BGA package using PCB and tape in a die-up configuration
First Claim
1. A die-up BGA package for an integrated-circuit die, comprising:
- a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have circuit-board contact areas at the top surface of the rigid circuit board;
a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon;
an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer;
means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to respective tape-layer contact areas formed on the lower surface of the flexible insulated tape layer;
a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer;
means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas of the electrical conductors at the top surface of the rigid circuit board;
a plurality of solder balls connected to the lower surface of the rigid circuit board and to the conductors formed through the rigid circuit board; and
sealing means for covering and sealing the integrated-circuit die and the bonding wires.
1 Assignment
0 Petitions
Accused Products
Abstract
A die-up configuration includes a rigid circuit board with electrically conductive plated-through holes formed therethrough and an integrated-circuit die mounted to the upper surface of which a flexible insulated tape layer is fixed to the upper surface of a rigid circuit board and which has a number of wire-bonding sites. Conductive vias or plated-through holes are provided for connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the contact areas formed on the lower surface of the flexible insulated tape layer. Conductors are provided for connecting respective contact areas on the lower surface of the flexible insulated tape layer to solder balls on the bottom of the rigid circuit board.
209 Citations
21 Claims
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1. A die-up BGA package for an integrated-circuit die, comprising:
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a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have circuit-board contact areas at the top surface of the rigid circuit board; a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon; an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer; means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to respective tape-layer contact areas formed on the lower surface of the flexible insulated tape layer; a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer; means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas of the electrical conductors at the top surface of the rigid circuit board; a plurality of solder balls connected to the lower surface of the rigid circuit board and to the conductors formed through the rigid circuit board; and sealing means for covering and sealing the integrated-circuit die and the bonding wires. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A die-up BGA package for an integrated-circuit die, comprising:
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a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have a circuit-board contact area at the top surface of the rigid circuit board; a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon; an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer; means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the tape-layer contact areas formed on the lower surface of the flexible insulated tape layer, wherein said means include conductive vias formed through the flexible insulated layer, filled with conductive material, and also connected to conductive traces formed on the upper surface of the flexible insulated tape layer for connection to the wire bonding; a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer; means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board; a plurality of solder balls connected to the lower surface of rigid circuit board and to the conductors formed through the rigid circuit board; and sealing means for covering and sealing the integrated-circuit die, the bonding wires. - View Dependent Claims (13, 14, 15, 16)
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17. A die-up BGA package for an integrated-circuit die, comprising:
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a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have a circuit-board contact area at the top surface of the rigid circuit board; a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon; an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer; means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the tape-layer contact areas formed on the lower surface of the flexible insulated tape layer, wherein said means include plated through holes formed through the flexible insulated layer and connected to conductive traces formed on the upper surface of the flexible insulated tape layer for connection to the wire bonding sites; a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer; means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board; a plurality of solder balls connected to the lower surface of rigid circuit board and to the conductors formed through the rigid circuit board; and sealing means for covering and sealing the integrated-circuit die, the bonding wires. - View Dependent Claims (18, 19, 20, 21)
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Specification