Noncontact IC device

• US 6,073,856 A
• Filed: 09/03/1998
• Issued: 06/13/2000
• Est. Priority Date: 09/05/1997
• Status: Expired due to Fees

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Takahashi, Norio
• Primary Examiner(s): LE, THIEN MINH
• Application Number:
  US09/146,536
• Time in Patent Office: 649 Days
• Field of Search: 235/492, 235/375, 235/486, 235/488
• US Class Current: 235/492
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/07726 the record comprising means for indicating first use, e.g. a frangible layer
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01H 2231/05 Card, e.g. credit card
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0275 Security details, e.g. tampering prevention or detection
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2201/0909 Preformed cutting or breaking line
• CPC Class Codes: H05K 2201/09127 PCB or component having an integral separable or breakable part
• CPC Class Codes: H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing programmable, customizable or modifiable circuits H05K1/0286
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/4084 by deforming at least one of the conductive layers

Abstract

A noncontact IC card is provided with an antenna coil, an IC chip and a short-circuiting circuit formed on a base card. The noncontact IC card is kept inoperative unless the short-circuiting circuit is opened and the noncontact IC card is rendered operative when the short-circuiting circuit is opened. The short-circuiting circuit is formed to extend across a main part and a removable identification part included in the base card. The short-circuiting circuit can be opened by removing the identification part from the base card.

Claims

1. A noncontact IC device comprising:

a base card;

an IC chip mounted on the base card;

an antenna coil formed on the base card and connected to the IC chip; and

a short-circuiting circuit capable of disabling the IC chip for operation when closed and of enabling the IC chip to operate when opened, and

the base card has a main part, a removable identification part, and a breaking Part provided with folding grooves and connecting the main part and the identification part, the IC chip and the antenna coil are placed in the main part, and a part of the short-circuiting circuit is formed in the identification part.

2. The noncontact IC device according to claim 1, wherein

the IC chip and the antenna coil are sealed integrally in a resin.

3. The noncontact IC device according to claim 1, wherein

the short-circuiting circuit has an open circuit between a pair of conductive lines, and a connecting part disposed between the pair of conductive lines of the open circuit, said contacting part being capable of closing the open circuit.

4. The noncontact IC device according to claim 3, wherein

the connecting part of the short-circuiting circuit is formed of a solder paste having electrical resistance which can be reduced when the solder paste is melted and then solidified.

5. The noncontact IC device according to claim 4, wherein

the solder paste comprises a flux and a solder powder in the flux.

6. The noncontact IC device according to claim 3, wherein

the connecting part is a press connecting part separated from open circuit and can be connected to the open circuit when pressed into contact with the pair of conductive lines.

7. The noncontact IC device according to claim 3, wherein

the base card has a main part, a removable identification part, and a breaking part provided with folding grooves and connecting the main part and the identification part, the IC chip and the antenna coil are located in the main part, and a part of the short-circuiting circuit is formed in the identification part.

8. The noncontact IC device according to claim 7, wherein

the connecting part is formed in the identification part.

9. The noncontact IC device according to claim 1, wherein

the short-circuiting circuit comprises a solder paste having electrical resistance which is reduced when the solder paste is melted and then solidified.

10. The noncontact IC device according to claim 9, wherein

the base card has a main part, a removable identification part, and a breaking part provided with folding grooves and connecting the main part and the identification part, the IC chip and the antenna coil are located in the main part, and a part of the short-circuiting circuit is formed in the identification part.

11. The noncontact IC device according to claim 1, wherein

a part of the short-circuiting circuit is located on a surface of the base card.

12. The noncontact IC device according to claim 1, wherein

the short-circuiting circuit comprises a volatile material which can be cut with a laser beam.

13. A noncontact IC device comprising:

a base card;

an IC chip mounted on the base card;

an antenna coil formed on the base card and connected to the IC chip; and

a short-circuiting circuit capable of disabling the IC chip for operation when closed and of enabling the IC chip to operate when opened, and

the short-circuiting circuit has an open circuit between a pair of conductive lines, and a connecting part disposed between the pair of conductive lines of the open circuit, said connecting part being capable of closing the open circuit.

14. The noncontact IC device according to claim 13, wherein

the base card has a main part, a removable identification part, an a breaking part provided with folding grooves and connecting the main part and the identification part, the IC chip and the antenna coil are placed in the main part, and a part of the short-circuiting circuit is formed in the identification part.

15. The noncontact IC device according to claim 13, wherein

the IC chip and the antenna coil are sealed integrally in a resin.

16. The noncontact IC device according to claim 13, wherein

the connecting part of the short-circuiting circuit is formed of a solder paste having electrical resistance which is reduced when the solder paste is melted and then solidified.

17. The noncontact IC device according to claim 16, wherein

the solder paste comprises a flux and a solder powder in the flux.

