Reduced weight artificial dielectric antennas and method for providing the same

• US 6,075,485 A
• Filed: 11/03/1998
• Issued: 06/13/2000
• Est. Priority Date: 11/03/1998
• Status: Expired due to Fees

• Current Assignee: Titan Aerospace Electronics Division
• Original Assignee: Atlantic Aerospace Electronics Corp. (L3Harris Technologies, Inc.)
• Inventors: McKinzie, William E. III, Auckland, David T., Lilly, James D.
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): VANNUCCI, JAMES
• Application Number:
  US09/185,205
• Time in Patent Office: 588 Days
• Field of Search: 343/700 MS, 343/911 R, 343/909, 343/910
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/0442 with particular tuning means

Abstract

An artificial anisotropic dielectric material is used as a microstrip patch antenna substrate and can achieve dramatic antenna weight reduction. The artificial dielectric is comprised of a periodic structure of low and high permittivity layers. The net effective dielectric constant in the plane parallel to the layers is engineered to be any desired value between the permittivities of the constituent layers. These layers are oriented vertically below the patch to support electric fields consistent with desired resonant modes. Substrates may be engineered for both linearly and circularly polarized patch antennas. Substrate weights can be reduced by factors of from 6 to 30 times using different types of high permittivity layers. This concept has numerous applications in electrically small and lightweight antenna elements, as well as in resonators, microwave lenses, and other electromagnetic devices.

Claims

1. An artificial dielectric structure comprising:

first and second stacked dielectric layers having first and second permittivities, respectively, said first permittivity being different from said second permittivity,

wherein said artificial dielectric structure has a permittivity tensor comprised of permittivity components respectively defined along three principal axes, one of said permittivity components along a certain axis of said principal axes being substantially different than both of the other two of said permittivity components,

and wherein said dielectric layers each have substantially parallel top and bottom surfaces and are stacked in a first direction perpendicular to said top and bottom surfaces such that said top surface of said first dielectric layer is adjacent to said bottom surface of said second dielectric layer, said certain axis being parallel to said first direction,

and wherein said other two of said permittivity components are greater than said one permittivity component along said certain axis by at least a factor of 5,

and wherein said first and second dielectric layers have first and second thicknesses t₁ and t₂, and first and second permittivities ε

_r1 and ε

_r2 respectively, said first and second thicknesses satisfying the condition that t_n <

<

1/β

_n, where β

_n =ω

×

sqrt(μ

₀ ε

₀ ε

_rn) for n=1,2, and ω

=2π

f where f is the maximum operating frequency of said artificial dielectric structure.

2. An artificial dielectric structure as defined in claim 1, wherein said other two of said permittivity components are substantially equal.

3. An artificial dielectric structure as defined in claim 1, wherein one of said first and second dielectric layers is comprised of an artificial dielectric material.

4. An artificial dielectric structure as defined in claim 3, wherein said one dielectric layer is comprised of a capacitive frequency selective surface.

5. An artificial dielectric structure as defined in claim 1, further comprising third and fourth stacked dielectric layers having third and fourth permittivities, respectively, said third permittivity being different from said fourth permittivity.

6. An artificial dielectric structure as defined in claim 5, wherein said third and fourth permittivities are the same as said first and second permittivities, respectively, of said first and second dielectric layers.

7. An artificial dielectric structure as defined in claim 6, wherein said first and second dielectric layers have first and second thicknesses, respectively, and said third and fourth dielectric layers have third and fourth thicknesses, respectively, said third thickness being the same as said first thickness, said fourth thickness being the same as said second thickness.

8. An artificial dielectric structure as defined in claim 6, wherein said first and second dielectric layers have first and second thicknesses, respectively, and said third and fourth dielectric layers have third and fourth thicknesses, respectively, said third thickness being different from said first thickness, said fourth thickness being different from said second thickness.

9. An artificial dielectric structure as defined in claim 5, wherein said third permittivity is the same as said first permittivity of said first dielectric layer and said fourth permittivity is different than said second permittivity of said second dielectric layer.

10. An artificial dielectric structure as defined in claim 9, wherein said first and second dielectric layers have first and second thicknesses, respectively, and said third and fourth dielectric layers have third and fourth thicknesses, respectively, said third thickness being the same as said first thickness, said fourth thickness being the same as said second thickness.

11. An artificial dielectric structure as defined in claim 9, wherein said second and fourth dielectric layers are comprised of an artificial dielectric material.

12. An artificial dielectric structure as defined in claim 11, wherein said second and fourth dielectric layers are comprised of an artificial dielectric material is a frequency selective surface.

