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Stack package

  • US 6,075,284 A
  • Filed: 06/28/1999
  • Issued: 06/13/2000
  • Est. Priority Date: 06/30/1998
  • Status: Expired due to Term
First Claim
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1. A stack package comprising:

  • at least two semiconductor chips disposed up and down;

    lead frames having inner leads attached at bonding pad-disposed faces of the semiconductor chips respectively, wherein a pair of protruding portions are formed at the inner leads toward upside and downside respectively, wherein among the lead frames of the semiconductor chips, only one at the lowermost position of the semiconductor chips comprises outer leads being extended from the inner leads and to be mounted on a printed circuit board;

    metal wires for electrically connecting the inner leads of the respective lead frames and bonding pads of the semiconductor chips; and

    an epoxy compound for separately molding the respective semiconductor chips so that the outer leads and the protruding portions are exposed therefrom,wherein the respective lead frames are electrically connected by connecting the respective protruding portions of the lead frames being exposed from the epoxy compound.

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