Semiconductor circuit, in particular for use in an integrated module

• US 6,078,537 A
• Filed: 02/23/1999
• Issued: 06/20/2000
• Est. Priority Date: 08/23/1996
• Status: Expired due to Term

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Zellner, Angela, Raeschmeier, Andreas, Pockrandt, Wolfgang
• Primary Examiner(s): Elms, Richard T.
• Assistant Examiner(s): PHUNG, ANH K
• Application Number:
  US09/255,992
• Time in Patent Office: 483 Days
• Field of Search: 365/201, 365/200, 365/185, 365/228, 371/21.1
• US Class Current: 365/201
• CPC Class Codes: G06F 21/87 by means of encapsulation, e.g. for integrated circuits
• CPC Class Codes: G06F 2221/2143 Clearing memory, e.g. to prevent the data from being stolen
• CPC Class Codes: H01L 23/525 with adaptable interconnections
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 23/576 using active circuits
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A semiconductor circuit, in particular for use in an integrated module, has at least one operational assembly with a drive circuit, such as a microprocessor, and a data memory. The semiconductor circuit has at least one initialization assembly for testing and/or for initializing the operational assembly. A disconnectable connecting line connects the operational assembly to the initialization assembly. In order to increase reliability, the initialization assembly is permanently disconnected from the operational assembly, by disconnecting the connecting lines, after the semiconductor circuit has been completed. In order to make it more difficult to reactivate the disconnected connecting lines, the semiconductor circuit has a potential line connected to the initialization assembly and/or to the operational assembly in a region of the connecting line. The initialization assembly and/or the operational assembly are configured in such a way that, when the potential line is connected to the connecting line, the initialization assembly is placed in an inactive state.

Claims

1. A semiconductor circuit, comprising:

at least one operational assembly having a drive circuit and a data memory;

at least one initialization assembly for at least one of testing and initializing said at least one operational assembly;

at least one permanently disconnectable connecting line connecting said at least one operational assembly to said at least one initialization assembly, said disconnectable connecting line being permanently disconnected from said operational assembly after the semiconductor circuit has been completed; and

at least one potential line connected to said at least one initialization assembly in a region of said at least one disconnectable connecting line, said at least one initialization assembly placed in an inactive state if said at least one potential line is connected to said at least one disconnectable connecting line.

2. The semiconductor circuit according to claim 1, wherein said drive circuit is a microprocessor.

3. The semiconductor circuit according to claim 1, wherein said at least one disconnectable connecting line and said at least one potential line are disposed substantially parallel to each other.

4. The semiconductor circuit according to claim 1, wherein said at least one potential line is one of at least two potential lines disposed in said region of said at least one disconnectable connecting line.

5. The semiconductor circuit according to claim 1, including an insulating housing surrounding said at least one operational assembly, said at least one initialization assembly, said at least one disconnectable connecting line and said at least one potential line.

6. A semiconductor circuit, comprising:

at least one operational assembly having a drive circuit and a data memory;

at least one initialization assembly for at least one of testing and initializing said at least one operational assembly;

at least one permanently disconnectable connecting line connecting said at least one operational assembly to said at least one initialization assembly, said disconnectable connecting line being permanently disconnected from said operational assembly after the semiconductor circuit has been completed; and

a potential line connected to said at least one operational assembly and disposed in a region of said at least one disconnectable connecting line, said at least one operational assembly placed in an inactive state if said at least one potential line is connected to said at least one disconnectable connecting line.

7. The semiconductor circuit according to claim 6, wherein said drive circuit is a microprocessor.

8. The semiconductor circuit according to claim 6, wherein said at least one disconnectable connecting line and said potential line are disposed substantially parallel to each other.

9. The semiconductor circuit according to claim 6, wherein said potential line is one of at least two potential lines disposed in said region of said at least one disconnectable connecting line.

10. The semiconductor circuit according to claim 6, including an insulating housing surrounding said at least one operational assembly, said at least one initialization assembly, said at least one disconnectable connecting line and said potential line.