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Process for producing a sensor arrangement for measuring temperature

  • US 6,082,609 A
  • Filed: 05/22/1997
  • Issued: 07/04/2000
  • Est. Priority Date: 05/24/1996
  • Status: Expired due to Fees
First Claim
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1. A process for producing a sensor arrangement for measuring temperature, wherein the sensor arrangement comprises a temperature-sensitive measuring resistance element which has a thin metal film as a resistance layer and two or more first contact surfaces on a ceramic substrate, wherein the resistance layer is covered by an electrically insulating protective layer, and the contact surfaces are mechanically connected in an electrically-conductive manner to conductor strips, which are electrically insulated from one another on a high temperature-resistant board, and wherein the measuring resistance element is bonded on one end of the board, and on an end of the board away from the measuring resistance element are arranged two or more second contact surfaces for connecting a plug or a cable, said process comprising applying a moist thick-film conducting paste upon the two or more contact surfaces (3, 4) for bonding and fastening the measuring resistance element (1) immediately before laying the measuring resistance element (1) on the high temperature-resistance board (2), laying the measuring resistance element (1) on the two or more contact surfaces on the board (2) while the paste is still moist, and burning-in the paste at temperatures from about 800°

  • C. to about 1000°

    C. on the board (2), whereby the measuring resistance element (1) is bonded and fastened to the board (2).

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