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Apparatus and method for in-line soldering

  • US 6,072,150 A
  • Filed: 01/26/1999
  • Issued: 06/06/2000
  • Est. Priority Date: 05/27/1998
  • Status: Expired due to Fees
First Claim
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1. A method of thermal processing of at least one workpiece location on a workpiece, to produce a processed workpiece, comprising the steps of:

  • (a) providing a calibration piece including at least one calibration location, each said at least one calibration location being representative of a corresponding workpiece location on the processed workpiece;

    (b) generating radiation of a first wavelength;

    (c) for each of said at least one calibration location;

    (i) aiming said radiation of said first wavelength at said each calibration location, and(ii) detecting intensity of radiation of a second wavelength emitted from said each calibration location when said radiation of said first wavelength impinges on said each calibration location;

    (d) generating radiation, of a third wavelength, having an intensity sufficient to effect the thermal processing; and

    (e) for each of the at least one workpiece location;

    (i) aiming said radiation of said third wavelength at said each workpiece location,(ii) detecting intensity of radiation of said second wavelength emitted from said each workpiece location when said radiation of said third wavelength impinges on said each calibration location,(iii) comparing said intensity of said radiation of said second wavelength, emitted from said each workpiece location, with said intensity of said radiation of said second wavelength, emitted from said calibration location representative of said each workpiece location, and(iv) based on said comparing, deciding whether to divert the workpiece for individual processing.

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