Thermally enhanced packaged semiconductor assemblies

• US 6,075,289 A
• Filed: 11/04/1996
• Issued: 06/13/2000
• Est. Priority Date: 10/24/1996
• Status: Expired due to Term

• Current Assignee: Tessera, Inc. (Adeia, Inc.)
• Original Assignee: Tessera, Inc. (Adeia, Inc.)
• Inventors: Distefano, Thomas H.
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US08/740,856
• Time in Patent Office: 1,317 Days
• Field of Search: 257/732, 257/704, 257/731, 257/730, 257/714, 257/708-710, 257/675, 257/712, 257/778, 257/733, 257/734, 257/738, 257/737, 257/699
• US Class Current: 257/732
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05664 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding contacts overlying the front face of the chip. The flange bonding contacts are coplanar with the chip bonding contacts, or can be brought into coplanar alignment by flexure of the cap. The package can be surface-mounted to a circuit board by placing the package onto pads of solder paste, and then heating the assembly to melt the solder paste in order to join the bonding contacts on the chip and on the flange to corresponding contacts on the circuit board.

Claims

1. A packaged semiconductor chip assembly for mounting on a substrate, said assembly comprising:

(a) a metallic cap defining a rear wall, at least one side wall projecting forwardly from the rear wall and at least one flange projecting from said at least one side wall at a forward edge thereof remote from the rear wall, at least part of said cap being flexible so that said at least one flange is movable with respect to said rear wall;

(b) a semiconductor chip mounted to said cap, said chip having a rear surface bonded to said rear wall and a front surface facing away from said rear wall;

(c) chip bonding contacts overlying said front surface of said chip and electrically connected to circuits on said chip; and

(d) flange bonding contacts on said at least one flange, said flange bonding contacts being coplanar with said chip bonding contacts in at least one position of said at least one flange, whereby said chip bonding contacts and said flange bonding contacts can be bonded simultaneously to a planar substrate to thereby electrically connect the chip to the substrate and mechanically and thermally connect the cap to the substrate.

2. An assembly as claimed in claim 1 wherein said flange bonding contacts and said chip bonding contacts are metallic for bonding by metallic bonding materials.

3. An assembly as claimed in claim 1 wherein said chip bonding contacts and said flange bonding contacts are solderable.

4. An assembly as claimed in claim 3 wherein said chip bonding contacts and said flange bonding contacts include metallic base contacts and solder on said metallic base contacts.

5. An assembly as claimed in claim 4 wherein at least some of said contacts include cores with a melting temperature above the melting temperature of the solder disposed in the solder.

6. An assembly as claimed in claim 5 wherein said flange contacts have said cores and said chip contacts do not have said cores.

7. An assembly as claimed in claim 5 wherein said chip contacts have said cores and said flange contacts do not have cores.

8. An assembly as claimed in claim 1 or claim 5 or claim 6 wherein, when said cap is in an undeformed condition, said flange contacts are disposed forwardly of said chip contacts, and wherein said flange contacts can be brought into coplanar disposition with said chip contacts by engaging the flange contacts with a planar substrate and urging the rear wall of the cap forwardly to thereby move the chip and the chip contacts toward the planar substrate.

9. An assembly as claimed in claim 1 wherein said chip bonding contacts are disposed on the front surface of said chip.

10. An assembly as claimed in claim 1 further comprising a dielectric interposer overlying said front surface of said chip, said chip bonding contacts being disposed on said interposer.

11. An assembly as claimed in claim 1 wherein said chip bonding contacts are movable with respect to said chip.

12. An assembly as claimed in claim 1 further comprising a flexible potting compound at least partially surrounding said chip but not covering said contacts.

13. An assembly as claimed in claim 12 wherein said potting compound has a hardness of less than Shore D 60.

14. An assembly as claimed in claim 13 wherein said potting compound has a hardness of less than Shore A90.

15. An assembly as claimed in claim 1 wherein said potting compound has an elastic modulus less than 100,000 pounds per square inch.

16. An assembly as claimed in claim 1 wherein said rear surface is bonded to said rear wall by means of a thermally conductive but electrically insulating material.

17. An assembly as claimed in claim 1 wherein said rear surface is bonded to said rear wall by means of a thermally conductive and electrically conductive material.

18. An assembly as claimed in claim 1 wherein said cap is formed from a unitary piece of sheet metal.

19. An assembly as claimed in claim 1 wherein each said side wall is flexible.

20. An assembly as claimed in claim 1 wherein said at least one side wall includes a first pair of side walls extending from opposite edges of said rear wall, said chip being disposed between said first pair of side walls.

21. An assembly as claimed in claim 1 wherein said rear wall is rectangular, and wherein said at least one side wall includes four side walls extending from four edges of said rectangular rear wall, said chip being disposed between said four side walls.

22. An assembly as claimed in claim 1 including a plurality of chips mounted to said cap, each said chip having a front surface facing away from said rear wall, said chip bonding contacts overlying said front surfaces of said plural chips and being connected to said plural chips.

23. An assembly as claimed in claim 1, wherein said planar substrate includes at least one internal conductor connected to a contact pad on the surface of said substrate which is in electrical communication with at least one of said flange bonding contacts.