrate and facing the movable electrode,

wherein the substrate has an electrode pattern facing the movable portion with a gap interposed therebetween, the electrode pattern being electrically connected to the movable portion through the anchor portion to have an electric potential equal to that of the movable portion.

14. The semiconductor sensor of claim 13, wherein the electrode pattern faces the entire surface of the mass portion, the movable electrode and the beam portion.

15. The semiconductor sensor of claim 14, wherein the electrode pattern has a plurality of protrusions facing the mass portion, the movable electrode and the beam portion.

16. The semiconductor sensor of claim 13, wherein the electrode pattern has a shape generally the same as that of the movable portion.

17. A semiconductor sensor for detecting a physical quantity, comprising:

a substrate having an anchor portion protruding therefrom and an electrode pattern;

a movable portion for being displaced by the physical quantity, the movable portion including a beam portion, a mass portion, and a movable electrode, and the movable portion being disposed above the substrate to face the electrode pattern with a first gap interposed therebetween, the mass portion being supported by the anchor portion through the beam portion;

a fixed electrode fixed to the substrate and facing the movable electrode with a second gap interposed therebetween; and

a stopper portion fixed to the substrate and facing the beam portion with a third gap interposed therebetween on a side opposite to the mass portion,

wherein the stopper portion and the electrode pattern are electrically connected to the beam portion through the anchor portion to restrict displacement of the movable portion in directions generally parallel to a surface of the substrate and generally perpendicular to the surface.

18. The semiconductor sensor of claim 17, wherein the third gap is larger than the second gap.

19. The semiconductor sensor of claim 17, wherein the stopper portion has a stopper protrusion facing the beam portion with the third gap interposed therebetween.

20. The semiconductor sensor of claim 17, wherein:

the electrode pattern has a plurality of protrusions facing the movable portion with the first gap interposed therebetween.

27. A semiconductor sensor for detecting a physical quantity, comprising:

a substrate;

a movable portion movably supported on the substrate and having a movable electrode; and

a fixed portion fixed non-movably to the substrate and separated from the movable portion, the fixed portion including a fixed electrode facing the movable electrode to detect the physical quantity, and a stopper portion facing a part of the movable portion for restricting displacement of the movable portion, the stopper portion having an electric potential approximately equal to that of the movable portion.

28. The semiconductor sensor of claim 27, wherein:

the movable portion has a mass portion which is displaced together with the movable electrode in a displacement direction approximately parallel to a surface of the substrate; and

wherein the stopper portion faces the movable portion with a specific gap in the displacement direction.

29. The semiconductor sensor of claim 28, wherein the stopper portion has a protrusion facing the movable portion with the specific gap.

30. The semiconductor sensor of claim 27, wherein the substrate has an electrode pattern facing the movable portion in a direction perpendicular to a surface thereof and having an electric potential approximately equal to that of the movable portion.