Composite bump structures

• US 6,084,301 A
• Filed: 10/14/1997
• Issued: 07/04/2000
• Est. Priority Date: 02/13/1995
• Status: Expired due to Term

• Current Assignee: Industrial Technology Industrial Research
• Original Assignee: Industrial Technology Industrial Research
• Inventors: Jou, Jwo-Huei, Chang, Shyh-Ming, Lee, Yu-Chi
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US08/950,376
• Time in Patent Office: 994 Days
• Field of Search: 257/737, 257/738, 257/734, 257/778, 257/693, 257/779-781, 257/690, 257/642, 257/643, 257/784, 257/786, 257/783
• US Class Current: 257/737
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/114 by blanket deposition of the material of the bump connector
• CPC Class Codes: H01L 2224/116 by patterning a pre-deposited material treatment of parts prior to assembly of the devices H01L21/48
• CPC Class Codes: H01L 2224/11901 with repetition of the same manufacturing step
• CPC Class Codes: H01L 2224/13008 Bump connector integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13016 in side view
• CPC Class Codes: H01L 2224/13017 being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13019 at the bonding interface of the bump connector, i.e. on the surface of the bump connector
• CPC Class Codes: H01L 2224/13021 the bump connector being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/13562 On the entire exposed surface of the core
• CPC Class Codes: H01L 2224/13582 Two-layer coating
• CPC Class Codes: H01L 2224/13609 Indium [In] as principal constituent
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young'"'"'s Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing. A base metal pad covering the integrated circuit element input/output pad can be used to provide added flexibility in location of the composite bump. The composite bump can be formed directly on the input/output pad or on the base metal pad.

Claims

1. A composite bump structure, comprising:

an integrated circuit element;

input/output pads formed on said integrated circuit element, wherein each of said input/output pads has an outer perimeter;

base metal pads formed on said input/output pads; and

composite bumps formed on said base metal pads, wherein said composite bumps comprise a polymer body covered by a conductive metal coating, wherein said polymer body has a Young'"'"'s Modulus between about 0.4×

10^-6 and 0.5×

10^-6 psi.

2. The composite bump structure of claim 1 wherein said polymer body is polyamic acid polyimide.

3. The composite bump structure of claim 1 wherein a base metal is formed under said composite bumps and on top of said input/output pads.

4. The composite bump structure of claim 1 wherein said base metal pads are aluminum.

5. The composite bump structure of claim 1 wherein said conductive metal coating is coated with solder.

6. The composite bump structure of claim 5 wherein said solder is 95% lead and 5% tin.

7. The composite bump structure of claim 1 wherein said composite bumps extend beyond said outer perimeter of each of said input/output pads.

8. The composite bump structure of claim 1 wherein said composite bumps are in a ring around said input/output pads.

9. A composite bump structure, comprising:

an integrated circuit element with input/output pads;

a passivation layer covering said integrated circuit element having contact holes over said input/output pads;

base metal pads formed on said passivation layer covering said contact holes and making electrical contact with said input/output pads; and

composite bumps formed on said base metal pads, wherein said composite bumps comprise a polymer body covered by a conductive metal coating, wherein said polymer body has a Young'"'"'s Modulus between about 0.4×

10^-6 and 0.5×

10^-6 psi.

10. The composite bump structure of claim 9 wherein said composite bumps have a rounded shape.

11. The composite bump structure of claim 9 wherein that part of the surface of said composite bumps opposite said base metal pads is flat.

12. The composite bump structure of claim 9 wherein that part of the surface of said composite bumps opposite said base metal pads has a rough, irregular exterior.

13. The composite bump structure of claim 9 wherein said base metal is aluminum.

14. The composite bump structure of claim 9 wherein said polymer body, is polyamic acid polyimide.

15. The composite bump structure of claim 9 wherein said polymer body, is photosensitive polymer.

16. The composite bump structure of claim 15 wherein said photosensitive polymer is photosensitive polyamic acid polyimide.

17. The composite bump structure of claim 9 wherein said conductive metal coating is covered by a layer of soldering metal.

18. The composite bump structure of claim 17 wherein said layer of soldering metal is 95% lead and 5% tin.

19. A composite bump structure, comprising:

an integrated circuit element;

input/output pads formed on said integrated circuit element, wherein each of said input/output pads has an outer periphery; and

multiple composite bumps formed wherein each said composite bump is formed from a polymer body having a Young'"'"'s Modulus between about 0.4×

10^-6 and 0.5×

10^-6 psi covered by a conductive metal coating and said multiple composite bumps are located inside said outer periphery of each said input/output pad.

20. A composite bump structure, comprising:

an integrated circuit element;

input/output pads formed on said integrated circuit element, wherein each of said input/output pads has an outer periphery; and

multiple composite bumps formed wherein each said composite bump is formed from a polymer body having a Young'"'"'s Modulus between about 0.4×

10^-6 and 0.5×

10^-6 psi covered by a conductive metal coating and said multiple composite bumps are located in a ring surrounding said outer periphery of each said input/output pad.

21. A composite bump structure, comprising:

an integrated circuit element;

input/output pads formed on said integrated circuit element, wherein each of said input/output pads has an outer periphery; and

multiple composite bumps formed wherein each said composite bump is formed from a polymer body having a Young'"'"'s Modulus between about 0.4×

10^-6 and 0.5×

10^-6 psi covered by a conductive metal coating and said multiple composite bumps are located inside said outer periphery of each said input/output pad and in a ring surrounding said outer periphery of each said input/output pad.