13. An antenna comprising:

a radiating element that is adapted to receive RF energy;

a metalized ground plane; and

a substrate disposed between said radiating element and said metalized ground plane, said substrate comprising at least first and second stacked dielectric layers having first and second permittivities, respectively, said first permittivity being different from said second permittivity, said substrate having a permittivity tensor comprised of permittivity components respectively defined along three principal axes, one of said permittivity components along a certain axis of said principal axes being substantially different than both of the other two of said permittivity components,

wherein said dielectric layers each have substantially parallel top and bottom surfaces and are stacked in a first direction perpendicular to said top and bottom surfaces such that said top surface of said first dielectric layer is adjacent to said bottom surface of said second dielectric layer, said certain axis being parallel to said first direction,

and wherein said other two of said permittivity components are greater than said one permittivity component along said certain axis by at least a factor of 5,

and wherein said first and second dielectric layers have first and second thicknesses t₁ and t₂, and first and second permittivities ε

_r1 and ε

_r2 respectively, said first and second thicknesses satisfying the condition that t_n <

<

1/β

_n, where β

_n =ω

×

sqrt(μ

₀ ε

₀ ε

_rn) for n=1,2, and ω

=2π

f where f is the maximum operating frequency of said antenna.

14. An antenna as defined in claim 13, further comprising:

a first feed probe that is adapted to couple RF energy to said radiating element.

15. An antenna as defined in claim 14, further comprising:

a second feed probe that is adapted to couple RF energy to said radiating element, said first and second feed probes being adapted to couple to independent principal modes of surface currents in said radiating element.

16. An antenna as defined in claim 13, wherein said other two of said permittivity components are substantially equal.

17. An antenna as defined in claim 13, wherein one of said first and second dielectric layers is comprised of an artificial dielectric material.

18. An antenna as defined in claim 17, wherein said one dielectric layer is comprised of a capacitive frequency selective surface.

20. An antenna as defined in claim 13, wherein said radiating element is comprised of a microstrip patch.

21. An antenna as defined in claim 13, wherein said radiating element is comprised of a radiating slot.

22. An antenna as defined in claim 13, wherein said radiating element is comprised of an Archimedian spiral, said radiating element being disposed substantially in contact with both said first and second dielectric layers of said substrate.

23. An antenna as defined in claim 13, further comprising a cavity that houses said substrate.

24. An antenna as defined in claim 23, wherein said radiating element is comprised of a microstrip patch.

25. An antenna as defined in claim 23, wherein said radiating element is comprised of a radiating slot.

26. An antenna as defined in claim 23, wherein said radiating element is comprised of an Archimedian spiral, said radiating element being disposed substantially in contact with both said first and second dielectric layers of said substrate.

19. An antenna comprising:

a radiating element that is adapted to receive RF energy;

a metalized ground plane; and

a substrate disposed between said radiating element and said metalized ground plane, said substrate comprising at least first and second stacked dielectric layers having first and second permittivities, respectively, said first permittivity being different from said second permittivity, said substrate having a permittivity tensor comprised of permittivity components respectively defined along three principal axes, one of said permittivity components along a certain axis of said principal axes being substantially different than both of the other two of said permittivity components, wherein said dielectric layers each have substantially parallel top and bottom surfaces and are stacked in a first direction perpendicular to said top and bottom surfaces such that said top surface of said first dielectric layer is adjacent to said bottom surface of said second dielectric layer, said certain axis being parallel to said first direction,

wherein said radiating element has a surface, said surface being parallel to said first direction.

27. A patch antenna, comprising:

a microstrip patch that is adapted to receive RF energy;

a metalized ground plane; and

a substrate disposed between said microstrip patch and said metalized ground plane, said substrate comprising four artificial dielectric structures, said artificial dielectric structures being arranged so that each artificial dielectric structure is adjacent to two other of said artificial dielectric structures, each artificial dielectric structure having at least first and second stacked dielectric layers having first and second permittivities, respectively, said first permittivity being different from said second permittivity, said each artificial dielectric structure having a permittivity tensor comprised of permittivity components respectively defined along three principal axes, one of said permittivity components along a certain axis of said principal axes being substantially different than both of the other two of said permittivity components, wherein said certain axis of said each artificial dielectric structure is orthogonal to said certain axis of each of said two adjacent artificial dielectric structures,

wherein said radiating element is disposed substantially in contact with both said first and second dielectric layers of said each artificial dielectric structure.

28. A patch antenna as defined in claim 27, further comprising:

a first feed probe that is adapted to couple RF energy to said microstrip patch; and

a second feed probe that is adapted to couple RF energy to said microstrip patch, said first and second feed probes being adapted to couple to independent principal modes of surface currents in said microstrip patch.

29. A patch antenna as defined in claim 28, wherein said first feed probe couples to a portion of said microstrip patch that is disposed over a first one of said four artificial dielectric structures, and said second feed probe couples to a portion of said microstrip patch that is disposed over a second one of said four artificial dielectric structures, said first artificial dielectric structure being arranged adjacent to said second artificial dielectric structure.

30. A patch antenna as defined in claim 27, wherein said dielectric layers of said each artificial dielectric structure each have substantially parallel top and bottom surfaces and are stacked in a first direction perpendicular to said top and bottom surfaces such that said top surface of said first dielectric layer is adjacent to said bottom surface of said second dielectric layer, said certain axis of said each artificial dielectric structure being parallel to said first direction.

