Apparatus for use in electrical, e.g. electrochemical, measurement procedures, and its production and use, and composite assemblies incorporating the apparatus

• US 6,066,244 A
• Filed: 02/28/1992
• Issued: 05/23/2000
• Est. Priority Date: 10/31/1984
• Status: Expired due to Term

• Current Assignee: Inverness Medical Switzerland GmbH (Abbott Laboratories)
• Original Assignee: Unilever Patent Holdings BV (Unilever PLC)
• Inventors: Marshman, Clive Edward, Stephenson, Peter Richard, Nylander, Claes Ivan, Birch, Brian Jeffrey
• Primary Examiner(s): TUNG, TA HSUNG
• Application Number:
  US07/842,329
• Time in Patent Office: 3,007 Days
• Field of Search: 204/418, 204/416, 204/419, 204/435
• US Class Current: 204/435
• CPC Class Codes: G01N 27/333 Ion-selective electrodes or membranes glass electrodes G01N27/36

Abstract

A composite electrode, comprising:

a solid non-metallic substrate, (such as ceramic, glass, or epoxy resin,)

and, bonded directly or indirectly to said substrate,

a non-conducting matrix, incorporating particles which are accessible to the electrode surface and contain an insoluble metal salt (e.g. halide) in direct electrical contact with the metal corresponding to said salt, said metal being present either (i) in the form of metallic particles incorporated in a non-conducting matrix zone disposed so that said metal salt-containing particles are located between said metallic particles and said electrode surface, and/or (ii) a solid metallic surface in the form of an intermediate layer between said matrix and said substrate.

Claims

1. A composite electrode comprising:

a solid non-conducting substrate;

metallic particles;

a non-conductive matrix layer in which the metallic particles are incorporated, and

insoluble metal salt particles which are of the same metal as the metallic particles, which are incorporated in said non-conductive matrix and which are accessible to reactions with electrochemical reagents at the surface of the electrode, such that there are insoluble metal salt particles located between the metallic particles and the surface of the electrode and the surface of the electrode predominantly comprises metal salt particles whereby the ratio of metallic particles to insoluble metal salt particles gradually increases from the outermost towards the innermost portions of the non-conductive matrix layer.

2. A composite electrode according to claim 1 further comprising an electroactive membrane which overlies said matrix incorporating said metal halide-containing particles.

3. A composite electrode according to claim 1 wherein the metal halide particles are derived from a layer of non-conducting matrix incorporating metallic particles the surface of which layer has been treated to convert metal to metal halide.

4. A composite electrode according to claim 1 wherein the non-conductive matrix has been formed by printing a layer of corresponding material in flowable form onto the solid substrate, and hardening the layer or allowing it to harden.

5. A composite electrode according to claim 1 wherein the substrate is made of plastics or ceramic material.

6. A composite electrode according to claim 5, wherein the substrate is made of a material selected form the group consisting of epoxy, polyvinylchloride, or alumina.

7. A composite electrode according to claim 1 wherein the particles in the matrix comprise silver and silver chloride particles.

8. A composite electrode according to claim 1 wherein a hermetic sealing layer is present over all conductive or electroactive parts of the electrode other than a sensitive surface intended to contact electrolyte.

9. An assembly comprising a composite electrode according to claim 1 wherein the metallic particles of the composite electrode are functionally connected to a hermetically sealed semiconductor device or integrated semiconductor circuit mounted on said solid non-metallic substrate.

10. An assembly according to claim 9 wherein the substrate is made of a ceramic or a polymer and the assembly is encapsulated with a hermetic sealing material which forms an integral sealed assembly having a functionally exposed area or areas not covered by the encapsulation.

11. An assembly according to claim 9, wherein said hermetically sealed semiconductor device or integrated circuit is packaged in a non-metallic package which constitutes said substrate for said composite electrode.

12. An electrode according to claim 1 in which the matrix layer has been produced by printing a layer of metallic particle containing material on the said substrate and hardening the layer or allowing it to harden.

13. A composite electrode comprising:

a solid non-conducting substrate;

metallic particles; and

a non-conductive matrix incorporating insoluble salt particles, the salt being of the same metal as the metallic particles and the metal salt particles being accessible to reaction with external electrochemical reagents at the surface of the electrode,

wherein the metallic particles are incorporated in said non-conductive matrix, said matrix having been applied directly to said substrate as a metallic particle containing layer and the metal salt particles thereafter being formed therein by treatment of the surface of said matrix layer, such that there are insoluble metal salt particles located between the metallic particles and the surface of the electrode and the surface of the electrode predominantly comprises metal salt particles whereby the ratio of metallic particles to insoluble salt particles gradually increases from the outermost towards the innermost portions of the non-conductive matrix layer.