Metal jet deposition system
First Claim
Patent Images
1. A metal deposition system for conductor bearing substrates, comprising:
- a system for providing a space substantially free from oxygen;
a first ejection system in said space for a directing a preparatory material to wet the conductor on the substrate; and
a second ejection system in said space for directing a bonding material to overlay said preparatory material.
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Accused Products
Abstract
A metal jet, metal deposition system has metal jets disposed in an oxygen-free chamber. The metal jets eject droplets of a wetting metal onto conductors on an electrical substrate followed by solder metal. Banks of metal jets can be used to print conductors onto the electrical substrate.
53 Citations
20 Claims
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1. A metal deposition system for conductor bearing substrates, comprising:
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a system for providing a space substantially free from oxygen; a first ejection system in said space for a directing a preparatory material to wet the conductor on the substrate; and a second ejection system in said space for directing a bonding material to overlay said preparatory material. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A metal deposition system for conductor bearing substrates, comprising:
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a system providing a chamber substantially free from oxygen; a first ejection system in said chamber for a directing a wetting metal to wet the conductor on the substrate; and a second ejection system in said chamber for directing a solder to overlay said wetting metal. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A solder bumping system for conductor bearing silicon wafers, comprising:
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a system for providing a space substantially free from oxygen; a first ejection system in said space for a directing a tin metal to wet the conductor on the wafer; and a second ejection system in said space for directing a tin-lead alloy to overlay said tin metal.
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20. A conductor application system for conductor bearing printed circuit board, comprising:
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a system for providing a space substantially free from oxygen; a first ejection system in said space for a directing a wetting metal to wet the conductor on the printed circuit board; and a second ejection system in said space for directing a conductor to overlay said wetting metal and to form conductor lines on said printed circuit board to connect the conductors thereon.
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Specification