Power semiconductor module

• US 6,078,501 A
• Filed: 12/17/1998
• Issued: 06/20/2000
• Est. Priority Date: 12/22/1997
• Status: Expired due to Term

• Current Assignee: Omnirel LLC (Infineon Technologies AG)
• Original Assignee: Omnirel LLC (Infineon Technologies AG)
• Inventors: Catrambone, John, Doiron, David, Greenspan, Jay, Driscoll, William, Clarke, Christopher, Semenov, Boris
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/215,580
• Time in Patent Office: 551 Days
• Field of Search: 361/728, 361/736, 361/748, 361/752, 361/760, 361/765, 361/772, 361/774, 361/777, 361/778, 361/730, 361/704, 361/707, 361/715, 174/50, 174/50.51, 174/50.54, 174/50.6, 174/52.1, 174/52.2, 257/687, 257/706, 257/713, 257/787, 257/796, 165/80.3, 165/185
• US Class Current: 361/704
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

An electronic module or package is disclosed for providing high reliability and high performance operation. The package comprises a hermetically sealed enclosure having a metallic baseplate and a ceramic cover, and containing one or more circuits or devices therein which typically are power rectifiers, bridges or power control circuitry. One or more power terminals are disposed on a terminal block compliantly supported on or above the baseplate, the terminals extending through the cover in hermetically sealed manner. Signal or control terminals may also be disposed on a terminal block compliantly supported on or above the baseplate, these terminals also extending through the cover in hermetically sealed manner. An adapter plate may be mounted on the cover and containing a plurality of terminals connected to the module terminals. The terminals of the adapter plate can be in any configuration to suit user requirements without requiring a change in the terminal configuration of the module itself. The adapter plate may also contain active and/or passive circuitry.

Claims

1. A power semiconductor module comprising:

a baseplate supporting one or more electronic devices on a surface thereof;

at least one terminal block having one or more power terminals retained thereon and having outwardly extending terminal elements;

a compliant mounting for compliantly supporting the terminal block on the same surface of the baseplate as the electronic devices; and

a cover hermetically sealed to the baseplate and having an opening for each of the terminal elements, each of the terminal elements extending through the cover and being hermetically sealed thereto.

2. The invention of claim 1 wherein the baseplate is composed of a laminate of metallic materials to provide a predetermined thermal conductivity and thermal coefficient of expansion.

3. The invention of claim 1 including a sealing element for each of the terminals each sealing element being operative to hermetically seal the respective terminal to the cover.

4. The invention of claim 1 further including an adapter plate mountable on the top surface of the cover and containing one or more terminals each connected to a respective terminal extending through the cover.

5. The invention of claim 1 wherein the baseplate is a thermally conductive material having a thermal coefficient of expansion compatible with that of the cover and of the electronic devices mounted on a surface of the baseplate.

6. The invention of claim 5 wherein the cover is a ceramic material.

7. The invention of claim 1 further including a circuit board disposed within the module in spaced relation to the baseplate and containing one or more electronic devices on at least one surface thereof.

8. The invention of claim 4 wherein the adapter plate is electrically insulative and has at least a portion of one side extending beyond the periphery of the cover and containing one or more edge terminals.

9. The invention of claim 4 wherein the adapter plate is electrically insulative and has circuit traces or circuit elements thereon.

10. The invention of claim 1 wherein the baseplate is composed of a composite of metallic materials to provide a predetermined thermal conductivity and thermal coefficient of expansion.

11. A power semiconductor module comprising:

a baseplate of thermally conductive metallic material having one or more electronic device substrates mounted on a surface thereof;

at least one high power terminal block having one or more power terminals retained thereon each terminal including an outwardly extending post portion and a laterally extending shelf portion;

at least one low power terminal block having one or more power terminals retained thereon each terminal including an outwardly extending post portion and a laterally extending shelf portion;

a compliant mounting for each of said terminal blocks for compliantly supporting the respective terminal blocks on the surface of the baseplate;

electrical connections selectively connecting the shelf portions of the terminal blocks to the electronic devices; and

a cover hermetically sealed to the baseplate and having an opening for each of the terminal posts, each of the terminal posts being hermetically sealed to the cover.

12. The invention of claim 11 wherein the compliant mounting includes a layer of compliant material bonded to the terminal block and to the surface of the baseplate.

13. The invention of claim 12 wherein the compliant material is silicone rubber.

14. The invention of claim 12 including electrical terminal elements disposed on an outer surface of the cover and electrically connected to respective terminals.

15. The invention of claim 11 wherein each of the terminal blocks include a body of electrically insulating material having the terminals molded thereto.

18. The invention of claim 12 wherein the compliant mounting includes for each terminal, an electrically insulative spacer bonded to the surface of the shelf portion.

16. A power semiconductor module comprising:

a baseplate supporting one or more electronic devices on a surface thereof;

at least one terminal block having one or more power terminals retained thereon and having outwardly extending terminal elements;

a compliant mounting for compliantly supporting the terminal block spaced from the same surface of the baseplate as the electronic devices; and

a cover hermetically sealed to the baseplate and having an opening for each of the terminal elements, each of the terminal elements extending through the cover and being hermetically sealed thereto.

17. A power semiconductor module comprising:

a baseplate of thermally conductive metallic material having one or more electronic device substrates mounted on a surface thereof;

at least one high power terminal block having one or more power terminals retained thereon each terminal including an outwardly extending post portion and a laterally extending shelf portion;

at least one low power terminal block having one or more power terminals retained thereon each terminal including an outwardly extending post portion;

a compliant mounting for said high power terminal block for compliantly supporting that terminal block above the surface of the baseplate;

electrical connections selectively connecting the terminal blocks to the electronic devices; and

a cover hermetically sealed to the baseplate and having an opening for each of the terminal posts, each of the terminal posts being hermetically sealed to the cover.