Compound semiconductor light-emitting device of gallium nitride series

• US 6,067,309 A
• Filed: 09/02/1997
• Issued: 05/23/2000
• Est. Priority Date: 09/06/1996
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Itaya, Kazuhiko, Onomura, Masaaki, Hatakoshi, Genichi
• Primary Examiner(s): Davie, James W.
• Application Number:
  US08/921,693
• Time in Patent Office: 994 Days
• Field of Search: 372/46, 372/45
• US Class Current: 372/46.01
• CPC Class Codes: H01S 2301/173 The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction
• CPC Class Codes: H01S 5/0421 characterised by the semiconducting contacting layers electrodes H01S5/0425
• CPC Class Codes: H01S 5/0425 Electrodes, e.g. characterised by the structure
• CPC Class Codes: H01S 5/04252 characterised by the material
• CPC Class Codes: H01S 5/04257 having positive and negative electrodes on the same side of the substrate
• CPC Class Codes: H01S 5/221 containing aluminium
• CPC Class Codes: H01S 5/227 Buried mesa structure ; Striped active layer
• CPC Class Codes: H01S 5/3063 using Mg
• CPC Class Codes: H01S 5/32341 blue laser based on GaN or GaP
• CPC Class Codes: H01S 5/34333 with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser

Abstract

There is disclosed a compound semiconductor light-emitting device of gallium nitride series having high reliability, which can be operated by a low threshold current and a low operation voltage without deterioration. The device comprises a p-type semiconductor structure having high carrier concentration, which can easily form a low resistance p-side electrode, and which can uniformly implant carriers to an active layer highly efficiently. A p electrode contact layer having Mg added thereto is used as a p-type semiconductor layer. At least a Ga_x2 In_y2 Al_z2 N (x2+y2+z2=1, 0≦x2, z2≦1, 0<y2≦1) smoothing layer is formed on an active layer than the p-type contact layer. On a surface of the p-type contact layer, there is formed a layered structure having a Pt layer, and a Ti layer containing TiN, and a Ti layer in order. An alloy, formed of Pt-semiconductor, is formed between the p-type contact layer and the Pt layer.

Claims

1. A compound semiconductor light-emitting device having a compound semiconductor (Ga_x1 In_y1 Al_z1 N:

x1+y1+z1=1, 0≦

x1, y1, z1≦

1) comprising;

an n-type semiconductor layer having at least an n-type clad layer;

an active layer formed on said n-type semiconductor layer;

a p-type semiconductor layer, formed on said active layer, having at least a p-type clad layer;

a smoothing layer of Ga_x2 In_y2 Al_z2 N (x2+y2+z2=1, 0≦

x2, z2≦

1, 0<

y2≦

1) formed in said active layer;

a p-type contact layer, formed on said p-type semiconductor layer, having a p-type impurity added thereto;

a p-side electrode formed on said p-type contact layer; and

an n-side electrode electrically connected with said n-type semiconductor layer.

2. The compound semiconductor light-emitting device according to claim 1, wherein said p-type contact layer contains Mg as said p-type impurity.

3. A compound semiconductor light-emitting device having a compound semiconductor (Ga_x1 In_y1 Al_z1 N:

x1+y1+z1=1, 0≦

x1, y1, z1≦

1) comprising;

an n-type semiconductor layer having at least an n-type clad layer;

an active layer formed on said n-type semiconductor layer;

a p-type semiconductor layer, formed on said active layer, having at least a p-type clad layer;

a smoothing layer of Ga_x2 In_y2 Al_z2 N (x2+y2+z2=1, 0≦

x2, z2≦

1, 0<

y2≦

1) formed in said active layer;

a p-type contact layer, formed on said p-type semiconductor layer, having a p-type impurity added thereto;

an alloy layer, made of Pt-semiconductor, selectively formed on a surface of said p-type contact layer;

a p-side electrode, containing a layered structure made of a Pt layer formed on said alloy layer, a Ti layer containing TiN, thereon, and a Ti layer thereon; and

an n-side electrode electrically connected with said n-type semiconductor layer.

