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Surface mount die: wafer level chip-scale package and process for making the same

  • US 6,075,290 A
  • Filed: 02/26/1998
  • Issued: 06/13/2000
  • Est. Priority Date: 02/26/1998
  • Status: Expired due to Term
First Claim
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1. An integrated circuit (IC) package comprising:

  • a die having a plurality of conductive pads;

    a passivation layer formed over the conductive pads such that the passivation layer has a plurality of passivation vias, each passivation via being positioned over an associated one of the conductive pads;

    a resilient protective layer formed over the passivation layer, the resilient protective layer having a plurality of resilient vias, each resilient via being associated with an associated passivation via;

    a plurality of under bump pads that are in electrical contact with the conductive pads, each under bump pad being associated with one of the resilient vias; and

    a plurality of contact bumps formed over the plurality of under bump pads such that each one of the contact bumps is electrically coupled with a selected one of the under bump pads and such that each contact bump is electrically coupled with a selected one of the conductive pads,wherein the resilient protective layer is formed from a material that absorbs stresses introduced at the contact bumps when the integrated circuit package is attached to an external substrate such that an underfill layer is not required between the IC package and the substrate.

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