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Lead frame and semiconductor device using the lead frame

  • US 6,084,292 A
  • Filed: 02/24/1998
  • Issued: 07/04/2000
  • Est. Priority Date: 08/19/1997
  • Status: Expired due to Fees
First Claim
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1. A lead frame comprising a unitary electrically conductive base plate including:

  • opposed first and second surfaces, the second surface being planar and the first surface having;

    a peripheral frame with a first thickness;

    a central portion within the peripheral frame for mounting a semiconductor element and having a second thickness smaller than the first thickness; and

    a lead-forming portion, within the central portion and having a plurality of raised portions with a third thickness substantially equal to the first thickness minus the second thickness, for forming leads.

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