Apparatus for carrying semiconductor devices
First Claim
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1. Apparatus for carrying and providing traceability for semiconductor die during and after wafer processing, comprising:
- a) a structure for receiving at least one semiconductor die; and
b) an electronic information storage device fixed to the structure and including;
A. a memory which stores traceability data associated with each semiconductor die, andB. means for allowing the traceability data for the semiconductor die, to be electronically read from and written to the memory.
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Abstract
This invention pertains to the embedding of a information storage device within, or attached to, the carriers used to transport work in progress from step to step in the semiconductor manufacturing process. The carrier can be a tray having sites for several semiconductor dies, tubes for carrying several dies together, lead frames, wafer cassettes or individual die sockets. The information storage device can be formed integrally with the carrier or formed separately and attached or secured to the carrier.
106 Citations
15 Claims
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1. Apparatus for carrying and providing traceability for semiconductor die during and after wafer processing, comprising:
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a) a structure for receiving at least one semiconductor die; and b) an electronic information storage device fixed to the structure and including; A. a memory which stores traceability data associated with each semiconductor die, and B. means for allowing the traceability data for the semiconductor die, to be electronically read from and written to the memory. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 14, 15)
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11. An apparatus for carrying and providing traceability for semiconductor die at the back end of the semiconductor manufacturing process, after separation from an originating wafer has occurred, comprising:
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a) a die carrier for receiving at least one semiconductor die, separately from the originating wafer; and b) an electronic information storage device fixed to the die carrier and including; A. a memory which stores data associated with the semiconductor die, and B. a means for allowing data, including traceability data for the semiconductor die, to be electronically read from and written to memory. - View Dependent Claims (12, 13)
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Specification