Large angle channel threshold implant for improving reverse narrow width effect
First Claim
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1. A method of fabricating channel threshold implant regions to increase the dopant concentration under a bird'"'"'s beak in a field oxide region;
- comprising the steps of;
a) forming spaced field oxide regions on a semiconductor substrate, said field oxide regions having bird'"'"'s beaks, said spaced field oxide regions defining a channel region;
b) performing a field implant using said spaced field oxide region as an implant mask forming a deep channel stop region;
c) forming a sacrificial oxide layer over the resulting surface;
d) forming a threshold adjustment region by performing an angled implant of ions using said field oxide region as an implant mask implanting said ions into said channel region and under said bird'"'"'s beak such that the threshold voltage is higher under said bird'"'"'s beak than in said channel region;
said angled implant comprises striking a tilted substrate with an ion beam, the substrate tilted at an angle between 15 and 45 degrees relative to said ion beam;
e) removing said sacrificial oxide layer;
f) forming a gate oxide layer over said channel region;
g) forming a conductive layer over said gate oxide;
h) patterning said conductive layer forming a gate electrode 50 over said channel region;
i) forming source and drain regions adjacent to said gate electrode and adjacent to said field oxide regions.
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Abstract
The present invention provides a method of manufacturing MOS device having threshold voltage adjustment region 28 ormed using a large angled implant. The invention'"'"'s angled implant serves as both (a) a Vt adjustment I/I and (b) a Channel stop I/I by (1) increasing the threshold voltage (Vt) and (2) reducing the leakage current. The method comprises forming spaced field oxide regions having bird'"'"'s beaks on a semiconductor substrate. A field implant is performed using the spaced field oxide regions as an implant mask formed a deep channel stop region 24. Next, a sacrificial oxide layer 20 is formed over the resultant surface. In a critical step, a threshold voltage adjustment region 28 is formed by performing a large angled implant of a p-type ions. The p-type ions into are implanted into the channel region 19 and under the bird'"'"'s beak 18 such that the threshold voltage is higher under the bird'"'"'s beak than in the channel region 19. A MOS transistor is then formed over the channel region. The large angled threshold voltage implant of the present invention eliminates the reverse narrow width effect (e.g., reduced threshold voltage (Vt) and increased leakage currents).
26 Citations
17 Claims
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1. A method of fabricating channel threshold implant regions to increase the dopant concentration under a bird'"'"'s beak in a field oxide region;
- comprising the steps of;
a) forming spaced field oxide regions on a semiconductor substrate, said field oxide regions having bird'"'"'s beaks, said spaced field oxide regions defining a channel region; b) performing a field implant using said spaced field oxide region as an implant mask forming a deep channel stop region; c) forming a sacrificial oxide layer over the resulting surface; d) forming a threshold adjustment region by performing an angled implant of ions using said field oxide region as an implant mask implanting said ions into said channel region and under said bird'"'"'s beak such that the threshold voltage is higher under said bird'"'"'s beak than in said channel region;
said angled implant comprises striking a tilted substrate with an ion beam, the substrate tilted at an angle between 15 and 45 degrees relative to said ion beam;e) removing said sacrificial oxide layer; f) forming a gate oxide layer over said channel region; g) forming a conductive layer over said gate oxide; h) patterning said conductive layer forming a gate electrode 50 over said channel region; i) forming source and drain regions adjacent to said gate electrode and adjacent to said field oxide regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
- comprising the steps of;
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11. A method of fabricating channel threshold implant regions to increase the dopant concentration under a bird'"'"'s beak in field oxide regions;
- comprising the steps of;
a) forming spaced field oxide regions on a semiconductor substrate 10, said field oxide regions having bird'"'"'s beaks, said spaced field oxide regions defining a channel region; b) performing a field implant using said spaced field oxide region as an implant mask forming a deep channel stop region; c) forming a sacrificial oxide layer over the resulting surface; d) forming a threshold adjustment region by performing an angled implant of a p-type ions using said field oxide region as an implant mask implanting said p-type ions into said channel region and under said bird'"'"'s beak such that the threshold voltage is higher under said bird'"'"'s beak than in said channel region;
said angled implant comprises striking a tilted substrate with an ion beam, the substrate tilted at an angle between 15 and 45 degrees relative to said ion beam;
said angled implant implanting BF2 ions at an energy in a range of between about 150 KeV and 200 KeV, a dose in a range of between about 5E12 and 5E13 atoms/cm3 ;
said threshold adjustment region having a concentration in a range of between about 1E17 atoms/cm3 and 5E17 atoms/cm3 and a depth from the substrate surface in a range of between about 500 and 1500 Å
;e) removing said sacrificial oxide layer; f) forming a gate oxide layer over said channel region; g) forming a conductive layer over said gate oxide; h) patterning said conductive layer forming a gate electrode 50 over said channel region; i) forming source and drain regions adjacent to said gate electrode and adjacent to said field oxide regions. - View Dependent Claims (12, 13, 14, 15, 16)
- comprising the steps of;
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17. A method of fabricating channel threshold implant regions to increase the dopant concentration under bird'"'"'s beaks in field oxide regions;
- comprising the steps of;
a) forming spaced field oxide regions on a semiconductor substrate, said field oxide regions having bird'"'"'s beaks, said spaced field oxide regions defining a channel region; b) performing a field implant using said spaced field oxide region as an implant mask forming a deep channel stop region;
said deep channel stop region having a concentration in a range of between about 1E17 atoms/cc and 5E17 atoms/cc and a depth from the substrate surface in a range of between about 1000 and 2500 Å
;
said field implant performed by implanting B ions at an energy in a range of between about 50 KeV and 130 KeV, a dose in a range of between about 5E12 and 5E13 atoms/cm2 ;c) forming a sacrificial oxide layer over the resulting surface; d) forming a threshold adjustment region by performing an angled implant of a p-type ions using said field oxide region as an implant mask implanting said p-type ions into said channel region and under said bird'"'"'s beak whereby the threshold voltage is higher under said bird'"'"'s beak than in said channel region;
said angled implant comprises striking a tilted substrate with an ion beam, the substrate tilted at an angle between 15 and 45 degrees relative to said ion beam;
said angled implant implanting BF2 ions at an energy in a range of between about 150 KeV and 200 KeV, a dose in a range of between about 5E12 and 5E13 atoms/cm3 ;
said threshold adjustment region having a concentration in a range of between about 1E17 atoms/cm3 and 5E17 atoms/cm3 and a depth from the substrate surface in a range of between about 500 and 1500 Å
;e) removing said sacrificial oxide layer; f) forming a gate oxide layer over said channel region; g) forming a conductive layer over said gate oxide; h) patterning said conductive layer forming a gate electrode 50 over said channel region; i) forming source and drain regions adjacent to said gate electrode and adjacent to said field oxide regions.
- comprising the steps of;
Specification
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Current AssigneeTaiwan Semiconductor Manufacturing Company Limited
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Original AssigneeTaiwan Semiconductor Manufacturing Company Limited
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InventorsHsu, Ching-Hsiang, Liang, Mong-Song
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Primary Examiner(s)Chaudhuri, Olik
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Assistant Examiner(s)COLEMAN, WILLIAM D
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Application NumberUS09/020,497Time in Patent Office876 DaysField of Search257/305, 257/336, 257/392, 438/302, 438/305, 438/290, 438/300, 438/289, 438/294, 438/525US Class Current438/289CPC Class CodesH01L 21/26586 characterised by the angle ...H01L 21/76216 introducing electrical acti...H01L 29/1033 with insulated gate, e.g. c...
