Semiconductor light emitting device

• US 6,084,252 A
• Filed: 07/10/1998
• Issued: 07/04/2000
• Est. Priority Date: 07/30/1997
• Status: Expired due to Term

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Isokawa, Shinji, Toda, Hidekazu
• Primary Examiner(s): Saadat, Mahshid
• Assistant Examiner(s): Fenty, Jesse A
• Application Number:
  US09/113,302
• Time in Patent Office: 725 Days
• Field of Search: 257/100, 257/98, 257/99, 257/95, 257/79, 435/25, 435/26
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12035 Zener diode
• CPC Class Codes: H01L 2924/12036 PN diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Obtained is a semiconductor light emitting device in which a light emitting device chip is bonded on a first lead and a second lead is electrically connected to one electrode of the light emitting device chip. Besides, the light emitting device chip and the top end of the second lead are enclosed by resin which a light from the light emitting device chip transmits. The first and second leads are respectively enclosed by heat resistant enclosing material along predetermined lengths of both leads at the bottom of the package, which is opposed to the light emitting surface. As a result, adhesiveness between the resin package and the leads is improved and thereby prevented is corrosion of the leads and the light emitting device chip in the package from occurring, which can make reliability improved.

Claims

1. A semiconductor light emitting device comprising:

a first lead;

a light emitting device chip which is bonded on a die pad portion of said first lead;

a second lead electrically connected to one electrode of said light emitting device chip;

a resin package made of epoxy resin, which encloses said light emitting device chip and a top end of said second lead, and which a light from said light emitting device chip transmits; and

a heat resistant enclosing material, which is provided on a bottom side of said resin package so as to enclose at least a part of said first and second leads, and a side portion of said heat resistant enclosing material is enclosed by said resin package, wherein a heat resistance of said heat resistant enclosing material is higher than a heat resistance of said resin package.

2. A semiconductor light emitting device according to claim 1, wherein said light emitting device chip is formed by a layered structure of gallium nitride based compound semiconductor.

3. A semiconductor light emitting device according to claim 1, wherein said heat resistant enclosing material is provided between the first and second leads in a continuous manner along a direction traversing both said leads, and said heat resistant enclosing material serves as an alternative to a tie bar which couples both said leads in assembly.

4. A semiconductor light emitting device according to claim 3, wherein said heat resistant enclosing material has an outer shape having a slope that is thin in said light emitting device chip side but thick in said resin package bottom side.

5. A semiconductor light emitting device according to claim 3, wherein a groove is formed on an outer surface of an outer shape of said heat resistant enclosing material, from end to end along an axial direction of said first and second leads.

6. A semiconductor light emitting device according to claim 1, wherein a part of said heat resistant enclosing material forms a curved surface surrounding a die pad portion of said first lead.

7. A semiconductor light emitting device according to claim 6, wherein said heat resistant enclosing material is made to be white in color.

8. A semiconductor light emitting device according to claim 1, wherein a recess/protrusion profile portion is formed on an outer surface of a structure of said heat resistant enclosing material along an axial directions of said first and second leads and said resin package is provided so as to copy the recess/protrusion profile on an outer area while filling a recess.

9. A semiconductor light emitting device according to claim 1, wherein said heat resistant enclosing material is provided almost all over a bottom surface of said resin package.