Process for forming a semiconductor device
First Claim
1. A process for fabricating a semiconductor device comprising:
- moving a substrate carrier near a port of a semiconductor device manufacturing apparatus, wherein;
the semiconductor device manufacturing apparatus has a first door and a first tray positioned internally; and
the substrate carrier has a shell and a carrier door;
sensing the substrate carrier with the semiconductor device manufacturing apparatus when near but before contacting the semiconductor device manufacturing apparatus, wherein sensing further comprises detecting a substrate carrier with a sensor unit contained within the semiconductor device manufacturing apparatus;
opening an outer door in response to sensing the substrate carrier when near but before contacting the semiconductor device manufacturing apparatus, the outer door positioned at the port of the semiconductor device manufacturing apparatus, the outer door being substantially flush with an outer wall of the semiconductor device manufacturing apparatus when closed;
in response to sensing, extending the first tray into a fabrication environment that lies outside of the semiconductor device manufacturing apparatus;
placing the substrate carrier including the shell onto the first tray while the first tray is extended into the fabrication environment; and
retracting the first tray into the semiconductor device manufacturing apparatus while the substrate carrier including the shell is on the first tray.
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Accused Products
Abstract
A method for forming a semiconductor device in a semiconductor device manufacturing apparatus (20) having a sensor (30) activated extensible shuttle (28). In a fabrication environment shuttle (28) is housed within semiconductor device manufacturing apparatus (20), where an outer door (32) is closed flush with an outer wall of the apparatus (20). As a substrate carrier (38) is moved near the apparatus (20), sensor (30) activates opening of outer door (32) and extension of shuttle (28) out of the apparatus (20) into the fabrication environment. In one embodiment, shuttle (28) has a sensor which is used to determine if carrier (38) is placed on shuttle (28) within a predetermined time, allowing retraction of shuttle (28) until it is required. The present invention increases the available operative space within the fabrication environment, and provides a clean mini-environment within apparatus (20).
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Citations
30 Claims
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1. A process for fabricating a semiconductor device comprising:
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moving a substrate carrier near a port of a semiconductor device manufacturing apparatus, wherein; the semiconductor device manufacturing apparatus has a first door and a first tray positioned internally; and the substrate carrier has a shell and a carrier door; sensing the substrate carrier with the semiconductor device manufacturing apparatus when near but before contacting the semiconductor device manufacturing apparatus, wherein sensing further comprises detecting a substrate carrier with a sensor unit contained within the semiconductor device manufacturing apparatus; opening an outer door in response to sensing the substrate carrier when near but before contacting the semiconductor device manufacturing apparatus, the outer door positioned at the port of the semiconductor device manufacturing apparatus, the outer door being substantially flush with an outer wall of the semiconductor device manufacturing apparatus when closed; in response to sensing, extending the first tray into a fabrication environment that lies outside of the semiconductor device manufacturing apparatus; placing the substrate carrier including the shell onto the first tray while the first tray is extended into the fabrication environment; and retracting the first tray into the semiconductor device manufacturing apparatus while the substrate carrier including the shell is on the first tray. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A process for fabricating a semiconductor device comprising:
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moving a substrate carrier near a port of a semiconductor device manufacturing apparatus, wherein; the semiconductor device manufacturing apparatus has a first door and a first tray positioned internally; and the substrate carrier has a shell and a carrier door; sensing the substrate carrier with the semiconductor device manufacturing apparatus when near but before contacting the semiconductor device manufacturing apparatus, wherein sensing further comprises detecting a substrate carrier with a sensor unit contained within the semiconductor device manufacturing apparatus; opening an outer door in response to sensing the substrate carrier when near but before contacting the semiconductor device manufacturing apparatus, the outer door positioned at the port of the semiconductor device manufacturing apparatus, the outer door being substantially flush with an outer wall of the semiconductor device manufacturing apparatus when closed; in response to sensing, extending the first tray into a fabrication environment that lies outside of the semiconductor device manufacturing apparatus; placing the substrate carrier including the shell onto the first tray while the first tray is extended into the fabrication environment; and retracting the first tray into the semiconductor device manufacturing apparatus while the substrate carrier including the shell is on the first tray. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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Specification