Method for forming electrical isolation for semiconductor devices
First Claim
1. A method for forming electrically isolated semiconductor devices in a silicon body, comprising:
- forming a trench in a selected region of the body;
depositing a barrier material over sidewalls of the trench;
removing portions of the barrier material from a first sidewall portion of the trench to expose such first sidewall portion of the trench while leaving portions of such barrier material on a second sidewall portion of the trench to form a barrier layer thereon;
depositing a dielectric material in the trench, a portion of dielectric material being deposited on the exposed first sidewall portion of the trench and another portion of such deposited dielectric material being deposited on the barrier material;
annealing the dielectric material in an oxidizing environment to densify such deposited dielectric material, the barrier layer inhibiting oxidation of the said second sidewall portion of the trench; and
forming a plurality of the semiconductor devices in the silicon body with such devices being electrically isolated by the dielectric material in the trench.
8 Assignments
0 Petitions
Accused Products
Abstract
A method for forming a electrically isolated semiconductor devices in a silicon body. A trench is formed in a selected region of the body. A barrier material is deposited over sidewalls of the trench. Portions of the barrier material are removed from a first sidewall portion of the trench to expose such first sidewall portion of the trench while leaving portions of such barrier material on a second sidewall portion of the trench to form a barrier layer thereon. A dielectric material is deposited in the trench, a portion of dielectric material being deposited on the exposed first sidewall portion of the trench and another portion of such deposited dielectric material being deposited on the barrier material. The dielectric material is annealed in an oxidizing environment to densify such deposited dielectric material, the barrier layer inhibiting oxidation of the said second sidewall portion of the trench. A plurality of the semiconductor devices is formed in the silicon body with such devices being electrically isolated by the dielectric material in the trench.
15 Citations
11 Claims
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1. A method for forming electrically isolated semiconductor devices in a silicon body, comprising:
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forming a trench in a selected region of the body; depositing a barrier material over sidewalls of the trench; removing portions of the barrier material from a first sidewall portion of the trench to expose such first sidewall portion of the trench while leaving portions of such barrier material on a second sidewall portion of the trench to form a barrier layer thereon; depositing a dielectric material in the trench, a portion of dielectric material being deposited on the exposed first sidewall portion of the trench and another portion of such deposited dielectric material being deposited on the barrier material; annealing the dielectric material in an oxidizing environment to densify such deposited dielectric material, the barrier layer inhibiting oxidation of the said second sidewall portion of the trench; and forming a plurality of the semiconductor devices in the silicon body with such devices being electrically isolated by the dielectric material in the trench. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification