Process for producing a sensor arrangement for measuring temperature

• US 6,082,609 A
• Filed: 05/22/1997
• Issued: 07/04/2000
• Est. Priority Date: 05/24/1996
• Status: Expired due to Fees

• Current Assignee: Heraeus Electro-Nite International N.V. (Heraeus Holding GMBH)
• Original Assignee: Heraeus Electro-Nite International N.V. (Heraeus Holding GMBH)
• Inventors: Muziol, Matthias, Soll, Eva, Wienand, Karlheinz
• Primary Examiner(s): Ryan, Patrick
• Assistant Examiner(s): STONER, KILEY SHAWN
• Application Number:
  US08/861,843
• Time in Patent Office: 1,139 Days
• Field of Search: 228/248.1, 228/180.22, 228/224, 228/122.1, 29/612
• US Class Current: 228/122.1
• CPC Class Codes: G01K 7/183 characterised by the use of the resistive element
• CPC Class Codes: Y10T 29/49085 Thermally variable
• CPC Class Codes: Y10T 29/49099 Coating resistive material on a base

Abstract

A process is provided for producing a sensor arrangement for measuring temperature with a temperature-sensitive measuring resistance element which has a thin, metallic resistance layer electrically-insulated toward the outside on a ceramic substrate and free-lying contact surfaces, which are connected electrically-conducting and directly mechanically fast with high-temperature-resistant conductor strips, electrically insulated from one another, on a ceramic board. The measuring resistance element is bonded and fastened on one end of the board by laying it on a still moist thick-film conducting paste printed on immediately before outfitting on the board and subsequently burning it in. On the end of the board away from the measuring resistance element, contact surfaces for connection of a plug or cable are arranged. The temperature sensor, a standard component in the form of a flat measuring resistance element, is applied wirelessly as an SMD component on the ceramic board. The sensor arrangement manufactured with the process is suited for temperature measurements above 400° C. as well. The process is economical in using only a few standardized components and easily automatable process steps.

Claims

1. A process for producing a sensor arrangement for measuring temperature, wherein the sensor arrangement comprises a temperature-sensitive measuring resistance element which has a thin metal film as a resistance layer and two or more first contact surfaces on a ceramic substrate, wherein the resistance layer is covered by an electrically insulating protective layer, and the contact surfaces are mechanically connected in an electrically-conductive manner to conductor strips, which are electrically insulated from one another on a high temperature-resistant board, and wherein the measuring resistance element is bonded on one end of the board, and on an end of the board away from the measuring resistance element are arranged two or more second contact surfaces for connecting a plug or a cable, said process comprising applying a moist thick-film conducting paste upon the two or more contact surfaces (3, 4) for bonding and fastening the measuring resistance element (1) immediately before laying the measuring resistance element (1) on the high temperature-resistance board (2), laying the measuring resistance element (1) on the two or more contact surfaces on the board (2) while the paste is still moist, and burning-in the paste at temperatures from about 800°

C. to about 1000°

C. on the board (2), whereby the measuring resistance element (1) is bonded and fastened to the board (2).

2. The process for producing a sensor arrangement for temperature measurement according to claim 1, wherein the thick-film conducting paste for bonding the measuring resistance element (1) on the board (2) contains conducting metal selected from the group consisting of Au, AgPd, AgPt and Pt.

3. A process for producing a sensor arrangement for measuring temperature, wherein the sensor arrangement comprises a temperature sensitive measuring resistance element which has a thin metal film as a resistance layer and two or more first contact surfaces on a ceramic substrate, wherein the resistance layer is covered by an electrically insulating protecting layer, and the contact surfaces are mechanically connected in an electrically-conductive manner to conductor strips, which are electrically insulated from one another on a high temperature-resistant board, and wherein the measuring resistance element is bonded on one end of the board, and on an end of the board away from the measuring resistance element are arranged two or more second contact surfaces for connecting a plug or a cable, said process comprising printing a moist thick-film conducting paste, said paste containing at least one conducting metal selected from the group consisting of Au, AgPd, AgPt and Pt, upon the two or more first contact surfaces (3, 4) for bonding and fastening the measuring resistance element (1) immediately before laying the measuring resistance element (1) on the high temperature-resistant board (2), laying the measuring resistance element (1) on the two or more contact surfaces on the board (2) while the paste is still moist, and burning-in the paste at temperatures from about 800°

C. to about 1000°

C. on the board (2) whereby the measuring resistance element (1) is bonded and fastened to the board (2).