Heat transfer device for a retention assembly
First Claim
Patent Images
1. A heat transfer apparatus for use with an electronic package that is housed in a retention mechanism, comprising:
- a base portion;
a first rail guide coupled to the base portion and being detachably removable to the retention mechanism;
a second rail guide coupled to the base portion and being detachably removable to the retention mechanism;
the base portion including a first flange and a second flange, the first flange coupled to the first guide and the second flange coupled to the second guide;
wherein the retention mechanism includes a first and second lock mechanism;
wherein the first flange is used by the first lock mechanism to secure the heat transfer apparatus to the retention mechanism;
wherein the second flange is used by the second lock mechanism to secure the heat transfer apparatus to the retention mechanism.
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Accused Products
Abstract
A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly houses one or more processor modules that mount into the connectors. The processor modules include a heat transfer device. The heat transfer device has a pair of rail guides that cover the outer edges of the processor module. The rail guides enable the processor module to slide in and out of the retention assembly thereby enabling the processor module to be securely mounted into the connector.
33 Citations
10 Claims
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1. A heat transfer apparatus for use with an electronic package that is housed in a retention mechanism, comprising:
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a base portion; a first rail guide coupled to the base portion and being detachably removable to the retention mechanism; a second rail guide coupled to the base portion and being detachably removable to the retention mechanism; the base portion including a first flange and a second flange, the first flange coupled to the first guide and the second flange coupled to the second guide; wherein the retention mechanism includes a first and second lock mechanism; wherein the first flange is used by the first lock mechanism to secure the heat transfer apparatus to the retention mechanism; wherein the second flange is used by the second lock mechanism to secure the heat transfer apparatus to the retention mechanism. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A heat sink for use with a retention assembly including a first wall, a second wall, a first lock lever, and a second lock lever, the first wall parallel to the second wall, the first wall including a first rail and the second wall including a second rail, the heat sink comprising:
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a base portion having a flat planar surface with a first edge and a second edge, the first edge opposite the second edge, the base portion including a first and second flange, the first flange for use with the first lock lever to secure the heat sink to the retention assembly, the second flange for use with the second lock lever to secure the heat sink to the retention assembly; a finned heat radiating member extending upward and outward from said base portion; and a first and second rail guides for removably mounting the heat sink into the retention assembly, the first rail guide coupled to the first edge of the base portion and fitted to slide into the first rail, the second rail guide coupled to the second edge of the base portion and fitted to slide into the second rail. - View Dependent Claims (9, 10)
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Specification