Lead frame and semiconductor device using the lead frame
First Claim
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1. A lead frame comprising a unitary electrically conductive base plate including:
- opposed first and second surfaces, the second surface being planar and the first surface having;
a peripheral frame with a first thickness;
a central portion within the peripheral frame for mounting a semiconductor element and having a second thickness smaller than the first thickness; and
a lead-forming portion, within the central portion and having a plurality of raised portions with a third thickness substantially equal to the first thickness minus the second thickness, for forming leads.
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Abstract
A lead frame includes a conductive base plate having a first surface on which a semiconductor element is to be mounted and a second surface opposite to the first surface, a lead forming portion arranged on the first surface of the conductive base plate, in a concavity in the first surface through etching by masking at least the lead forming portion. The lead forming portions are coupled with one another, and are not independent. Thus, bending of the lead forming portion in a lead frame is avoided. A semiconductor device using the lead frame, and methods for manufacturing the lead frame are also disclosed.
43 Citations
16 Claims
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1. A lead frame comprising a unitary electrically conductive base plate including:
opposed first and second surfaces, the second surface being planar and the first surface having; a peripheral frame with a first thickness; a central portion within the peripheral frame for mounting a semiconductor element and having a second thickness smaller than the first thickness; and a lead-forming portion, within the central portion and having a plurality of raised portions with a third thickness substantially equal to the first thickness minus the second thickness, for forming leads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A semiconductor device comprising:
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a lead frame including a unitary electrically conductive base plate comprising; opposed first and second surfaces, the second surface being planar and the first surface having a peripheral frame having a first thickness, a central portion within the peripheral frame for mounting a semiconductor element and having a second thickness smaller than the first thickness, and a lead-forming portion within the central portion and having a plurality of raised leads with a third thickness, substantially equal to the first thickness minus the second thickness, a semiconductor element mounted on the central portion within the peripheral frame, the semiconductor element being electrically connected to the leads; a resin covering the semiconductor element and the central portion; and an insulating material covering the second side of the electrically conductive base plate, opposite the central portion on which the semiconductor element is mounted.
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Specification