31. An antenna as defined in claim 27, wherein said other two of said permittivity components are substantially equal.

32. An artificial dielectric structure as defined in claim 27, wherein said other two of said permittivity components are greater than said one permittivity component along said certain axis by at least a factor of 5.

33. An artificial dielectric structure as defined in claim 31, wherein said other two of said permittivity components are greater than said one permittivity component along said certain axis by at least a factor of 5.

34. A patch antenna as defined in claim 27, wherein one of said first and second dielectric layers of said each artificial dielectric structure is comprised of an artificial dielectric material.

35. A patch antenna as defined in claim 34, wherein said one dielectric layer is comprised of a capacitive frequency selective surface.

36. A patch antenna as defined in claim 27, wherein said first and second dielectric layers of said each artificial dielectric structure have first and second thicknesses t₁ and t₂, and first and second permittivities ε

_r1 and ε

_r2 respectively, said first and second thicknesses satisfying the condition that t_n <

<

1/β

_n, where β

_n =ω

×

sqrt(μ

₀ ε

₀ ε

_m) for n=1,2, and ω

=2π

f where f is the maximum operating frequency of said patch antenna.

37. A patch antenna as defined in claim 27, wherein said patch is arranged so that it is disposed over substantially equal portions of said four artificial dielectric structures.

38. A patch antenna, comprising:

a microstrip patch that is adapted to receive RF energy;

a metalized ground plane; and

a substrate disposed between said microstrip patch and said metalized ground plane, said substrate comprising four artificial dielectric structures, said artificial dielectric structures being arranged so that each artificial dielectric structure is adjacent to two other of said artificial dielectric structures, each artificial dielectric structure having at least first and second stacked dielectric layers having first and second permittivities, respectively, said first permittivity being different from said second permittivity, said each artificial dielectric structure having a permittivity tensor comprised of permittivity components respectively defined along three principal axes, one of said permittivity components along a certain axis of said principal axes being substantially different than both of the other two of said permittivity components, wherein said certain axis of said each artificial dielectric structure is orthogonal to said certain axis of each of said two adjacent artificial dielectric structures,

wherein said dielectric layers of said each artificial dielectric structure each have substantially parallel top and bottom surfaces and are stacked in a first direction perpendicular to said top and bottom surfaces such that said top surface of said first dielectric layer is adjacent to said bottom surface of said second dielectric layer, said certain axis of said each artificial dielectric structure being parallel to said first direction,

and wherein said patch has a surface, said surface being parallel to said first direction of said four artificial dielectric structures.

39. A method of providing an antenna substrate with a desired permittivity ε

_d, wherein said antenna substrate is adapted for use in a microstrip patch antenna having a patch with a patch surface, said method comprising;

identifying a first dielectric material having a first permittivity ε

_r1 ;

identifying a second dielectric material having a second permittivity ε

_r2, said first and second dielectric materials each having substantially parallel top and bottom surfaces;

adjusting respective first and second thicknesses t₁ and t₂ between said top and bottom surfaces of said first and second dielectric materials in accordance with said desired permittivity;

stacking said first and second dielectric materials in a first direction perpendicular to said top and bottom surfaces such that said top surface of said first dielectric material is adjacent to said bottom surface of said second dielectric material; and

orienting said stacked first and second dielectric materials so that said first direction is parallel to said patch surface.

40. A method as defined in claim 39, wherein said antenna substrate is adapted for use in an antenna having a maximum operating frequency f (ω

=2π

f), said method further comprising;

maintaining the condition that t_n <

<

1/β

_n, where β

_n =ω

×

sqrt(μ

₀ ε

₀ ε

_rn) for n=1,2.

41. A method as defined in claim 40, wherein said adjusting step includes:

selecting a pair of thicknesses t₁ and t₂ that satisfy a relationship between said desired permittivity, said first and second thicknesses and said first and second permittivities, said relationship being;

##EQU5##

42. A method as defined in claim 39, wherein said antenna substrate has a desired weight, said first and second dielectric layers having first and second specific gravities, respectively, said adjusting step being performed in further accordance with said desired weight.

43. A method of reducing the weight of an antenna having a substrate with a desired permittivity and an undesired specific gravity, wherein said antenna substrate is adapted for use in a microstrip patch antenna having a patch with a patch surface, comprising:

identifying a first dielectric material having a first permittivity ε

_r1 and a first specific gravity;

identifying a second dielectric material having a second permittivity ε

_r2 and a second specific gravity, at least one of said first and second specific gravities being less than said undesired specific gravity, said dielectric materials each having substantially parallel top and bottom surfaces;

adjusting respective first and second thicknesses t₁ and t₂ between said top and bottom surfaces of said first and second dielectric materials in accordance with said desired permittivity and a desired specific gravity less than said undesired specific gravity;

stacking said first and second dielectric materials in a first direction perpendicular to said top and bottom surfaces such that said top surface of said first dielectric material is adjacent to said bottom surface of said second dielectric material to form an artificial dielectric structure;

replacing said substrate with said artificial dielectric structure; and

orienting said stacked first and second dielectric materials so that said first direction is parallel to said patch surface.