Amplifier module with two power amplifiers for dual band cellular phones
First Claim
1. An amplifier module suitable for automated mounting on a motherboard of a cellular phone, comprising:
- a substrate, the substrate having an upper surface and a lower surface, and at least two layers of electrically conducting material;
a first semiconductor chip, said first chip comprising a first integrated circuit operating as part of a first power amplifier and being adapted for a first radio frequency band;
a second semiconductor chip, said second chip comprising a second integrated circuit operating as part of a second power amplifier and being adapted for a second radio frequency band; and
said first and second chips being positioned on said upper surface of said substrate and electrically connected to components mounted on said upper surface to form two power amplifiers operable independently of each other.
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Accused Products
Abstract
Disclosed is an amplifier module suitable for automated mounting and connecting to a motherboard of a cellular phone. The amplifier module comprises a substrate which has at least two layers of electrically conducting material. On the substrate, a first and second semiconductor chip are mounted. The first semiconductor chip includes a first integrated circuit which forms part of a first power amplifier adapted for a first radio frequency band. The second semiconductor chip includes a second integrated circuit which forms part of a second power amplifier adapted for a second radio frequency band. The first and second chips are positioned on the substrate and electrically connected to components mounted on the substrate.
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Citations
21 Claims
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1. An amplifier module suitable for automated mounting on a motherboard of a cellular phone, comprising:
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a substrate, the substrate having an upper surface and a lower surface, and at least two layers of electrically conducting material; a first semiconductor chip, said first chip comprising a first integrated circuit operating as part of a first power amplifier and being adapted for a first radio frequency band; a second semiconductor chip, said second chip comprising a second integrated circuit operating as part of a second power amplifier and being adapted for a second radio frequency band; and said first and second chips being positioned on said upper surface of said substrate and electrically connected to components mounted on said upper surface to form two power amplifiers operable independently of each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A cellular phone for a mobile communications system, said cellular phone being operable at a first radio frequency band and a second radio frequency band comprising a motherboard, said motherboard having a signal processing module and a dual band power amplifier module serially interconnected between a microphone and an antenna, said dual band power amplifier module comprising:
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a substrate, the substrate having an upper surface and a lower surface, and at least two layers of electrically conducting material; a first semiconductor chip, said first chip comprising a first integrated circuit operating as part of a first power amplifier and being adapted for the first radio frequency band; a second semiconductor chip, said second chip comprising a second integrated circuit operating as part of a second power amplifier and being adapted for the second radio frequency band; and said first and second chips being positioned on said upper surface of said substrate and electrically connected to components mounted on said upper surface to form two power amplifiers operable independently of each other; and said signal processing module switching the dual power amplifier module to operate at one of said radio frequency bands. - View Dependent Claims (13, 14, 15, 16)
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17. An amplifier module suitable for automated mounting on a mother board of a cellular phone, comprising:
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a substrate, said substrate having an upper surface and a lower surface, and at least two layers of electrically conducting material, said substrate comprises thermal vias which extend from said upper surface to said lower surface, at least of one of said thermal vias thermally connecting to one of said layers, said thermal vias being grouped into a first group and a second group; a first semiconductor chip, said first chip comprising a first integrated circuit operating as part of a first power amplifier and being adapted for a first radio frequency band; a second semiconductor chip, said second chip comprising a second integrated circuit operating as part of a second power amplifier and being adapted for a second radio frequency band; and said first and second chips being positioned on said upper surface of said substrate and electrically connected to components mounted on said upper surface. - View Dependent Claims (18, 19, 20)
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21. A method for manufacturing a dual band power amplifier module for a dual band cellular phone, said method comprising the steps of:
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etching a substrate having multiple layers of electrically conducting material in accordance with a layout of an electrical circuit diagram; mounting passive electrical components to an upper surface of said substrate; mounting a first semiconductor chip to said upper surface, said first chip comprising a first integrated circuit operating as part of a first power amplifier and being adapted for a first radio frequency band; mounting a second semiconductor chip to said upper surface, said second chip comprising a second integrated circuit operating as part of a second power amplifier and being adapted for a second radio frequency band; and electrically connecting said first and second chips to said upper surface of said substrate to form two power amplifiers operable independently of each other on a single multiple layer substrate.
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Specification