Method of centerless ground finishing of feedthrough pins for an implantable medical device

• US 6,076,017 A
• Filed: 02/11/1998
• Issued: 06/13/2000
• Est. Priority Date: 04/30/1997
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Taylor, William J., LaBree, Gary F., Lessar, Joseph F., Wright, John D.
• Primary Examiner(s): Kamm, William E.
• Application Number:
  US09/022,321
• Time in Patent Office: 853 Days
• Field of Search: 174/152 GM, 607/36
• US Class Current: 607/36
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: H01M 50/186 characterised by the disposition of the sealing members
• CPC Class Codes: H01M 50/191 Inorganic material
• CPC Class Codes: H01M 50/247 specially adapted for portable devices, e.g. mobile phones, computers, hand tools or pacemakers
• CPC Class Codes: H01M 6/16 with organic electrolyte H01M6/18 takes precedence

Abstract

A centerless grinding method of finishing feedthrough pins and corresponding devices for use in implantable medical devices and for components such as batteries in implantable medical devices is disclosed. The method provides certain advantages, including the elimination of longitudinal anomalies in drawn wire to thereby improve the hermeticity of implantable medical devices. In one of the preferred methods, the surface of an over-size medical grade wire having a known anomaly depth is centerless ground using an abrasive wheel and suitable coolant to a layer past which those anomalies disappear.

Claims

1. A glass-metal hermetic seal comprising a metal pin and a sealing glass, wherein the pin is circumferentially and sealingly engaged with the sealing glass and, prior to being assembled with the glass to form the seal, includes a surface that has been subjected to a centerless grinding process for removing defects and anomalies therefrom such that the hermetic seal withstands at least 19-21 pin bend cycles.

2. The seal of claim 1 wherein the pin is selected from the group consisting of titanium, molybdenum, tantalum, niobium, platinum, stainless steel, aluminum and alloys from the selected group including combinations thereof.

3. The seal of claim 1 wherein the seal is selected from the group consisting of glass, ceramic and a combination thereof.

4. A ceramic-metal hermetic seal comprising a metal pin and a sealing ceramic, wherein the pin is circumferentially and sealingly engaged with the sealing ceramic and, prior to being assembled with the ceramic to form the seal, includes a surface that has been subjected to a centerless grinding process for removing defects and anomalies therefrom such that the hermetic seal withstands at least 19-21 pin bend cycles.

5. The seal of claim 4 wherein the pin is selected from the group consisting of molybdenum, tantalum, niobium, titanium, platinum, stainless steel, aluminum and alloys from the selected group including combinations and mixtures thereof.

6. The seal of claim 4 wherein the seal is selected from the group consisting of glass, ceramic, and a combination thereof.

7. A ceramic-glass-metal hermetic seal comprising a metal pin, a sealing ceramic and glass wherein the pin is circumferentially and sealingly engaged with the sealing ceramic and the glass, prior to being assembled with the ceramic and the glass to form the seal, includes a surface that has been subjected to a centerless grinding process for removing defects and anomalies therefrom such that the hermetic seal withstands at least 19-21 pin bend cycles.

8. The seal of claim 7 wherein the pin is selected from the group consisting of molybdenum, tantalum, niobium, platinum, stainless steel, aluminum and alloys from the selected group including, combinations and mixtures thereof.

9. The seal of claim 7 wherein the seal is selected from the group consisting of glass, ceramic and a combination of ceramic and glass.