4. The compound semiconductor light-emitting device according to claim 3, wherein an Au layer is formed on said Ti layer through a second Pt layer.

5. The compound semiconductor light-emitting device according to claim 3, wherein said p-type contact layer contains carbon, and carbon concentration of a boundary between said Ti layer containing TiN, and said Pt layer is higher than carbon concentration of said p-type contact layer.

6. The compound semiconductor light-emitting device according to claim 3, wherein said p-type contact layer contains carbon and oxygen, and carbon concentration of a boundary between said Ti layer containing TiN and said Pt layer is higher than carbon concentration of said p-type contact layer, and oxygen concentration of said boundary is higher than oxygen concentration of said p-type contact layer.

7. The compound semiconductor light-emitting device according to claim 3, wherein said p-type contact layer contains hydrogen, and hydrogen concentration of a boundary between said second Pt layer and said Au layer is higher than hydrogen concentration of said p-type contact layer.

8. The compound semiconductor light-emitting device according to claim 3, wherein said n-side electrode has a layered structure having the Ti layer and Au layer formed in order.

9. A compound semiconductor light-emitting device having a compound semiconductor (Ga_x1 In_y1 Al_z1 N:

x1+y1+z1=1, 0≦

x1, y1, z1<

1) comprising;

an n-type-semiconductor layer having at least an n-type clad layer;

an active layer, formed on said n-type semiconductor layer, having a multi-quantum well structure having well layers, formed of at least Ga_x3 In_y3 Al_z3 N (x3+y3+z3=1, 0≦

x3, y3, z3≦

1) and barrier layers, formed of Ga_x4 In_y4 Al_z4 N (x4+y4+z4=1, 0≦

x4, y4, z4≦

1), alternatively layered;

a p-type semiconductor layer, formed on said active layer, having at least a p-type clad layer;

a smoothing layer of Ga_x2 In_y2 Al_z2 N (x2+y2+z2=1, 0≦

x2, z2<

1, 0<

y2≦

1) formed in said p-type semiconductor layer;

a p-type contact layer, formed on said p-type semiconductor layer, having a p-type impurity added thereto;

a p-side electrode formed on said p-type contact layer; and

an n-side electrode electrically connected with said n-type semiconductor layer, wherein said Ga_x2 In_y2 Al_z2 N smoothing layer is formed to be thicker than the thickness of said well layer when In composition y2 is lower than In composition y3 of said well layer.

10. The compound semiconductor light-emitting device according to claim 9, wherein said p-type contact layer has an alloy layer, made of Pt-semiconductor, selectively formed on its surface, and said p-side electrode has a layered structure made of a Pt layer formed on said alloy layer, a Ti layer containing TiN, thereon, and a Ti layer thereon.

11. The compound semiconductor light-emitting device according to claim 9, wherein said Ga_x2 In_y2 Al_z2 N smoothing layer is formed to be thicker than the thickness of said well layer and a p-type carrier concentration is 1×

10¹⁸ cm^-3 or more when In composition y2 is lower than In composition y3 of said well layer.

12. A compound semiconductor light-emitting device having a compound semiconductor (Ga_x1 In_y1 Al_z1 N:

x1+y1+z1=1, 0≦

x1, y1, z1≦

1)comprising;

an n-type semiconductor layer having at least an n-type clad layer;

an active layer, formed on said n-type semiconductor layer, having a multi-quantum well structure having well layers, formed of at least Ga_x3 In_y3 Al_z3 N (x3+y3+z3=1, 0≦

x3, y3, z3≦

1), and barrier layers, formed of Ga_x4 In_y4 Al_z4 N (x4+y4+z4=1, 0≦

x4, y4, z4≦

1) alternatively layered;

a p-type semiconductor layer, formed on said active layer, having at least a p-type clad layer;

a smoothing layer of Ga_x2 In_y2 Al_z2 N (x2+y2+z2=1, 0≦

x2, z2≦

1, 0<

y2≦

1) formed in said p-type semiconductor layer;

a p-type contact layer, formed on said p-type semiconductor layer, having a p-type impurity added thereto;

a p-side electrode formed on said p-type contact layer; and

an n-side electrode electrically connected with said n-type semiconductor layer, wherein said n-type semiconductor layer, wherein said Ga_x2 In_y2 Al_z2 N smoothing layer is formed to be thinner than the thickness of said well layer when In composition y2 is higher than In composition y3 of said well layer.

