Sintered pressure sensor for a pressure transmitter

• US 6,079,276 A
• Filed: 06/30/1999
• Issued: 06/27/2000
• Est. Priority Date: 02/28/1995
• Status: Expired due to Term

• Current Assignee: Rosemount Incorporated (Emerson Electric Company)
• Original Assignee: Rosemount Incorporated (Emerson Electric Company)
• Inventors: Toy, Adrian C., Louwagie, Bennett L., Frick, Roger L.
• Primary Examiner(s): FELBER, JOSEPH LEON
• Application Number:
  US09/345,165
• Time in Patent Office: 363 Days
• Field of Search: 73/724, 73/718, 73/756, 361/283.4
• US Class Current: 73/718
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass
• CPC Class Codes: G01L 9/125 with temperature compensating means non electric temperature compensating means G01L19/04
• CPC Class Codes: Y10T 29/49142 including metal fusion

Abstract

A transmitter in a process control system transmits a pressure over a process control loop. The transmitter includes I/O circuitry, compensation circuitry and an absolute pressure sensor. The I/O circuitry transmits information over the process control loop. Compensation circuitry receives a pressure related signal and responsively control'"'"'s the I/O circuitry to transmit pressure information on the loop. The absolute pressure sensor includes a cavity which deforms as the sensor deflects in response to an applied pressure. A sensor in the cavity provides the pressure related signal to the compensation circuitry in response to the deformation.

Claims

1. A pressure transmitter in a process control system for transmitting pressure on a process control loop, the transmitter comprising:

a transmitter housing;

a pressure sensor body of a brittle corrosion resistant material operably coupled to the housing and positioned in the housing, the pressure sensor body comprising a first portion bonded to a second portion by a fusion bond, the fusion bond substantially free of foreign material, the pressure sensor body including a cavity formed between the first and second portions, the cavity having at least one dimension which changes in response to applied pressure;

first and second capacitive plates coupled to an interior wall of the cavity having a capacitance formed therebetween, the plates configured whereby a spacing between the plates changes as a function of the at least one dimension which changes in response to applied pressure;

first and second electrical conductors extending from an exterior of the pressure sensor body and electrically coupled to respective first and second capacitive plates;

a signal generator in the transmitter housing having a periodic output electrically coupled to the capacitance through at least one electrical conductor; and

an analog to digital converter in the transmitter housing having a digitized output as a function of the capacitance;

a loop interface in the transmitter housing configured to transmit a pressure related signal on the process control loop as a function of the digitized output, the interface further configured to completely power the transmitter with power received from the process control loop.

2. The pressure transmitter of claim 1 wherein the process control loop is configured to carry a 4-20 mA signal.

3. The pressure transmitter of claim 2 wherein the 4-20 mA signal is related to the applied pressure.

4. The pressure transmitter of claim 1 wherein the pressure related signal comprises a digital signal.

5. The pressure transmitter of claim 1 wherein the pressure within the cavity is substantially a vacuum.

6. The pressure transmitter of claim 1 wherein pressure within the cavity comprises a reference pressure.

7. The pressure transmitter of claim 1 wherein the corrosion resistant material comprises sapphire.

8. The pressure transmitter of claim 1 wherein the corrosion resistant material comprises single crystal material.

9. The pressure transmitter of claim 1 wherein the corrosion resistant material comprises single crystal sapphire.

10. The pressure transmitter of claim 1 wherein the fusion bond is formed by applying pressure to the body.

11. The pressure transmitter of claim 1 wherein the fusion bond is formed without applying pressure to the body.

12. The pressure transmitter of claim 1 wherein the brittle corrosion resistant material comprises silicon.

13. The pressure transmitter of claim 1 herein the brittle corrosion resistant material comprises ruby.

14. The pressure transmitter of claim 1 wherein the brittle corrosion resistant material comprises quartz.

15. The pressure transmitter of claim 1 wherein the brittle corrosion resistant material comprises diamond.

16. The pressure transmitter of claim 1 wherein at least one capacitive plate comprises a metal oxide.

17. The pressure transmitter of claim 1 wherein at least one capacitive plate comprises a doped semiconductor.

18. The pressure transmitter of claim 1 wherein at least one capacitive plate comprises a metal.

19. The pressure transmitter of claim 18 wherein the metal comprises chrome.

20. The pressure transmitter of claim 18 wherein the metal comprises tungsten.

21. The pressure transmitter of claim 18 wherein the metal comprises tantalum.

22. The pressure transmitter of claim 18 wherein the metal comprises platinum.

23. The pressure transmitter of claim 18 wherein the metal comprises iridium.

24. The pressure transmitter of claim 1 wherein at least one plate comprises a metal silicide.

25. The pressure transmitter of claim 1 wherein at least one capacitive plate is implanted into a surface of the body.

26. The pressure transmitter of claim 1 wherein the interface is further configured to receive commands from the process control loop.

27. The pressure transmitter of claim 1 wherein the pressure sensor body is configured to be surrounded by and directly contacting a process fluid.

28. The pressure transmitter of claim 1 wherein the sensor body comprises an elongate structure.

29. The pressure transmitter of claim 1 wherein at least one outer edge of the pressure sensor body is substantially straight.

30. The pressure transmitter of claim 1 wherein at least one outer surface of the pressure sensor body is substantially flat.

31. The pressure transmitter of claim 30 wherein all outer surfaces of the pressure sensor body are substantially flat.

32. The pressure transmitter of claim 1 wherein the cavity has at least two opposed substantially flat interior surfaces.

33. The pressure transmitter of claim 32 wherein the first and second capacitive plates are positioned on the opposed substantially flat surfaces.

34. The pressure transmitter of claim 1 wherein the pressure sensor body couples to the transmitter housing through a stress isolation member.

35. The pressure transmitter of claim 1 wherein the transmitter housing includes a sensor carrying member configured to carry the pressure sensor body and an ASIC chip.

36. The pressure transmitter of claim 35 wherein the ASIC compensates the capacitance.

37. The pressure transmitter of claim 1 including a temperature sensor thermally coupled to the pressure sensor body and wherein the pressure related signal from the loop interface is further a function of an output from the temperature sensor.

38. The pressure transmitter of claim 37 wherein the temperature sensor is fabricated on the pressure sensor body.

39. The pressure transmitter of claim 38 wherein the temperature sensor has a resistance which is a function of temperature.

40. The pressure transmitter of claim 1 wherein the fusion bond is formed through application of heat.

41. This pressure transmitter of claim 1 wherein the fusion bond is formed through application of pressure.

42. The pressure transmitter of claim 1 including an amplifier in the housing electrically coupled to the capacitance through at least one electrical conductor which provides an amplified output to the analog to digital converter.