Vapor phase etching of oxide masked by resist or masking material

• US 6,074,951 A
• Filed: 05/29/1997
• Issued: 06/13/2000
• Est. Priority Date: 05/29/1997
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Natzle, Wesley C., Kleinhenz, Richard L., Yu, Chienfan
• Primary Examiner(s): Utech, Benjamin L.
• Assistant Examiner(s): Deo, Duy-Vu
• Application Number:
  US08/865,260
• Time in Patent Office: 1,111 Days
• Field of Search: 438/701, 438/706, 438/713, 438/707, 438/710, 438/712, 438/723, 438/743, 438/725
• US Class Current: 438/701
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: H01L 21/76804 by forming tapered via holes

Abstract

Hydrogen fluoride undercut of oxide layers may be reduced by using a low pressure mixture of gaseous hydrogen fluoride and gaseous ammonia mixture. Organic photoresists can be used as a masking material when using the gaseous hydrogen fluoride/ammonia mixture without resulting in an enhanced reaction rate. In addition, because of the reaction conditions, the dimensions in the oxide layer being etched can be specifically sized smaller than openings made in the overcoating masking material.

Claims

1. A method of patterning oxide for an integrated circuit, comprising the steps of:

depositing an organic photoresist on an oxide layer to be patterned, the oxide layer being positioned on a substrate;

photolithographically patterning an opening in the organic photoresist to form first and second edges which define an exposed portion of the oxide layer;

etching the exposed portion of the oxide layer with neutral molecules from a gaseous hydrogen fluoride/ammonia mixture while simultaneously preserving the organic photoresist such that the organic photoresist at the opening remains in substantial contact with the oxide layer subsequent to said etching;

producing a reaction product from said etching step, the reaction product being a solid that occupies more volume than the etched oxide, wherein the organic photoresist forces the reaction product from under the edges of the organic photoresist into the exposed portion of the oxide layer, thereby slowing the etching near the edge; and

removing the reaction product formed in said etching step.

2. The method of claim 1 wherein said removing step is performed by heating said reaction product to at least 100°

C.

3. The method of claim 1 wherein said etching step is performed in an etch chamber operating under the conditions of a total pressure of less than 30 mTorr.

4. The method of claim 3 wherein said total pressure is approximately 7 mTorr.

5. The method according to claim 1, wherein said etching step produces a lateral dimension of said photoresist not in contact with said oxide that is smaller than a thickness of said oxide.

6. The method according to claim 1, wherein said reaction product solid includes silicon from said etched oxide.

12. The method according to claim 5, wherein said reaction product solid includes silicon from said etched oxide.

7. A method of patterning oxide for an integrated circuit, comprising the steps of:

positioning a mask on an oxide layer to be patterned, the oxide layer being positioned on a substrate, the mask having first and second edges which define a first opening of a first dimension which forms an exposed portion of the oxide layer;

etching the exposed portion of the oxide layer with neutral molecules from a gaseous hydrogen fluoride/ammonia mixture while simultaneously preserving the mask such that the mask at the first opening remains in substantial contact with the oxide layer subsequent to said etching;

producing a reaction product from said etching step, the reaction product being a solid that occupies more volume than the etched oxide, wherein the mask forces the reaction product from under the edges of the mask and into the exposed portion of the oxide layer, thereby slowing said etching near the edge; and

removing the reaction product formed in said etching step, said etching and removing steps being performed under conditions where a second opening of a second dimension is formed, the second opening residing in the oxide layer and contacting the substrate, the second dimension of the second opening being smaller than the first dimension of the first opening.

8. The method of claim 7 wherein said removing step is performed by heating said reaction product to at least 100°

C.

9. The method of claim 7 wherein said etching step is performed in an etch chamber operating under the conditions of a total pressure of less than 30 mTorr.

10. The method of claim 9 wherein said total pressure is approximately 7 mTorr.

11. The method according to claim 7, wherein said etching step produces a lateral dimension of said photoresist not in contact with said oxide that is smaller than a thickness of said oxide.