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Electrode for plasma processes and method for manufacture and use thereof

  • US 6,073,577 A
  • Filed: 06/30/1998
  • Issued: 06/13/2000
  • Est. Priority Date: 06/30/1998
  • Status: Expired due to Term
First Claim
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1. An electrode assembly useful for a plasma reaction chamber used in semiconductor substrate processing, comprising:

  • a support member having a bonding surface;

    an RF driven electrode having an RF powered surface on one side thereof and a bonding surface at an outer edge on an opposite side thereof engaging the bonding surface of the support member; and

    an elastomeric joint between the outer edge of the electrode and the support member, the elastomeric joint resiliently attaching the electrode to the support member so as to allow movement between the electrode and the support member during temperature cycling thereof.

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