13. The compound semiconductor light-emitting device according to claim 12, wherein said p-type contact layer has an alloy layer, made of Pt-semiconductor, selectively formed on its surface, and said p-side electrode has a layered structure made of a Pt layer formed on said alloy layer, a Ti layer containing TiN, thereon, and a Ti layer thereon.

14. A compound semiconductor light-emitting device having a compound semiconductor (Ga_x1 In_y1 Al_z1 N:

x1+y1+z1=1, 0≦

x1, y1, z1≦

1) (comprising;

an n-type clad layer;

an n-type waveguide layer formed on said n-type clad layer;

an active layer formed on said waveguide layer;

a p-type waveguide layer, formed on said active layer, having a stripe ridge;

a block layer selectively formed on along a side portion of the ridge of said p-type waveguide layer;

a smoothing layer of Ga_x2 In_y2 Al_z2 N (x2+y2+z2=1, x2, z2≦

1, 0<

y2≦

1) formed on said block layer and the ridge of said p-type waveguide layer;

a p-type clad layer formed on said Ga_x2 In_y2 Al_z2 N smoothing layer;

a p-type contact layer, formed on said p-type clad layer, having a p-type impurity added thereto;

a p-side electrode formed on said p-type contact layer; and

an n-side electrode electrically connected with said n-type semiconductor layer, wherein said block layer is formed of Ga_x5 In_y5 Al_z5 N (x5+y5+z5=1, 0≦

x5, y5≦

1, 0≦

z5≦

1).

15. The compound semiconductor light-emitting device according to claim 14, wherein said active layer is a multi-quantum well structure having well layers (x3+y3+z3=1, 0≦

x3, y3, z3≦

1), formed of at least Ga_x3 In_y3 Al_z3 N, and barrier layers, formed Ga_x4 In_y4 Al_z4 N (x4+y4+z4=1, 0≦

x4, y4, z4≦

1), alternatively layered.

16. The compound semiconductor light-emitting device according to claim 14, wherein said p-type contact layer has an alloy layer, made of Pt-semiconductor, selectively formed on its surface, and said p-side electrode has a layered structure made of a Pt layer formed on said alloy layer, a Ti layer containing TiN, thereon, and a Ti layer thereon.

17. A compound semiconductor light-emitting device having a compound semiconductor (Ga_x1 In_y1 Al_z1 N:

x1+y1+z1=1, 0≦

x1, y1, z1≦

1) comprising;

an n-type clad layer;

an n-type waveguide layer formed on said n-type clad layer;

an active layer formed on said n-type waveguide layer;

a p-type waveguide layer, formed on said active layer, having a stripe ridge;

a block layer selectively formed on along a side portion of the ridge of said p-type waveguide layer;

a smoothing layer of Ga_x2 In_y2 Al_z2 N (x2+y2+z2=1, x2, z2≦

1, 0<

y2≦

1) formed on said block layer and the ridge of said p-type conductive layer;

a p-type clad layer formed on said Ga_x2 In_y2 Al_z2 N smoothing layer;

a p-type contact layer, formed on said p-type clad layer, having a p-type impurity added thereto;

a p-side electrode formed on said p-type contact layer; and

an n-side electrode electrically connected with said n-type semiconductor layer, wherein said block layer is formed of Ga_x5 In_y5 Al_z5 N (x5+y5+z5=1,0≦

x5, z5≦

1, 0<

y5≦

1).

18. The compound semiconductor light-emitting device according to claim 17, wherein said active layer is a multi-quantum well structure having well layers (x3+y3+z3=1, 0≦

x3, y3, z3≦

1), formed of at least Ga_x3 In_y3 Al_z3 N, and barrier layers, formed Ga_x4 In_y4 Al_z4 N (x4+y4+z4=1, 0≦

x4, y4, z4≦

1), alternatively layered.

19. The compound semiconductor light-emitting device according to claim 17, wherein said p-type contact layer has an alloy layer, made of Pt-semiconductor, selectively formed on its surface, and said p-side electrode has a layered structure made of a Pt layer formed on said alloy layer, a Ti layer containing TiN, thereon, and a Ti layer thereon.

20. A compound semiconductor light-emitting device having a compound semiconductor (Ga_x1 In_y1 Al_z1 N:

x1+y1+z1=1, 0≦

x1, y1, z1≦

1) comprising

an n-type semiconductor layer having at least an n-type clad layer;

an active layer formed on said n-type semiconductor layer;

a p-type semiconductor layer, formed on said active layer, having at least a p-type clad layer;

a smoothing layer of Ga_x2 In_y2 Al_z2 N (x2+y2+z2=1, 0≦

x2, z2≦

1, 0<

y2≦

1) formed in said p-type semiconductive layer;

a p-type contact layer, formed on said p-type semiconductor layer, having a p-type impurity added thereto;

a p-side electrode formed on said p-type contact layer; and

an n-side electrode electrically connected with said n-type semiconductor layer.

21. The compound semiconductor light-emitting device according to claim 20, wherein said active layer is a multi-quantum well structure having well layers (x3+y3+z3=1, 0≦

x3, z3≦

1, 0<

y3≦

1), formed of at least Ga_x3 In_y3 Al_z3 N, and barrier layers, formed Ga_x4 In_y4 Al_z4 N (x4+y4+z4=1, 0≦

x4, z4≦

1,0<

y4≦

1), alternatively layered.

22. The compound semiconductor light-emitting device according to claim 20, wherein said active layer is a multi-quantum well structure having well layers (x3+y3+z3=1, 0<

x3, y3, z3≦

1), formed of at least Ga_x3 In_y3 Al_z3 N, and barrier layers, formed of G_x4 In_y4 Al_z4 N (x4+y4+z4=1, 0≦

x4, y4, z4≦

1) alternatively layered.

23. A compound semiconductor light-emitting device having a compound semiconductor (Ga_x1 In_y1 Al_z1 N:

x1+y1+z1=1, 0≦

x1, y1, z1≦

1) comprising;

an n-type semiconductor layer having at least an n-type clad layer;

an active layer formed on said n-type semiconductor layer;

a p-type semiconductor layer, formed on said active layer, having at least a p-type clad layer;

a smoothing layer of Ga_x2 In_y2 Al_z2 N (x2+y2+z2=1, 0≦

x2, z2≦

1, 0<

y2≦

1) formed in said p-type semiconductor layer;

a p-type contact layer, formed on said p-type semiconductor layer, having a p-type impurity added thereto,

an alloy layer, made of Pt-semiconductor, selectively formed on a surface of said p-type contact layer;

a p-side electrode, containing a layered structure made of a Pt layer formed on said alloy layer, a Ti layer containing TiN, thereon, and a Ti layer thereon; and

an n-side electrode electrically connected with said n-type semiconductor layer.

24. The compound semiconductor light-emitting device according to claim 23, wherein an Au layer is formed on said Ti layer through a second Pt layer.

25. The compound semiconductor light-emitting device according to claim 23, wherein said p-type contact layer contains carbon, and a carbon concentration of a boundary between said Ti layer containing TiN and said Pt layer is higher than a carbon concentration of said p-type contact layer.

26. The compound semiconductor light-emitting device according to claim 23, wherein said p-type contact layer contains carbon and oxygen, and a carbon concentration of a boundary between said Ti layer containing TiN and said Pt layer is higher than a carbon concentration of said p-type contact layer, and an oxygen concentration of said boundary is higher than an oxygen concentration of said p-type contact layer.

27. The compound semiconductor light-emitting device according to claim 23, wherein said p-type contact layer contains hydrogen, and a hydrogen concentration of a boundary between said second Pt layer and said Au layer is higher than a hydrogen concentration of said p-type contact layer.

28. The compound semiconductor light-emitting device according to claim 23, wherein said n-side electrode has as layered structure having the Ti layer and Au layer formed in order.