18. The noncontact IC device according to claim 13, wherein

the connecting part is a press connecting part separated from the open circuit and can be connected to the open circuit when pressed into contact with the pair of conductive lines.

19. The noncontact IC device according to claim 13, wherein

the base card has a main part, a removable identification part, and a breaking part provided with folding grooves and connecting the main part and the identification part, the IC chip and the antenna coil are located in the main part, and a part of the short-circuiting circuit is formed in the identification part.

20. The noncontact IC device according to claim 19, wherein

the connecting part is formed in the identification part.

21. The noncontact IC device according to claim 13, wherein

the short-circuiting circuit comprises a solder paste having electrical resistance which is reduced when the solder paste is melted and then solidified.

22. The noncontact IC device according to claim 21, wherein

the base card has a main part, a removable identification part, and a breaking part provided with folding grooves and connecting the main part and the identification part, the IC chip and the antenna coil are located in the main part, and a part of the short-circuiting circuit is formed in the identification part.

23. The noncontact IC device according to claim 13, wherein

a part of the short-circuiting circuit is located on a surface of the base card.

24. The noncontact IC device according to claim 13, wherein

the short-circuiting circuit comprises a volatile material which can be cut with a laser beam.

25. An IC device for transmitting signals to and receiving signals from an external device, which comprises:

a base member,

said base supporting communications means and a short-circuiting circuit,

said communications means for transmitting signals to and receiving signals from an external device,

said communications means including an IC chip for controlling transmitted signals and received signals, and

said short-circuiting circuit for disabling said IC chip when said short-circuiting circuit is closed.

26. The IC device of claim 25, wherein said short-circuiting circuit is removable from the remainder of the IC device, whereby the remainder of the IC device is then able to communicate because the short-circuiting circuit is open.

27. The device of claim 26, wherein said removable part of said short-circuiting circuit from the remainder of the IC device is defined by grooves formed in said base.

28. The device of claim 25, wherein the IC device is in card form.

29. The device of claim 25, wherein the device is capable of transmitting signals to and receiving signals from an external deice without being in physical contact therewith.

30. The device of claim 29, wherein said communication means includes an antenna.

31. The device of claim 30, wherein said antenna and said IC chip form an IC module.

32. The device of claim 25, wherein said base member comprises a middle sheet, an upper sheet, and a lower sheet, whereby said communications means and short-circuiting circuit are formed on the middle sheet so that said IC chip and said communications means are concealed by said upper sheet and said lower sheet.

33. The device of claim 25, further comprising:

a connecting part, formed in a part of said short-circuiting circuit, being in a nonconductive initial state and capable of being set in a conductive state so that said short-circuiting circuit is closed.

34. The device of claim 33, wherein aid connecting part has high resistance sufficient to keep said short-circuiting circuit in a nonconductive state.

35. The device of claim 34, wherein said high resistance part is a solder paste.

36. The device of claim 35, wherein said solder paste forms all the wiring lines of said short-circuit circuit.

37. The device of claim 33, wherein said connecting part is isolated spatially so that said short-circuiting circuit is open as an initial state, and said short-circuit circuit becomes closed when said connecting part is pressed into an opening in the wiring line of the short-circuiting circuit.

38. An IC card for transmitting signals to and receiving signals from an external device, which comprises:

a base member,

said base supporting communications means and a short-circuiting circuit and configured in card form,

said communications means for transmitting signals to and receiving signals from an external device without physical contact,

said communications means including an IC chip for controlling transmitted signals and received signals,

said short-circuiting circuit for disabling said IC chip when said short-circuiting circuit is closed, and

said short-circuiting circuit being removable from the remainder of the IC device, whereby the remainder of the IC device is then able to communicate because the short-circuiting circuit is open.

39. An IC card of claim 38 wherein:

said base comprises a middle sheet, an upper sheet, and a lower sheet, and

said communications mean and short-circuiting circuit are formed on the middle sheet so that said communications means and said short-circuiting circuit are concealed by said upper sheet and said lower sheet.

40. An IC card for transmitting signals to and receiving signals from an external device, which comprises:

a base member,

said base supporting communications means and a short-circuiting circuit and having a configuration of a card form, said communications means for transmitting signals to and receiving signals from an external device without physical contact,

said communications means including an IC chip for controlling transmitted signals and received signals,

said short-circuiting circuit for disabling said IC chip when said short-circuiting circuit is closed,

a connecting part, formed in a part of said short-circuiting circuit, being in a nonconductive initial state and capable of being set in a conductive state so that said short-circuiting circuit is closed,

and said short-circuiting circuit being removable from the remainder of the IC device, whereby the remainder of the IC device is then able to communicate because the short-circuiting circuit is open.

41. An IC card of claim 40 wherein:

said base comprises a middle sheet, an upper sheet, and a lower sheet, and

said communications mean and short-circuiting circuit are formed on the middle sheet so that said communications means and said short-circuiting circuit are concealed by said upper sheet and said lower sheet.