Method and apparatus for monitoring plasma processing operations
First Claim
1. A plasma processing system, comprising:
- a processing chamber comprising a window, wherein said window comprises an inner surface which is exposed to a plasma process conducted within said chamber and an outer surface which is isolated from said plasma process;
means for generating a plasma within said processing chamber to conduct said plasma process within said processing chamber;
means for obtaining optical emissions of said plasma within said chamber which are emitted through said window during said plasma process;
means for evaluating said plasma process through output from said means for obtaining; and
a calibration assembly operatively interconnected with said means for evaluating, said calibration assembly comprising means for calibrating said means for evaluating for each of first and second conditions, said first condition being a wavelength shift associated with said optical emissions which are used by said means for evaluating, said second condition being an intensity shift associated with said optical emissions which are used by said means for evaluating.
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Accused Products
Abstract
The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber. Plasma health evaluations and process identification through optical emissions analysis are included in this aspect. Yet another aspect associated with the present invention relates in at least some manner to the endpoint of a plasma process (e.g., plasma recipe, plasma clean, conditioning wafer operation) or discrete/discernible portion thereof (e.g., a plasma step of a multiple step plasma recipe). A final aspect associated with the present invention relates to how one or more of the above-noted aspects may be implemented into a semiconductor fabrication facility, such as the distribution of wafers to a wafer production system.
160 Citations
45 Claims
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1. A plasma processing system, comprising:
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a processing chamber comprising a window, wherein said window comprises an inner surface which is exposed to a plasma process conducted within said chamber and an outer surface which is isolated from said plasma process; means for generating a plasma within said processing chamber to conduct said plasma process within said processing chamber; means for obtaining optical emissions of said plasma within said chamber which are emitted through said window during said plasma process; means for evaluating said plasma process through output from said means for obtaining; and a calibration assembly operatively interconnected with said means for evaluating, said calibration assembly comprising means for calibrating said means for evaluating for each of first and second conditions, said first condition being a wavelength shift associated with said optical emissions which are used by said means for evaluating, said second condition being an intensity shift associated with said optical emissions which are used by said means for evaluating. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A plasma processing system, comprising:
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a processing chamber comprising a window, wherein said window comprises an inner surface which is exposed to a plasma process conducted within said chamber and an outer surface which is isolated from said plasma process; means for generating a plasma within said processing chamber to conduct said plasma process within said processing chamber; means for obtaining optical emissions of said plasma within said chamber which are emitted through said window during said plasma process, said optical emissions being within a first wavelength range; means for evaluating said plasma process through output from said means for obtaining; and a calibration assembly operatively interconnected with said means for evaluating, said calibration assembly comprising means for determining if said window is filtering out any said optical emissions within a first wavelength region which is contained within said first wavelength range. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A plasma processing system, comprising:
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a processing chamber comprising a window, wherein said window comprises an inner surface which is exposed to a plasma process conducted within said chamber and an outer surface which is isolated from said plasma process; means for generating a plasma within said processing chamber to conduct said plasma process within said processing chamber; means for obtaining optical emissions of said plasma within said chamber which are emitted through said window during said plasma process, said optical emissions being within a first wavelength range; means for evaluating said plasma process through output from said means for obtaining; and a calibration assembly operatively interconnected with said means for evaluating, said calibration assembly means for determining if said window is having a first dampening effect on a first wavelength region which is within said first wavelength range, as well as a second dampening effect on a second wavelength region which is both within said first wavelength range and outside of said first wavelength region, wherein said first and second dampening effects are different. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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Specification