High selectivity etch using an external plasma discharge

• US 6,074,514 A
• Filed: 02/09/1998
• Issued: 06/13/2000
• Est. Priority Date: 02/09/1998
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Welch, Michael, Bjorkman, Claes, Shan, Hongching
• Primary Examiner(s): Nuzzolillo, Maria
• Assistant Examiner(s): Martin, Angela J.
• Application Number:
  US09/020,959
• Time in Patent Office: 855 Days
• Field of Search: 156/345 P, 156/345 MW, 156/345 C, 156/345 PC, 156/345 MC
• US Class Current: 156/345.35
• CPC Class Codes: H01J 37/32871 Means for trapping or directing unwanted particles

Abstract

An apparatus and method for scavenging etchant species from a plasma formed of etchant gas prior to the etchant gas entering a primary processing chamber of a plasma reactor. There is at least one scavenging chamber, each of which is connected at an inlet thereof to an etchant gas source and at an outlet thereof to a gas distribution device of the primary processing chamber. Each scavenging chamber has a radiation applicator that irradiates the interior of the scavenging chamber and creates a plasma therein from etchant gas flowing through the chamber from the etchant gas source to the gas distribution apparatus of the primary processing chamber. The applicator uses either an inductive discharge, capacitive discharge, direct current (DC) discharge or microwave discharge to irradiate the interior of the scavenging chamber and ignite the plasma. An etchant species scavenging source is also disposed within the scavenging chamber. This source provides scavenging material that interacts with the plasma to scavenge etchant species created by the dissociation of the etchant gas in the plasma and form etch by-products comprised of substances from both the etchant species and the scavenging source. The scavenging chambers can be employed, as is or in a modified form, as excitation chambers to excite gases at optimal conditions and feed the modified gases into the primary chamber. The scavenging chamber is modified by removing its scavenging source if this source would adversely interact with the gas being excited.

Claims

1. A plasma reactor, comprising:

a primary processing chamber having a workpiece supporter for holding a workpiece inside and a gas distribution apparatus capable of introducing a processing gas, which includes an etchant gas, into the primary processing chamber; and

a scavenging chamber connected at an inlet thereof to an etchant gas source and connected at an outlet thereof to the gas distribution device of the primary processing chamber, said scavenging chamber comprising,

a radiation applicator capable of irradiating the interior of the scavenging chamber and creating a plasma from etchant gas flowing through the scavenging chamber from the etchant gas source to the gas distribution apparatus of the primary processing chamber,

an etchant species scavenging source disposed within the scavenging chamber and capable of interacting with the plasma to scavenge etchant species created by the dissociation of the etchant gas in the plasma and forming etch by-products comprised of substances from both the etchant species and the scavenging source.

2. The reactor of claim 1, wherein the radiation applicator uses one of (i) an inductive discharge, (ii) a capacitive discharge, (iii) a direct current (DC) discharge or (iv) a microwave discharge to irradiate the interior of the scavenging chamber and create the plasma therein.

3. The reactor of claim 1, wherein the etchant species scavenging source comprises a solid scavenging material and is as small as possible while still being capable of scavenging sufficient etchant species to create a desired concentration of etchant species and etchant by-products in a plasma formed within the primary processing chamber.

4. The reactor of claim 1, wherein the scavenging chamber further comprises a removable lid covering an access opening thereof, and wherein the etchant species scavenging source comprises a solid scavenging material and is sized so as to facilitate its being installed into or removed from the chamber through the access opening.

5. The reactor of claim 1, wherein the etchant species scavenging source comprises a solid scavenging material, and wherein the scavenging chamber further comprises a temperature control apparatus capable of controlling the temperature of the etchant species scavenging source so as to assist in ensuring the source is capable of scavenging sufficient etchant species to create a desired concentration of etchant species and etchant by-products in the plasma formed within the primary processing chamber.

6. The reactor of claim 1, wherein the workpiece includes a target material and the etchant species scavenging source comprises a scavenging material that scavenges the type of etchant species from the plasma formed within the scavenging chamber and produces the type of etch by-products that result in a lowering of the etch rate of the target material whenever the workpiece undergoes a plasma-assisted etching process in the primary processing chamber of the reactor.

7. The reactor of claim 2, wherein the radiation applicator comprising a coil antenna capable of radiating RF energy into the scavenging chamber by inductive coupling, thereby using an inductive discharge to create a plasma therein, said coil antenna being wound around the exterior of the scavenging chamber so as to surround a plasma generating region within the chamber.

8. The reactor of claim 7, wherein the etchant species scavenging source comprises a hollow liner comprised of a scavenging material, said liner being disposed adjacent to the inner walls of the scavenging chamber and surrounding the plasma generating region.

