Method for producing semiconductor device

• US 6,074,900 A
• Filed: 02/25/1997
• Issued: 06/13/2000
• Est. Priority Date: 11/11/1994
• Status: Expired due to Term

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Takemura, Yasuhiko, Yamazaki, Shunpei
• Primary Examiner(s): Booth, Richard
• Application Number:
  US08/805,937
• Time in Patent Office: 1,204 Days
• Field of Search: 438/151, 438/308, 438/592, 438/302, 438/525, 438/164
• US Class Current: 438/164
• CPC Class Codes: H01L 29/458 for thin film silicon, e.g. source or drain electrode
• CPC Class Codes: H01L 29/66757 Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate

Abstract

In producing a top gate type or a bottom gate type thin film transistor (TFT), after a metal film for forming silicide is formed on a semiconductor active layer provided on an insulating surface, an N-type or P-type impurity ion is introduced into the semiconductor active layer using an anodizable gate electrode and an anodic oxide formed on the surface of the gate electrode as masks. The exposing portion of the semiconductor active layer is reacted with the metal film, so that a silicide layer is formed in the portion. Then, non-reacted portion of the metal film is removed.

Claims

1. A method for producing a semiconductor device comprising the steps of:

forming a semiconductor island on an insulating surface;

selectively forming a gate insulating film on said semiconductor island;

selectively forming a gate electrode portion on said gate insulating film;

selectively removing portions of said gate insulating film until a width of said gate insulating film is the same as a width of said gate electrode;

forming a metal film which covers the semiconductor island, the gate insulating film and the gate electrode portion;

selectively introducing an N-type or P-type impurity element into the semiconductor island through the metal film in a slanting direction with respect to a major surface of said insulating surface, wherein said gate insulating film with edges of said gate electrode portion to define a width of a source and drain region in said semiconductor island;

selectively reacting the metal film with the semiconductor island to selectively form a silicide region in the semiconductor island;

removing a portion of the metal film that has not reacted in the reacting step,

wherein said slanting direction is an angle of 30°

or more with respect to the major surface of the insulating surface.

2. A method according to claim 1 further comprising the step of irradiating laser or intense light corresponding to the intensity of a laser after the reacting step.

3. A method according to claim 1 wherein the reacting step is performed by thermal annealing at 300 to 500°

C.

10. A method according to claim 1 wherein said gate electrode portion includes a gate electrode and an anodic oxide film thereof.

13. A method according to claim 1 wherein said gate electrode portion, comprises a gate electrode and an anodic oxide film formed thereon.

4. A method for producing a semiconductor device comprising the steps of:

forming a semiconductor active layer on an insulating surface;

selectively forming an insulating film on said semiconductor active layer;

selectively forming a gate electrode portion on said insulating film;

forming a metal film which covers the semiconductor active layer and the gate electrode portion;

selectively reacting the metal film with the semiconductor active layer to selectively form a silicide region in the semiconductor active layer;

removing a portion of the metal film that has not reacted in the reacting step; and

selectively introducing an N-type or P-type impurity element into the semiconductor active layer in a slanting direction with respect to a major surface of said insulating surface,

wherein the metal film forming step is performed before the reacting step and the introducing step, and the reacting step is performed before the removing step,

wherein edges of said insulating film are aligned with edges of said gate electrode portion,

wherein said gate electrode portion acts as a mask defining a width of a source and drain region in said semiconductor active layer,

wherein said slanting direction is an angle of 30°

or more with respect to the major surface of the insulating surface.

5. A method according to claim 4 further comprising the step of irradiating laser or intense light corresponding to the intensity of a laser after the reacting step.

6. A method according to claim 4 wherein the reacting step is performed by thermal annealing at 300 to 500°

C.

