Methods and structures for pad reconfiguration to allow intermediate testing during manufacture of an integrated circuit
First Claim
1. An integrated circuit, the integrated circuit including a first subcircuit which is fully processed at an intermediate stage during the processing of the integrated circuit and a second subcircuit which is partially processed at said intermediate stage, comprising a plurality of intermediate probe pads for transmitting signals from said tester to the subcircuit to test the subcircuit at the intermediate stage of processing.
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Accused Products
Abstract
Methods and structures for pad reconfiguration to allow intermediate testing during the manufacture of an integrated circuit are disclosed. The methods and structures disclosed are particularly useful in testing an embedded subcircuit, such as a memory array within an embedded chip product. A bond pad reconfiguration etch and other means for reconfiguring a bond pad are also disclosed.
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Citations
8 Claims
- 1. An integrated circuit, the integrated circuit including a first subcircuit which is fully processed at an intermediate stage during the processing of the integrated circuit and a second subcircuit which is partially processed at said intermediate stage, comprising a plurality of intermediate probe pads for transmitting signals from said tester to the subcircuit to test the subcircuit at the intermediate stage of processing.
Specification