9. The reactor of claim 8, wherein the liner has an interior facing surface that interacts with a plasma formed in the scavenging chamber, said liner being sized so that its interior facing surface is just large enough, given a particular RF power input into the coil antenna and a particular flow rate of etchant gas through the scavenging chamber, to result in the scavenging of sufficient etchant species to create a desired concentration of etchant species and etchant by-products in the plasma.

10. The reactor of claim 8, wherein the liner comprises an electrically conductive material, and wherein said liner has a plurality of slots formed through its walls and spaced periodically around the circumference of the liner, the number and size of the slots being sufficient to ensure enough RF energy is transmittable into the plasma generating region of the scavenging chamber to ignite and maintain a plasma therein.

11. The reactor of claim 2, wherein the radiation applicator comprising a pair of electrodes capable of irradiating the interior of the scavenging chamber to create a plasma therein, said pair of electrodes facing each other across a plasma generating region of the chamber.

12. The reactor of claim 11, wherein the pair of electrodes are disposed inside the walls of scavenging chamber and are comprised of a scavenging material so as to collectively comprise the etchant species scavenging source of the chamber, and wherein said pair of electrodes are connected to a RF power source and capable of radiating RF energy into the scavenging chamber by capacitive coupling, thereby using a capacitive discharge to create the plasma within the scavenging chamber.

13. The reactor of claim 11, wherein the pair of electrodes are disposed inside the walls of scavenging chamber and are comprised of an electrically conductive scavenging material so as to collectively comprise the etchant species scavenging source of the chamber, and wherein said pair of electrodes are connected to a DC power source and capable of coupling energy into the scavenging chamber, thereby using a DC discharge to create the plasma within the scavenging chamber.

14. The reactor of claim 11, wherein the pair of electrodes are disposed outside the walls of scavenging chamber and the etchant species scavenging source comprises a hollow liner comprised of a dielectric or semiconductor scavenging material, said liner being disposed adjacent to the inner walls of the scavenging chamber and surrounding the plasma generating region.

15. The reactor of claim 14, wherein the liner has an interior facing surface that interacts with a plasma formed in the scavenging chamber, said liner being sized so that its interior facing surface is just large enough, given a particular RF power input into the pair of electrodes and a particular flow rate of etchant gas through the scavenging chamber, to result in the scavenging of sufficient etchant species to create a desired concentration of etchant species and etchant by-products in the plasma.

16. The reactor of claim 2, wherein the scavenging chamber further comprises an applicator tube through which the etchant gas flows on its way from the etchant gas source to the gas distribution apparatus of the primary processing chamber, and wherein the radiation applicator comprising a microwave source capable of irradiating the interior of an applicator tube, thereby using a microwave discharge to create a plasma therein.

17. The reactor of claim 16, wherein the etchant species scavenging source comprises a hollow liner comprised of a scavenging material, said liner being disposed between an outlet of the application tube and the outlet of the scavenging chamber such that the plasma formed of the etchant gas in the application tube exits the tube and passes through the liner on its way to the primary processing chamber.

18. The reactor of claim 17, wherein the liner has an interior facing surface that interacts with the plasma formed in the application tube, said liner being sized so that its interior facing surface is just large enough, given a particular power input into the microwave source and a particular flow rate of etchant gas through the liner, to result in the scavenging of sufficient etchant species to create a desired concentration of etchant species and etchant by-products in the plasma.

19. The reactor of claim 17, wherein the liner is located at a distance away from the applicator tube such that, given a particular power input into the microwave source and a particular flow rate of etchant gas through the liner, the scavenging of etchant species does not exceed a desired concentration thereof.

20. The reactor of claim 1, wherein the etchant species scavenging source comprises a gaseous scavenging material introduced into the scavenging chamber in a sufficient quantity to create a desired concentration of etchant species and etchant by-products in a plasma formed within the primary processing chamber.

21. The reactor of claim 1, further comprising at least one additional scavenging chamber, each additional scavenging chamber being connected at an inlet thereof to one of (i) the etchant gas source associated with the first scavenging chamber or (ii) a different etchant gas source, and connected at an outlet thereof to the gas distribution device of the primary processing chamber, each of said additional scavenging chambers comprising,

a radiation applicator capable of irradiating the interior of the additional scavenging chamber and creating a plasma from etchant gas flowing through the additional scavenging chamber to the gas distribution apparatus of the primary processing chamber,

an etchant species scavenging source disposed within the additional scavenging chamber and capable of interacting with the plasma to scavenge etchant species created by the dissociation of the etchant gas in the plasma and forming etch by-products comprised of substances from both the etchant species and the scavenging source.

22. The reactor of claim 1, further comprising an excitation chamber, each excitation chamber being connected at an inlet thereof to a gas source containing gases making up a part of the processing gas employed in the primary processing chamber and connected at an outlet thereof to the gas distribution device of the primary processing chamber, the excitation chamber comprising,

a radiation applicator capable of irradiating the interior of the excitation chamber and creating a plasma from gas flowing through the excitation chamber to the gas distribution apparatus of the primary processing chamber.