7. A method for producing a semiconductor device comprising the steps of:

forming a semiconductor island on an insulating surface;

forming a gate insulating film on the semiconductor island, said gate insulating film covering a part of the semiconductor island while the other part of the semiconductor island is exposed;

forming a gate electrode portion on the gate insulating film;

forming a metal film in contact with the other part of the semiconductor island;

introducing an impurity element at a first concentration into the semiconductor island in a slanting direction with respect to a major surface of said insulating surface by using the gate electrode portion and the gate insulating film as masks, so that at least a pair of first impurity portions is formed extending below at least a part of the gate insulating film;

introducing said impurity at a second concentration higher than the first concentration into the semiconductor island after said impurity induction being conducted in a vertical direction with respect to the major surface of said insulating surface so that a pair of second impurity portions is formed in the semiconductor island, wherein edges between each of first and second portions are aligned with edges of the gate electrode portion;

selectively reacting the metal film with the other part of the semiconductor island to selectively form a silicide region in the other part of the semiconductor island; and

removing a portion of the metal film that has not reacted in the reacting step,

wherein edges of said gate insulating film are aligned with edges of said gate electrode portion,

wherein said gate electrode portion acts as a mask defining a width of a source and drain region in said semiconductor island,

wherein said slanting direction is an angle of 30°

or more with respect to the major surface of the insulating surface.

8. The method of claim 7 further comprising the step of irradiating laser or intense light corresponding to the intensity of a laser after the reacting step.

9. The method of claim 8 wherein the reacting step is performed by thermal annealing at 300 to 500°

C.

11. A method according to claim 7 wherein said semiconductor island is non-single crystalline.

12. A method according to claim 7 wherein each of the pair of said impurity regions in said semiconductor island has a same width from an edge of the gate electrode.

14. A method according to claim 7 wherein said gate electrode portion comprises a gate electrode and an anodic oxide film formed thereon.

15. A method for producing a semiconductor device comprising the steps of:

forming a semiconductor island on an insulating surface;

selectively forming a gate insulating film on said semiconductor island;

selectively forming a gate electrode portion on said gate insulating film;

forming a metal film which covers the semiconductor island, the gate insulating film and the gate electrode portion;

selectively introducing an N-type or P-type impurity element into the semiconductor island through the metal film in a slanting direction with respect to a major surface of said insulating surface;

selectively reacting the metal film with the semiconductor island to selectively form a silicide region in the semiconductor island;

removing a portion of the metal film that has not reacted in the reacting step,

wherein said slanting direction is an angle of 30°

or more with respect to the major surface of the insulating surface.

16. A method for producing a semiconductor device comprising the steps of:

forming a semiconductor active layer on an insulating surface;

selectively forming an insulating film on said semiconductor active layer;

selectively forming a gate electrode portion on said insulating film;

forming a metal film which covers the semiconductor active layer and the gate electrode portion;

selectively reacting the metal film with the semiconductor active layer to selectively form a silicide region in the semiconductor active layer;

removing a portion of the metal film that has not reacted in the reacting step; and

selectively introducing an N-type or P-type impurity element into the semiconductor active layer in a slanting direction with respect to a major surface of said insulating surface,

wherein the metal film forming step is performed before the reacting step and the introducing step, and the reacting step is performed before the removing step,

wherein edges of said insulating film are aligned with edges of said gate electrode portion,

wherein said slanting direction is an angle of 30°

or more with respect to the major surface of the insulating surface.

17. A method for producing a semiconductor device comprising the steps of:

forming a semiconductor island on an insulating surface;

forming a gate insulating film on the semiconductor island, said gate insulating film covering a part of the semiconductor island while the other part of the semiconductor island is exposed;

forming a gate electrode portion on the gate insulating film;

forming a metal film in contact with the other part of the semiconductor island;

introducing an impurity element at a first concentration into the semiconductor island in a slanting direction with respect to a major surface of said insulating surface by using the gate electrode portion and the gate insulating film as masks, so that at least a pair of first impurity portions is formed extending below at least a part of the gate insulating film;

introducing said impurity at a second concentration higher than the first concentration into the semiconductor island after said impurity induction being conducted in a vertical direction with respect to the major surface of said insulating surface so that a pair of second impurity portions is formed in the semiconductor island, wherein edges between each of first and second portions are aligned with edges of the gate electrode portion;

selectively reacting the metal film with the other part of the semiconductor island to selectively form a silicide region in the other part of the semiconductor island; and

removing a portion of the metal film that has not reacted in the reacting step,

wherein edges of said gate insulating film are aligned with edges of said gate electrode portion,

wherein said slanting direction is an angle of 30°

or more with respect to the major surface of the insulating surface.