Method for producing thin dice from fragile materials

• US 6,083,811 A
• Filed: 02/07/1996
• Issued: 07/04/2000
• Est. Priority Date: 02/07/1996
• Status: Expired due to Term

• Current Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Original Assignee: Northrop Grumman Corporation
• Inventors: Riding, Alan J., Jones, H. Wayne, Pennisi, Leonard
• Primary Examiner(s): Picardat, Kevin M.
• Assistant Examiner(s): COLLINS, DEVEN M
• Application Number:
  US08/597,762
• Time in Patent Office: 1,609 Days
• Field of Search: 438/416, 438/460, 438/464, 438/977
• US Class Current: 438/460
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate

Abstract

Thin dice of fragile material are formed by making saw cuts in a front surface of a body of fragile material. The saw cuts define the thin dice, and have a depth equal to the desired thickness of the thin dice plus about 1 mil. A support film is then applied to the front surface of the body of fragile material. Using conventional equipment, the back surface of the body of fragile material, opposite the front surface, is ground. The grinding operation reduces the thickness of the body to the desired thickness for the thin dice. Due to the depth of the saw cuts, the grinding process exposes these saw cuts creating the individual thin dice having the desired thickness.

Claims

1. A method of producing thin dice out of a fragile material, comprising:

(a) forming grooves in a first surface of a body of fragile material, said body also having a second surface opposite said first surface;

(b) applying a support film to said first surface;

(c) removing fragile material from said second surface to thin said body, said step (c) removing enough of said fragile material from said second surface to expose said grooves and form a plurality of thin dice; and

(d) removing said support film.

2. The method of claim 1, wherein said step (a) forms said grooves by making saw cuts in said first surface.

3. The method of claim 1, wherein said step (b) applies a non-metallic support film.

4. The method of claim 1, wherein said step (b) applies a backgrinding film to said first surface, said backgrinding film being a non-contracting film.

5. The method of claim 4, wherein said step (b) applies several layers of backgrinding film.

6. The method of claim 1, wherein said step (c) removes said fragile material from said second surface by grinding.

7. The method of claim 1, wherein said step (d) removes said support film by peeling said support film off said first surface of said plurality of semiconductor dice.

8. The method of claim 1, wherein said step (d) comprises the substeps of:

(d1) applying a handling film to said second surface of said plurality of thin dice, said handling film having greater adhesion to said plurality of thin dice than between said support film and said plurality of thin dice; and

(d2) peeling said support film off said first surface of said plurality of thin dice.

9. The method of claim 1, wherein

said step (b) applies a backgrinding film to said first surface, said backgrinding film being a non-contracting film;

and

said step (d) includes the substeps of,

(d1) applying a handling film to said second surface of said plurality of thin dice, said handling film having greater adhesion to said plurality of thin dice than between said backgrinding film and said plurality of thin dice; and

(d2) peeling said backgrinding film off said first surface of said plurality of thin dice.

10. The method of claim 1, wherein said body of fragile material is a semiconductor wafer.

11. The method of claim 1, wherein said body of fragile material is a body of one of quartz, sapphire, and ceramic.