Process for improving uniform thickness of semiconductor substrates using plasma assisted chemical etching

• US 6,074,947 A
• Filed: 07/10/1998
• Issued: 06/13/2000
• Est. Priority Date: 07/10/1998
• Status: Expired due to Fees

• Current Assignee: Plasmasil LLC
• Original Assignee: Plasmasil LLC
• Inventors: Mumola, Peter B.
• Primary Examiner(s): Utech, Benjamin L.
• Assistant Examiner(s): CHEN, KIN CHAN
• Application Number:
  US09/113,274
• Time in Patent Office: 704 Days
• Field of Search: 438/689, 438/690, 438/691, 438/692, 438/695, 438/697, 438/704, 438/706, 156/345
• US Class Current: 438/689
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/32136 using plasmas
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

A process for improving the uniformity of the thickness of a semiconductor substrate utilizing plasma assisted chemical etching is disclosed. The process includes measuring the thickness of a semiconductor substrate at discrete points on the front surface, computing a dwell time versus position map based on the measured thickness data, mathematically inverting the position map to allow material to be removed from the back surface, and selectively removing material from the back surface of the substrate by plasma assisted chemical etching to improve the thickness uniformity of the substrate.

Claims

1. A process for improving the uniformity of the thickness of a semiconductor substrate having a front surface and a back surface using plasma assisted chemical etching, the process comprising:

measuring the thickness of the substrate at discrete positions on the front surface of the substrate using the back surface as a reference surface;

processing the thickness measurements and computing a dwell time versus position map for the front surface of the substrate to determine the length of time a plasma electrode must etch the surface;

inverting mathematically the dwell time versus position map and;

removing material selectively from the back surface of the substrate based on the inverted dwell time versus position map by plasma assisted chemical etching to improve the uniformity of the thickness of the substrate.

2. The process as set forth in claim 1 wherein between about 1 and about 5 micrometers of material is removed from the back surface.

3. The process as set forth in claim 1 wherein the substrate is a silicon wafer.

4. A process for improving the uniformity of the thickness of a semiconductor substrate having a front surface and a back surface using plasma assisted chemical etching, the process comprising:

polishing the front surface of the substrate to remove between about 20 and about 30 micrometers of material from the front surface;

measuring the thickness of the polished substrate at discrete positions on the front surface of the substrate using the back surface as a reference surface;

processing the thickness measurements and computing a dwell time versus position map for the front surface of the polished substrate to determine the length of time a plasma electrode must etch the surface;

inverting mathematically the dwell time versus position map;

removing material selectively from the back surface of the polished substrate based on the inverted dwell time versus position map by plasma assisted chemical etching to improve the uniformity of the thickness of the substrate; and

re-polishing the front surface of the polished substrate to remove between about 100 and about 5000 angstroms of material from the front surface.

5. The process as set forth in claim 4 wherein between about 1 and about 5 micrometers of material is removed from the back surface.

6. The process as set forth in claim 4 wherein the substrate has a total thickness variation of no more than about 0.3 micrometers after the second polishing step.

7. The process as set forth in claim 4 wherein the substrate has a total thickness variation of about 0.1 micrometers after the second polishing step.

8. The process as set forth in claim 4 wherein about 500 angstroms of material is removed from the front surface of the substrate in the second polishing step.

9. The process as set forth in claim 4 wherein the substrate is a silicon wafer.

10. A process for reducing the non-uniformity of a semiconductor substrate having a front surface and a back surface by about 90% using plasma assisted chemical etching, the process comprising:

polishing the front surface of the substrate to remove between about 20 and about 30 micrometers of material from the front surface;

measuring the thickness of the polished substrate at discrete positions on the front surface of the substrate using the back surface as a reference surface;

processing the thickness measurements and computing a dwell time versus position map for the front surface of the polished substrate to determine the length of time a plasma electrode must etch the surface;

inverting mathematically the dwell time versus position map;

removing material selectively from the back surface of the polished substrate based on the inverted dwell time versus position map by plasma assisted chemical etching to improve the uniformity of the thickness of the substrate; and

re-polishing the front surface of the polished substrate to remove between about 100 and about 5000 angstroms of material from the front surface.

11. The process as set forth in claim 10 wherein the substrate is a silicon wafer.