Wafer polishing device with movable window

• US 6,068,539 A
• Filed: 03/10/1998
• Issued: 05/30/2000
• Est. Priority Date: 03/10/1998
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Lam Research Corporation
• Inventors: Surana, Rahul K., Jew, Stephen C., Pecen, Jiri, Bajaj, Rajeev, Litvak, Herbert E.
• Primary Examiner(s): Rose, Robert A.
• Application Number:
  US09/038,171
• Time in Patent Office: 812 Days
• Field of Search: 451/6, 451/8, 451/41, 451/287, 451/288, 451/527, 451/530, 451/533, 451/921
• US Class Current: 451/6
• CPC Class Codes: B24B 21/04 for grinding plane surfaces
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 49/12 involving optical means
• CPC Class Codes: B24D 7/12 with apertures for inspecting the surface to be abraded

Abstract

A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.

Claims

1. A chemical mechanical polishing element comprising:

a belt comprising a polishing surface, said belt formed in a closed loop; and

a window comprising a first surface and movably disposed within said belt to move between first and second positions, said first surface being closer to said polishing surface in the second position than in the first position.

3. The invention of claim 1 or 2, wherein said first surface is substantially flush with said polishing surface in the second position.

4. The invention of claim 1 or 2, further comprising a flexible diaphragm coupling said window with said belt.

5. The invention of claim 1 or 2, wherein said window comprises a single-piece window.

6. The invention of claim 1 or 2, wherein said window comprises a flat-sheet window.

7. The invention of claim 1 or 2, wherein said window comprises a sliding window.

8. The invention of claim 1 or 2, wherein said window comprises a bellows window.

9. The invention of claim 1 or 2, wherein said window is affixed to said belt.

10. The invention of claim 1 or 2, wherein said window is integral with said belt.

11. The invention of claim 1 or 2, wherein said window is molded in said belt.

33. The invention of claim 1, 2, 16, 17, 18, or 19, wherein said first surface is below a pad cutting surface of a pad conditioner in the first position.

34. The invention of claim 1, 2, 16, 17, 18, or 19, wherein said first surface of said window comprises a slurry-phobic material.

2. In a linear chemical mechanical polisher of the type comprising:

at least two rollers, a belt comprising a polishing surface, said belt mounted to extend between the rollers such that rotation of the rollers drives the belt, and a wafer carrier positioned adjacent the belt to press a wafer into contact with the belt intermediate the rollers, the improvement comprising;

a window comprising a first surface and movably disposed within said belt to move between first and second positions, said first surface being closer to the polishing surface in the second position than in the first position, said window positioned to move intermittently into alignment with the wafer as the belt is driven by the rollers.

12. The invention of claim 2, further comprising a window displacement mechanism operative to move said window from the first to the second position.

13. The invention of claim 2, further comprising a fluid platen operative to move said window from the first to the second position.

14. The invention of claim 2, further comprising a window displacement mechanism operative to move said window from the second to the first position.

15. The invention of claim 2, further comprising an in-situ measuring device coupled with said polisher.

16. A chemical mechanical polishing element comprising:

a rotating platen comprising a polishing surface; and

a window comprising a first surface and movably disposed within said platen to move between first and second positions, said first surface being closer to said polishing surface in the second position than in the first position.

20. The invention of claim 16, 17, 18, or 19, wherein said first surface is substantially flush with said polishing surface in the second position.

21. The invention of claim 16, 17, 18, or 19, further comprising a flexible diaphragm coupling said window with said platen.

22. The invention of claim 16, 17, 18, or 19, wherein said window comprises a single-piece window.

23. The invention of claim 16, 17, 18, or 19, wherein said window comprises a flat-sheet window.

24. The invention of claim 16, 17, 18, or 19, wherein said window comprises a sliding window.

25. The invention of claim 16, 17, 18, or 19, wherein said window comprises a bellows window.

26. The invention of claim 16, 17, 18, or 19, wherein said window is affixed to said platen.

27. The invention of claim 16, 17, 18, or 19, wherein said window is integral with said platen.

28. The invention of claim 16, 17, 18, or 19, wherein said window is molded in said platen.

17. In a chemical mechanical polisher of the type comprising:

a rotating platen comprising a polishing surface, means for moving the platen along a rotating polishing path, and a wafer carrier positioned adjacent the polishing element to press a wafer against the polishing surface during a polishing operation;

the improvement comprising;

a window comprising a first surface and movably disposed within said rotating platen to move between first and second positions, said first surface being closer to said polishing surface in the second position than in the first position, said window positioned to move intermittently into alignment with the wafer during the polishing operation.

29. The invention of claim 17 or 19, further comprising a window displacement mechanism operative to move said window from the first to the second position.

30. The invention of claim 17 or 19, further comprising a fluid platen operative to move said window from the first to the second position.

31. The invention of claim 17 or 19, further comprising a window displacement mechanism operative to move said window from the second to the first position.

32. The invention of claim 17 or 19, further comprising an in-situ measuring device coupled with said polisher.

18. A chemical mechanical polishing element comprising:

an orbital platen comprising a polishing surface; and

a window comprising a first surface and movably disposed within said platen to move between first position and second positions, said first surface being closer to said polishing surface in the second position than in the first position.

19. In a chemical mechanical polisher of the type comprising:

an orbital platen comprising a polishing surface, means for moving the platen along an orbital polishing path, and a wafer carrier positioned adjacent the platen element to press a wafer against the polishing surface during a polishing operation;

the improvement comprising;

a window comprising a first surface and movably disposed within said platen movable between first and second positions, said first surface being closer to said polishing surface in the second position than in the first position, said window positioned to move intermittently into alignment with the wafer during the polishing operation.

35. A method for in-situ monitoring of a wafer while polishing the wafer with a polishing device comprising a polishing surface, said method comprising the steps of:

(a) providing a polishing device comprising a polishing surface and a window, said window movably disposed within said polishing device to move toward and away from said polishing surface;

then

(b) moving said window toward the polishing surface;

then

(c) performing an in-situ measurement of said wafer; and

then

(d) moving said window away from the polishing surface.