Thin film transistor, manufacturing method thereof, and circuit and liquid crystal display device using the thin film transistor
First Claim
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1. A thin film transistor, comprising:
- a substrate;
a gate electrode;
a plurality of non-single crystal thin films formed on the substrate which cross the gate electrode;
a channel region formed on each of the non-single crystal silicon thin films; and
a first region and a second region, the first region and the second region of a first conduction type formed on the non-single crystal silicon thin film, the first region and the second region separated by the channel region,wherein the first region and the second region are connected to common electrodes and wherein the dimension between the outermost sides of the non-single crystal silicon thin films is 50 μ
m or more.
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Abstract
A thin film transistor has a structure capable of decreasing deterioration in Vgs-Ids characteristics. The thin film transistor has a source region composed of an N-type impurity-diffused region, a drain region, and a gate electrode, and a channel region formed directly below the gate electrode. To the source region and the drain region are connected a source electrode and a drain electrode, respectively, through a plurality of contact holes. In the channel region are formed a plurality of P-type impurity-diffused regions at constant intervals.
73 Citations
3 Claims
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1. A thin film transistor, comprising:
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a substrate; a gate electrode; a plurality of non-single crystal thin films formed on the substrate which cross the gate electrode; a channel region formed on each of the non-single crystal silicon thin films; and a first region and a second region, the first region and the second region of a first conduction type formed on the non-single crystal silicon thin film, the first region and the second region separated by the channel region, wherein the first region and the second region are connected to common electrodes and wherein the dimension between the outermost sides of the non-single crystal silicon thin films is 50 μ
m or more. - View Dependent Claims (2, 3)
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Specification
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Current AssigneeBOE Technology Group Co., Ltd.
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Original AssigneeSeiko Epson Corporation (Seiko Group)
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InventorsInoue, Satoshi
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Primary Examiner(s)Ngo, Ngan V.
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Application NumberUS09/011,998Time in Patent Office862 DaysField of Search257/347, 257/348, 257/349, 257/352, 257/353, 257/354, 257/66US Class Current257/66CPC Class CodesG02F 1/13454 Drivers integrated on the a...H01L 29/78696 characterised by the struct...
